Microsemi Corporation ZL50058GAC

ZL50058GAC Overview
The manufacturer of this component is Microsemi Corporation. It is a type of chip used for telecommunications, specifically in the category of Interface - Telecom. The package or casing for this chip is 252-BGA and it has a total of 256 pins. It is typically packaged in a tray. This particular part is no longer in production and is considered obsolete. It has a moisture sensitivity level of 1, meaning it can be exposed to unlimited moisture without being damaged. The terminal position is located at the bottom of the chip and the terminal form is in the shape of balls. The chip operates with a supply voltage of 1.8V and has a maximum reflow temperature of 30 seconds. Its main function is to act as a switch for telecommunications purposes.

ZL50058GAC Features
Available in the 252-BGA package
Operating supply current of 240mA

ZL50058GAC Applications
There are a lot of Microsemi Corporation ZL50058GAC Telecom applications.

Cross Connects
ATM Switches
Multichannel DS1 Test Equipment
Set-Top Box
Digital subscriber line access multiplexer (DSLAM)
Multiplexers
CSU/DSU E1 Interface
ISDN NT1/TA
Cable PC
T1/E1/J1 Multiplexer and Channel Banks