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MX25L6473EBBI-10G

Macronix MX25L6473EBBI-10G

Part Number:
MX25L6473EBBI-10G
Manufacturer:
Macronix
Ventron No:
7372799-MX25L6473EBBI-10G
Description:
MXSMIO™ Memory IC MXSMIO™ Series
ECAD Model:
Datasheet:
MX25L6473E

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Specifications
Macronix MX25L6473EBBI-10G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25L6473EBBI-10G.
  • Mounting Type
    Surface Mount
  • Package / Case
    12-UFBGA, WLCSP
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Series
    MXSMIO™
  • Published
    2017
  • JESD-609 Code
    e1
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    12
  • Terminal Finish
    TIN SILVER COPPER
  • Additional Feature
    ALSO CONFIGURABLE AS 64M X 1
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • JESD-30 Code
    R-PBGA-B12
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    64Mb 8M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    104MHz
  • Memory Format
    FLASH
  • Memory Interface
    SPI
  • Organization
    16MX4
  • Memory Width
    4
  • Write Cycle Time - Word, Page
    50μs, 3ms
  • Memory Density
    67108864 bit
  • Parallel/Serial
    SERIAL
  • Programming Voltage
    2.7V
  • Alternate Memory Width
    2
  • Height Seated (Max)
    0.52mm
  • RoHS Status
    RoHS Compliant
Description
MX25L6473EBBI-10G Overview
Non-Volatile is the type of memory it has. There is a Tape & Reel (TR) case available. The 12-UFBGA, WLCSP case contains it. The chip has an 64Mb 8M x 8 memory. This device uses a FLASH-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 2.7V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. The chip has 12 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 3V of power. It is important to note that the memory has a clock frequency rotation within the range of 104MHz. Despite all its merits, this chip also features ALSO CONFIGURABLE AS 64M X 1 to boost system performance. In its target applications, this memory ics plays an important role as a member of the MXSMIO™ series of memory devices. Nonvolatile memory arrays require 2.7V programming voltage to change their state.

MX25L6473EBBI-10G Features
Package / Case: 12-UFBGA, WLCSP
Additional Feature:ALSO CONFIGURABLE AS 64M X 1


MX25L6473EBBI-10G Applications
There are a lot of Macronix
MX25L6473EBBI-10G Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MX25L6473EBBI-10G More Descriptions
NOR Flash Serial-SPI 3.3V 64Mbit 64M/32M/16M x 1bit/2bit/4bit 8ns 12-Pin BGA
IC FLASH 64MBIT SPI 12WLCSP
Product Comparison
The three parts on the right have similar specifications to MX25L6473EBBI-10G.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Memory Density
    Parallel/Serial
    Programming Voltage
    Alternate Memory Width
    Height Seated (Max)
    RoHS Status
    Factory Lead Time
    Number of Pins
    Pin Count
    Interface
    Length
    Width
    ECCN Code
    HTS Code
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Supply Current-Max
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Lead Free
    Pbfree Code
    Reflow Temperature-Max (s)
    View Compare
  • MX25L6473EBBI-10G
    MX25L6473EBBI-10G
    Macronix
    Surface Mount
    12-UFBGA, WLCSP
    YES
    -40°C~85°C TA
    Tape & Reel (TR)
    MXSMIO™
    2017
    e1
    Not For New Designs
    3 (168 Hours)
    12
    TIN SILVER COPPER
    ALSO CONFIGURABLE AS 64M X 1
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    260
    1
    3V
    0.5mm
    40
    R-PBGA-B12
    3.6V
    2.7V
    64Mb 8M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    FLASH
    SPI
    16MX4
    4
    50μs, 3ms
    67108864 bit
    SERIAL
    2.7V
    2
    0.52mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L12875FMI-10G
    MX25L12875FMI-10G
    Macronix
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    YES
    -40°C~85°C TA
    Tube
    MX25xxx35/36 - MXSMIO™
    -
    e3
    Active
    3 (168 Hours)
    16
    MATTE TIN (800)
    CAN BE ORGNISED AS 128 MBIT X 1
    FLASH - NOR
    2.7V~3.6V
    DUAL
    260
    1
    3V
    1.27mm
    40
    -
    3.6V
    2.7V
    128Mb 16M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    FLASH
    SPI
    32MX4
    4
    30μs, 1.5ms
    134217728 bit
    -
    3V
    2
    2.65mm
    ROHS3 Compliant
    16 Weeks
    16
    16
    SPI, Serial
    10.3mm
    7.52mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    MX25L6473EBBI-10G vs MX25L12875FMI-10G
  • MX25L2006EZNI-12G
    MX25L2006EZNI-12G
    Macronix
    Surface Mount
    8-WDFN Exposed Pad
    YES
    -40°C~85°C TA
    Tray
    MX25xxx05/06
    2010
    -
    Active
    3 (168 Hours)
    8
    -
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    NOT SPECIFIED
    R-PDSO-N8
    -
    2.7V
    2Mb 256K x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    FLASH
    SPI
    1MX2
    2
    50μs, 3ms
    -
    -
    2.7V
    1
    0.8mm
    ROHS3 Compliant
    10 Weeks
    -
    8
    SPI, Serial
    6mm
    5mm
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.02mA
    2 Mb
    0.00001A
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    Lead Free
    -
    -
    MX25L6473EBBI-10G vs MX25L2006EZNI-12G
  • MX25L1606EM2I-12G
    MX25L1606EM2I-12G
    Macronix
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    YES
    -40°C~85°C TA
    Tube
    MX25xxx05/06
    2016
    e3
    Not For New Designs
    3 (168 Hours)
    8
    Matte Tin (Sn) - annealed
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    -
    R-PDSO-G8
    -
    2.7V
    16Mb 2M x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    FLASH
    SPI
    8MX2
    2
    50μs, 3ms
    -
    -
    2.7V
    1
    2.16mm
    ROHS3 Compliant
    16 Weeks
    -
    8
    SPI, Serial
    5.28mm
    5.23mm
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.025mA
    16 Mb
    0.00002A
    SPI
    100000 Write/Erase Cycles
    -
    HARDWARE/SOFTWARE
    Lead Free
    yes
    NOT SPECIFIED
    MX25L6473EBBI-10G vs MX25L1606EM2I-12G
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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