MX25L6456EXDI-10G

Macronix MX25L6456EXDI-10G

Part Number:
MX25L6456EXDI-10G
Manufacturer:
Macronix
Ventron No:
7372794-MX25L6456EXDI-10G
Description:
MXSMIO™ 24 Pin Memory IC MXSMIO™ Series 8mm mm
ECAD Model:
Datasheet:
MX25L6456EXDI-10G

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Specifications
Macronix MX25L6456EXDI-10G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25L6456EXDI-10G.
  • Mounting Type
    Surface Mount
  • Package / Case
    24-TBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Series
    MXSMIO™
  • Published
    2017
  • Part Status
    Not For New Designs
  • Number of Terminations
    24
  • Additional Feature
    CAN BE ORGNISED AS 64 MBIT X 1; 5 X 5 BALL ARRAY
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Pin Count
    24
  • JESD-30 Code
    R-PBGA-B24
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    64Mb 8M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    104MHz
  • Memory Format
    FLASH
  • Memory Interface
    SPI
  • Organization
    16MX4
  • Memory Width
    4
  • Memory Density
    67108864 bit
  • Parallel/Serial
    SERIAL
  • Programming Voltage
    2.7V
  • Alternate Memory Width
    2
  • Length
    8mm
  • Height Seated (Max)
    1.2mm
  • Width
    6mm
  • RoHS Status
    RoHS Compliant
Description
MX25L6456EXDI-10G Overview
Non-Volatile is the type of memory it has. There is a Tray case available. The 24-TBGA, CSPBGA case contains it. The chip has an 64Mb 8M x 8 memory. This device uses a FLASH-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 2.7V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. The chip has 24 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 3V of power. It is important to note that the memory has a clock frequency rotation within the range of 104MHz. There are 24 pins on this memory device, which indicates it has 24 memory locations in it. Despite all its merits, this chip also features CAN BE ORGNISED AS 64 MBIT X 1; 5 X 5 BALL ARRAY to boost system performance. In its target applications, this memory ics plays an important role as a member of the MXSMIO™ series of memory devices. Nonvolatile memory arrays require 2.7V programming voltage to change their state.

MX25L6456EXDI-10G Features
Package / Case: 24-TBGA, CSPBGA
Additional Feature:CAN BE ORGNISED AS 64 MBIT X 1; 5 X 5 BALL ARRAY


MX25L6456EXDI-10G Applications
There are a lot of Macronix
MX25L6456EXDI-10G Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MX25L6456EXDI-10G More Descriptions
Not For New Designs SERIAL 2017 BOTTOM ic memory -40C~85C TA 2.7V 67108864bit 6mm
IC FLASH 64MBIT SPI 24CSPBGA
CMOS MXSMIO (Serial Multi I/O) Flash Memory 64Mb Capacity 64M x 1/32M x 2/16M x 4 Organization 104MHz Speed 3V Supply Voltage Surface Mount 24-Ball TFBGA Tray
FLASH 2.7V PROM
Product Comparison
The three parts on the right have similar specifications to MX25L6456EXDI-10G.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Number of Terminations
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Programming Voltage
    Alternate Memory Width
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Factory Lead Time
    Number of Pins
    JESD-609 Code
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Interface
    Write Cycle Time - Word, Page
    ECCN Code
    HTS Code
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Supply Current-Max
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Lead Free
    Pbfree Code
    Reflow Temperature-Max (s)
    View Compare
  • MX25L6456EXDI-10G
    MX25L6456EXDI-10G
    Surface Mount
    24-TBGA, CSPBGA
    YES
    -40°C~85°C TA
    Tray
    MXSMIO™
    2017
    Not For New Designs
    24
    CAN BE ORGNISED AS 64 MBIT X 1; 5 X 5 BALL ARRAY
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    260
    1
    3V
    1mm
    40
    24
    R-PBGA-B24
    3.6V
    2.7V
    64Mb 8M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    FLASH
    SPI
    16MX4
    4
    67108864 bit
    SERIAL
    2.7V
    2
    8mm
    1.2mm
    6mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L12875FMI-10G
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    YES
    -40°C~85°C TA
    Tube
    MX25xxx35/36 - MXSMIO™
    -
    Active
    16
    CAN BE ORGNISED AS 128 MBIT X 1
    FLASH - NOR
    2.7V~3.6V
    DUAL
    260
    1
    3V
    1.27mm
    40
    16
    -
    3.6V
    2.7V
    128Mb 16M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    FLASH
    SPI
    32MX4
    4
    134217728 bit
    -
    3V
    2
    10.3mm
    2.65mm
    7.52mm
    ROHS3 Compliant
    16 Weeks
    16
    e3
    3 (168 Hours)
    MATTE TIN (800)
    SPI, Serial
    30μs, 1.5ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L2006EZNI-12G
    Surface Mount
    8-WDFN Exposed Pad
    YES
    -40°C~85°C TA
    Tray
    MX25xxx05/06
    2010
    Active
    8
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    NOT SPECIFIED
    8
    R-PDSO-N8
    -
    2.7V
    2Mb 256K x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    FLASH
    SPI
    1MX2
    2
    -
    -
    2.7V
    1
    6mm
    0.8mm
    5mm
    ROHS3 Compliant
    10 Weeks
    -
    -
    3 (168 Hours)
    -
    SPI, Serial
    50μs, 3ms
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.02mA
    2 Mb
    0.00001A
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    Lead Free
    -
    -
  • MX25L1606EM2I-12G
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    YES
    -40°C~85°C TA
    Tube
    MX25xxx05/06
    2016
    Not For New Designs
    8
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    -
    8
    R-PDSO-G8
    -
    2.7V
    16Mb 2M x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    FLASH
    SPI
    8MX2
    2
    -
    -
    2.7V
    1
    5.28mm
    2.16mm
    5.23mm
    ROHS3 Compliant
    16 Weeks
    -
    e3
    3 (168 Hours)
    Matte Tin (Sn) - annealed
    SPI, Serial
    50μs, 3ms
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.025mA
    16 Mb
    0.00002A
    SPI
    100000 Write/Erase Cycles
    -
    HARDWARE/SOFTWARE
    Lead Free
    yes
    NOT SPECIFIED
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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