Xilinx Inc. XC7VX690T-1FFG1157I

XC7VX690T-1FFG1157I Overview
The package or case of this electronic component is referred to as 1156-BBGA or FCBGA, which stands for Ball Grid Array and Flip Chip Ball Grid Array respectively. This type of package is commonly used in high-density integrated circuits due to its compact size and efficient heat dissipation. The Moisture Sensitivity Level (MSL) of this component is 4, meaning it can be exposed to ambient humidity levels for up to 72 hours without any adverse effects. The technology used in this component is CMOS, which stands for Complementary Metal-Oxide-Semiconductor, a type of integrated circuit design that offers low power consumption and high speed performance. The supply voltage required for this component to function is 1V, and the terminal pitch, or the distance between the center of two adjacent terminals, is 1mm. This component complies with the JESD-30 Code S-PBGA-B1157, which specifies the requirements for plastic ball grid array packages. It has a RAM size of 6.5MB and a clock frequency of 1818MHz, making it suitable for high-speed data processing. With a total of 866400 registers, this component offers a large amount of storage capacity. Furthermore, it is also RoHS3 compliant, meaning it meets the Restriction of Hazardous Substances directive set by the European Union, making it environmentally friendly.

XC7VX690T-1FFG1157I Features
600 I/Os
Up to 54190080 RAM bits
866400 registers

XC7VX690T-1FFG1157I Applications
There are a lot of Xilinx Inc. XC7VX690T-1FFG1157I FPGAs applications.

Device controllers
Integrating multiple SPLDs
Telecommunication
Radar and Sensors
High Performance Computing
Camera time adjustments
Software-defined radio
Automotive advanced driver assistance systems (ADAS)
Wired Communications
OpenCL