MX25L6456EXCI-10G

Macronix MX25L6456EXCI-10G

Part Number:
MX25L6456EXCI-10G
Manufacturer:
Macronix
Ventron No:
7372786-MX25L6456EXCI-10G
Description:
MXSMIO™ 24 Pin Memory IC MXSMIO™ Series 8mm mm
ECAD Model:
Datasheet:
MX25L6456EXCI-10G

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Specifications
Macronix MX25L6456EXCI-10G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25L6456EXCI-10G.
  • Mounting Type
    Surface Mount
  • Package / Case
    24-TBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Series
    MXSMIO™
  • Published
    2017
  • Part Status
    Not For New Designs
  • Number of Terminations
    24
  • Additional Feature
    CAN BE ORGNISED AS 64 MBIT X 1; 4 X 6 BALL ARRAY
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    24
  • JESD-30 Code
    R-PBGA-B24
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    64Mb 8M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    104MHz
  • Memory Format
    FLASH
  • Memory Interface
    SPI
  • Organization
    16MX4
  • Memory Width
    4
  • Memory Density
    67108864 bit
  • Parallel/Serial
    SERIAL
  • Programming Voltage
    2.7V
  • Alternate Memory Width
    2
  • Length
    8mm
  • Height Seated (Max)
    1.2mm
  • Width
    6mm
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Lead Free
Description
MX25L6456EXCI-10G Overview
In terms of its memory type, it can be classified as Non-Volatile. The case comes in Tray size. The case is embedded in 24-TBGA, CSPBGA. Memory size on the chip is 64Mb 8M x 8. This device uses takes advantage of the FLASH format. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V. The recommended mounting type for this device is Surface Mount. On the chip, there are 24 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 3V is required for the operation of this memory device. There is a clock frequency rotation of the memory within a 104MHz range. A memory device like this has 24 pins, indicating that there are 24 memory locations on the device. It also features CAN BE ORGNISED AS 64 MBIT X 1; 4 X 6 BALL ARRAY to boost system performance despite all its merits. MXSMIO™ series memory devices play an important role in the applications they target. A programming voltage of 2.7V is required to alter the state of certain nonvolatile memory arrays.

MX25L6456EXCI-10G Features
Package / Case: 24-TBGA, CSPBGA
Additional Feature:CAN BE ORGNISED AS 64 MBIT X 1; 4 X 6 BALL ARRAY


MX25L6456EXCI-10G Applications
There are a lot of Macronix
MX25L6456EXCI-10G Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
MX25L6456EXCI-10G More Descriptions
R-PBGA-B24 Surface Mount Tray 16MX4 ic memory 104MHz 6mm 67108864bit 2.7V
Serial Flash Multi I/O 64MB 3V TFBGA-24 Industrial temp
CMOS MXSMIO (Serial Multi I/O) Flash Memory 64Mb Capacity 64M x 1/32M x 2/16M x 4 Organization 104MHz Speed 3V Supply Voltage Surface Mount 24-Ball TFBGA Tray
Product Comparison
The three parts on the right have similar specifications to MX25L6456EXCI-10G.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Number of Terminations
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Programming Voltage
    Alternate Memory Width
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Lead Free
    Factory Lead Time
    Number of Pins
    JESD-609 Code
    Moisture Sensitivity Level (MSL)
    Terminal Finish
    Interface
    Write Cycle Time - Word, Page
    ECCN Code
    HTS Code
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Supply Current-Max
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Pbfree Code
    Reflow Temperature-Max (s)
    View Compare
  • MX25L6456EXCI-10G
    MX25L6456EXCI-10G
    Surface Mount
    24-TBGA, CSPBGA
    YES
    -40°C~85°C TA
    Tray
    MXSMIO™
    2017
    Not For New Designs
    24
    CAN BE ORGNISED AS 64 MBIT X 1; 4 X 6 BALL ARRAY
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    NOT SPECIFIED
    1
    3V
    1mm
    NOT SPECIFIED
    24
    R-PBGA-B24
    3.6V
    2.7V
    64Mb 8M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    FLASH
    SPI
    16MX4
    4
    67108864 bit
    SERIAL
    2.7V
    2
    8mm
    1.2mm
    6mm
    Non-RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L12875FMI-10G
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    YES
    -40°C~85°C TA
    Tube
    MX25xxx35/36 - MXSMIO™
    -
    Active
    16
    CAN BE ORGNISED AS 128 MBIT X 1
    FLASH - NOR
    2.7V~3.6V
    DUAL
    260
    1
    3V
    1.27mm
    40
    16
    -
    3.6V
    2.7V
    128Mb 16M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    FLASH
    SPI
    32MX4
    4
    134217728 bit
    -
    3V
    2
    10.3mm
    2.65mm
    7.52mm
    ROHS3 Compliant
    -
    16 Weeks
    16
    e3
    3 (168 Hours)
    MATTE TIN (800)
    SPI, Serial
    30μs, 1.5ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L2006EZNI-12G
    Surface Mount
    8-WDFN Exposed Pad
    YES
    -40°C~85°C TA
    Tray
    MX25xxx05/06
    2010
    Active
    8
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    NOT SPECIFIED
    8
    R-PDSO-N8
    -
    2.7V
    2Mb 256K x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    FLASH
    SPI
    1MX2
    2
    -
    -
    2.7V
    1
    6mm
    0.8mm
    5mm
    ROHS3 Compliant
    Lead Free
    10 Weeks
    -
    -
    3 (168 Hours)
    -
    SPI, Serial
    50μs, 3ms
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.02mA
    2 Mb
    0.00001A
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    -
    -
  • MX25L1606EM2I-12G
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    YES
    -40°C~85°C TA
    Tube
    MX25xxx05/06
    2016
    Not For New Designs
    8
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    -
    8
    R-PDSO-G8
    -
    2.7V
    16Mb 2M x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    FLASH
    SPI
    8MX2
    2
    -
    -
    2.7V
    1
    5.28mm
    2.16mm
    5.23mm
    ROHS3 Compliant
    Lead Free
    16 Weeks
    -
    e3
    3 (168 Hours)
    Matte Tin (Sn) - annealed
    SPI, Serial
    50μs, 3ms
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.025mA
    16 Mb
    0.00002A
    SPI
    100000 Write/Erase Cycles
    -
    HARDWARE/SOFTWARE
    yes
    NOT SPECIFIED
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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