MX25U25635FXDI-10G

Macronix MX25U25635FXDI-10G

Part Number:
MX25U25635FXDI-10G
Manufacturer:
Macronix
Ventron No:
7371940-MX25U25635FXDI-10G
Description:
Memory IC 8mm mm
ECAD Model:
Datasheet:
MX25U25635FXDI-10G

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Specifications
Macronix MX25U25635FXDI-10G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25U25635FXDI-10G.
  • Surface Mount
    YES
  • Packaging
    Tray
  • Published
    2017
  • Part Status
    Not For New Designs
  • Number of Terminations
    24
  • Additional Feature
    ALSO CONFIGURABLE AS 256MX1
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B24
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    3.6V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.65V
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    108MHz
  • Organization
    64MX4
  • Memory Width
    4
  • Memory Density
    268435456 bit
  • Parallel/Serial
    SERIAL
  • Memory IC Type
    FLASH
  • Programming Voltage
    1.8V
  • Alternate Memory Width
    2
  • Length
    8mm
  • Height Seated (Max)
    1.2mm
  • Width
    6mm
  • RoHS Status
    RoHS Compliant
Description
MX25U25635FXDI-10G Overview
There is a Tray case available. The chip has 24 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 1.8V of power. It is important to note that the memory has a clock frequency rotation within the range of 108MHz. Despite all its merits, this chip also features ALSO CONFIGURABLE AS 256MX1 to boost system performance. Nonvolatile memory arrays require 1.8V programming voltage to change their state. This ic memory chip contains a FLASH memory IC. The product should only be used at temperatures greater than 85°C. In order for the part to work, it must operate at a temperature of -40°C, otherwise it will not work

MX25U25635FXDI-10G Features
Additional Feature:ALSO CONFIGURABLE AS 256MX1


MX25U25635FXDI-10G Applications
There are a lot of Macronix
MX25U25635FXDI-10G Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MX25U25635FXDI-10G More Descriptions
IC FLASH 256MBIT SPI/QU 24CSPBGA
CMOS MXSMIO (Serial Multi I/O) Flash Memory 256Mb Capacity 256M x 1/128M x 2/64M x 4 Organization 108MHz Speed 1.8V Supply Voltage Surface Mount 24-Ball BGA Tray
Product Comparison
The three parts on the right have similar specifications to MX25U25635FXDI-10G.
  • Image
    Part Number
    Manufacturer
    Surface Mount
    Packaging
    Published
    Part Status
    Number of Terminations
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Clock Frequency
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Alternate Memory Width
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Factory Lead Time
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Series
    JESD-609 Code
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Voltage - Supply
    Pin Count
    Interface
    Memory Size
    Memory Type
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    ECCN Code
    HTS Code
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Supply Current-Max
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Lead Free
    Pbfree Code
    Reflow Temperature-Max (s)
    View Compare
  • MX25U25635FXDI-10G
    MX25U25635FXDI-10G
    YES
    Tray
    2017
    Not For New Designs
    24
    ALSO CONFIGURABLE AS 256MX1
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    R-PBGA-B24
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    1.65V
    SYNCHRONOUS
    108MHz
    64MX4
    4
    268435456 bit
    SERIAL
    FLASH
    1.8V
    2
    8mm
    1.2mm
    6mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L12875FMI-10G
    YES
    Tube
    -
    Active
    16
    CAN BE ORGNISED AS 128 MBIT X 1
    FLASH - NOR
    DUAL
    -
    260
    1
    3V
    1.27mm
    40
    -
    -
    -
    3.6V
    -
    2.7V
    SYNCHRONOUS
    104MHz
    32MX4
    4
    134217728 bit
    -
    -
    3V
    2
    10.3mm
    2.65mm
    7.52mm
    ROHS3 Compliant
    16 Weeks
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    16
    -40°C~85°C TA
    MX25xxx35/36 - MXSMIO™
    e3
    3 (168 Hours)
    MATTE TIN (800)
    2.7V~3.6V
    16
    SPI, Serial
    128Mb 16M x 8
    Non-Volatile
    FLASH
    SPI
    30μs, 1.5ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L2006EZNI-12G
    YES
    Tray
    2010
    Active
    8
    -
    FLASH - NOR
    DUAL
    -
    NOT SPECIFIED
    1
    3V
    1.27mm
    NOT SPECIFIED
    R-PDSO-N8
    -
    -
    -
    -
    2.7V
    SYNCHRONOUS
    86MHz
    1MX2
    2
    -
    -
    -
    2.7V
    1
    6mm
    0.8mm
    5mm
    ROHS3 Compliant
    10 Weeks
    Surface Mount
    8-WDFN Exposed Pad
    -
    -40°C~85°C TA
    MX25xxx05/06
    -
    3 (168 Hours)
    -
    2.7V~3.6V
    8
    SPI, Serial
    2Mb 256K x 8
    Non-Volatile
    FLASH
    SPI
    50μs, 3ms
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.02mA
    2 Mb
    0.00001A
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    Lead Free
    -
    -
  • MX25L1606EM2I-12G
    YES
    Tube
    2016
    Not For New Designs
    8
    -
    FLASH - NOR
    DUAL
    -
    NOT SPECIFIED
    1
    3V
    1.27mm
    -
    R-PDSO-G8
    -
    -
    -
    -
    2.7V
    SYNCHRONOUS
    86MHz
    8MX2
    2
    -
    -
    -
    2.7V
    1
    5.28mm
    2.16mm
    5.23mm
    ROHS3 Compliant
    16 Weeks
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    -
    -40°C~85°C TA
    MX25xxx05/06
    e3
    3 (168 Hours)
    Matte Tin (Sn) - annealed
    2.7V~3.6V
    8
    SPI, Serial
    16Mb 2M x 8
    Non-Volatile
    FLASH
    SPI
    50μs, 3ms
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.025mA
    16 Mb
    0.00002A
    SPI
    100000 Write/Erase Cycles
    -
    HARDWARE/SOFTWARE
    Lead Free
    yes
    NOT SPECIFIED
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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