MX25L6408EZNI-12G

Macronix MX25L6408EZNI-12G

Part Number:
MX25L6408EZNI-12G
Manufacturer:
Macronix
Ventron No:
7372788-MX25L6408EZNI-12G
Description:
8 Pin Memory IC 8mm mm
ECAD Model:
Datasheet:
MX25L6408EZNI-12G

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Specifications
Macronix MX25L6408EZNI-12G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25L6408EZNI-12G.
  • Mounting Type
    Surface Mount
  • Package / Case
    8-WDFN Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2017
  • JESD-609 Code
    e3
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    8
  • Terminal Finish
    MATTE TIN (800)
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1.27mm
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Pin Count
    8
  • JESD-30 Code
    R-PDSO-N8
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Memory Size
    64Mb 8M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    86MHz
  • Memory Format
    FLASH
  • Memory Interface
    SPI
  • Organization
    32MX2
  • Memory Width
    2
  • Write Cycle Time - Word, Page
    50μs, 3ms
  • Memory Density
    67108864 bit
  • Parallel/Serial
    SERIAL
  • Programming Voltage
    2.7V
  • Alternate Memory Width
    1
  • Length
    8mm
  • Height Seated (Max)
    0.8mm
  • Width
    6mm
  • RoHS Status
    RoHS Compliant
Description
MX25L6408EZNI-12G Overview
In this case, the memory type of the device can be classified as Non-Volatile. Case Tray is available. An embedded 8-WDFN Exposed Pad case surrounds memory ics. It is estimated that the memory size on the chip is 64Mb 8M x 8. As with most mainstream devices, this one uses FLASH-format memory. Due to its wide temperature range of -40°C~85°C TA, this device is well suited to a wide range of applications that require high performance. With 2.7V~3.6V as the supply voltage, it is capable of handling memory ics. It is recommended to mount it in the Surface Mount mounting type. It is planted on the chip with 8 terminations. It supports up to 1 functions for comprehensive operation. There is a requirement for 3V to be supplied to this ic memory chip in order to operate. In order to operate effectively, the memory rotates at a clock frequency within a range of 86MHz. The memory device has a total of 8 pins, thus indicating that it has a total of 8 memory locations. Nonvolatile memory arrays require 2.7V programming voltages to change their states.

MX25L6408EZNI-12G Features
Package / Case: 8-WDFN Exposed Pad


MX25L6408EZNI-12G Applications
There are a lot of Macronix
MX25L6408EZNI-12G Memory applications.


networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
MX25L6408EZNI-12G More Descriptions
CMOS Serial Flash 64MB Capacity 64M x 1/32M x 2 Organization 86MHz Speed 3V Supply Voltage Surface Mount 8-Pin WSON Tray
IC FLASH 64MBIT SPI 86MHZ 8WSON
OEMs, CMs ONLY (NO BROKERS)
Product Comparison
The three parts on the right have similar specifications to MX25L6408EZNI-12G.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Memory Density
    Parallel/Serial
    Programming Voltage
    Alternate Memory Width
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Factory Lead Time
    Number of Pins
    Series
    Additional Feature
    Interface
    ECCN Code
    HTS Code
    Qualification Status
    Operating Supply Voltage
    Power Supplies
    Supply Current-Max
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Lead Free
    Pbfree Code
    Reflow Temperature-Max (s)
    View Compare
  • MX25L6408EZNI-12G
    MX25L6408EZNI-12G
    Surface Mount
    8-WDFN Exposed Pad
    YES
    -40°C~85°C TA
    Tray
    2017
    e3
    Not For New Designs
    3 (168 Hours)
    8
    MATTE TIN (800)
    FLASH - NOR
    2.7V~3.6V
    DUAL
    260
    1
    3V
    1.27mm
    40
    8
    R-PDSO-N8
    3.6V
    2.7V
    64Mb 8M x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    FLASH
    SPI
    32MX2
    2
    50μs, 3ms
    67108864 bit
    SERIAL
    2.7V
    1
    8mm
    0.8mm
    6mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L12875FMI-10G
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    YES
    -40°C~85°C TA
    Tube
    -
    e3
    Active
    3 (168 Hours)
    16
    MATTE TIN (800)
    FLASH - NOR
    2.7V~3.6V
    DUAL
    260
    1
    3V
    1.27mm
    40
    16
    -
    3.6V
    2.7V
    128Mb 16M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    FLASH
    SPI
    32MX4
    4
    30μs, 1.5ms
    134217728 bit
    -
    3V
    2
    10.3mm
    2.65mm
    7.52mm
    ROHS3 Compliant
    16 Weeks
    16
    MX25xxx35/36 - MXSMIO™
    CAN BE ORGNISED AS 128 MBIT X 1
    SPI, Serial
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L2006EZNI-12G
    Surface Mount
    8-WDFN Exposed Pad
    YES
    -40°C~85°C TA
    Tray
    2010
    -
    Active
    3 (168 Hours)
    8
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    NOT SPECIFIED
    8
    R-PDSO-N8
    -
    2.7V
    2Mb 256K x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    FLASH
    SPI
    1MX2
    2
    50μs, 3ms
    -
    -
    2.7V
    1
    6mm
    0.8mm
    5mm
    ROHS3 Compliant
    10 Weeks
    -
    MX25xxx05/06
    -
    SPI, Serial
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.02mA
    2 Mb
    0.00001A
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    Lead Free
    -
    -
  • MX25L1606EM2I-12G
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    YES
    -40°C~85°C TA
    Tube
    2016
    e3
    Not For New Designs
    3 (168 Hours)
    8
    Matte Tin (Sn) - annealed
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    -
    8
    R-PDSO-G8
    -
    2.7V
    16Mb 2M x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    FLASH
    SPI
    8MX2
    2
    50μs, 3ms
    -
    -
    2.7V
    1
    5.28mm
    2.16mm
    5.23mm
    ROHS3 Compliant
    16 Weeks
    -
    MX25xxx05/06
    -
    SPI, Serial
    EAR99
    8542.32.00.51
    Not Qualified
    3.6V
    3/3.3V
    0.025mA
    16 Mb
    0.00002A
    SPI
    100000 Write/Erase Cycles
    -
    HARDWARE/SOFTWARE
    Lead Free
    yes
    NOT SPECIFIED
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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