MX25R6435FBDIL0

Macronix MX25R6435FBDIL0

Part Number:
MX25R6435FBDIL0
Manufacturer:
Macronix
Ventron No:
7372804-MX25R6435FBDIL0
Description:
Memory IC
ECAD Model:
Datasheet:
MX25R6435FBDIL0

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Specifications
Macronix MX25R6435FBDIL0 technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25R6435FBDIL0.
  • Factory Lead Time
    12 Weeks
  • Surface Mount
    YES
  • Packaging
    Tape & Reel (TR)
  • Published
    2017
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    22
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    0.4mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B22
  • Operating Temperature (Max)
    85°C
  • Operating Temperature (Min)
    -40°C
  • Supply Voltage-Max (Vsup)
    3.6V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.65V
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    33MHz
  • Organization
    16MX4
  • Memory Width
    4
  • Memory Density
    67108864 bit
  • Parallel/Serial
    SERIAL
  • Memory IC Type
    FLASH
  • Programming Voltage
    3V
  • Alternate Memory Width
    2
  • Height Seated (Max)
    0.52mm
  • RoHS Status
    Non-RoHS Compliant
Description
MX25R6435FBDIL0 Overview
The case comes in Tape & Reel (TR) size. On the chip, there are 22 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 1.8V is required for the operation of this memory device. There is a clock frequency rotation of the memory within a 33MHz range. It also features ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT to boost system performance despite all its merits. A programming voltage of 3V is required to alter the state of certain nonvolatile memory arrays. FLASH is the type of memory IC in this chip. Using ic memory chip above 85°C is recommended. Ic memory chip is designed to operate at a temperature of -40°C, otherwise the part will malfunction

MX25R6435FBDIL0 Features
Additional Feature:ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT


MX25R6435FBDIL0 Applications
There are a lot of Macronix
MX25R6435FBDIL0 Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
MX25R6435FBDIL0 More Descriptions
R-PBGA-B22 INDUSTRIAL Tape & Reel (TR) 16MX4 ic memory 33MHz 0.52mm 67108864bit 1.65V
NOR Flash Serial 1.8/2.5/3.3V 64Mb 64/32/16M 1/2/4Bit 8ns 22-Pin WLCSP
Ultra Low Power 64M Bit CMOS Mxsmio Flash Memory
IC FLASH 64MBIT SPI/QUAD 22WLCSP
Product Description Demo for Development.
Product Comparison
The three parts on the right have similar specifications to MX25R6435FBDIL0.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Surface Mount
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Operating Temperature (Max)
    Operating Temperature (Min)
    Supply Voltage-Max (Vsup)
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Operating Mode
    Clock Frequency
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Memory IC Type
    Programming Voltage
    Alternate Memory Width
    Height Seated (Max)
    RoHS Status
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Series
    Voltage - Supply
    Pin Count
    Interface
    Memory Size
    Memory Type
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    Length
    Width
    ECCN Code
    HTS Code
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Supply Current-Max
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Lead Free
    Pbfree Code
    Reflow Temperature-Max (s)
    View Compare
  • MX25R6435FBDIL0
    MX25R6435FBDIL0
    12 Weeks
    YES
    Tape & Reel (TR)
    2017
    e1
    Active
    3 (168 Hours)
    22
    Tin/Silver/Copper (Sn/Ag/Cu)
    ALSO IT CAN BE CONFIGURED AS 64M X 1 BIT
    CMOS
    BOTTOM
    BALL
    260
    1
    1.8V
    0.4mm
    40
    R-PBGA-B22
    85°C
    -40°C
    3.6V
    INDUSTRIAL
    1.65V
    SYNCHRONOUS
    33MHz
    16MX4
    4
    67108864 bit
    SERIAL
    FLASH
    3V
    2
    0.52mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L12875FMI-10G
    16 Weeks
    YES
    Tube
    -
    e3
    Active
    3 (168 Hours)
    16
    MATTE TIN (800)
    CAN BE ORGNISED AS 128 MBIT X 1
    FLASH - NOR
    DUAL
    -
    260
    1
    3V
    1.27mm
    40
    -
    -
    -
    3.6V
    -
    2.7V
    SYNCHRONOUS
    104MHz
    32MX4
    4
    134217728 bit
    -
    -
    3V
    2
    2.65mm
    ROHS3 Compliant
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    16
    -40°C~85°C TA
    MX25xxx35/36 - MXSMIO™
    2.7V~3.6V
    16
    SPI, Serial
    128Mb 16M x 8
    Non-Volatile
    FLASH
    SPI
    30μs, 1.5ms
    10.3mm
    7.52mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L2006EZNI-12G
    10 Weeks
    YES
    Tray
    2010
    -
    Active
    3 (168 Hours)
    8
    -
    -
    FLASH - NOR
    DUAL
    -
    NOT SPECIFIED
    1
    3V
    1.27mm
    NOT SPECIFIED
    R-PDSO-N8
    -
    -
    -
    -
    2.7V
    SYNCHRONOUS
    86MHz
    1MX2
    2
    -
    -
    -
    2.7V
    1
    0.8mm
    ROHS3 Compliant
    Surface Mount
    8-WDFN Exposed Pad
    -
    -40°C~85°C TA
    MX25xxx05/06
    2.7V~3.6V
    8
    SPI, Serial
    2Mb 256K x 8
    Non-Volatile
    FLASH
    SPI
    50μs, 3ms
    6mm
    5mm
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.02mA
    2 Mb
    0.00001A
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    Lead Free
    -
    -
  • MX25L1606EM2I-12G
    16 Weeks
    YES
    Tube
    2016
    e3
    Not For New Designs
    3 (168 Hours)
    8
    Matte Tin (Sn) - annealed
    -
    FLASH - NOR
    DUAL
    -
    NOT SPECIFIED
    1
    3V
    1.27mm
    -
    R-PDSO-G8
    -
    -
    -
    -
    2.7V
    SYNCHRONOUS
    86MHz
    8MX2
    2
    -
    -
    -
    2.7V
    1
    2.16mm
    ROHS3 Compliant
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    -
    -40°C~85°C TA
    MX25xxx05/06
    2.7V~3.6V
    8
    SPI, Serial
    16Mb 2M x 8
    Non-Volatile
    FLASH
    SPI
    50μs, 3ms
    5.28mm
    5.23mm
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.025mA
    16 Mb
    0.00002A
    SPI
    100000 Write/Erase Cycles
    -
    HARDWARE/SOFTWARE
    Lead Free
    yes
    NOT SPECIFIED
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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