Xilinx Inc. XC7K325T-1FB900I

Name: XC7K325T-1FB900I
Brand: Xilinx Inc.
SKU: 3135556-XC7K325T-1FB900I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC7K325T-1FB900I

Manufacturer:: Xilinx Inc.

Ventron No:: 3135556-XC7K325T-1FB900I

Description:: IC FPGA 500 I/O 900FCBGA

ECAD Model:

Datasheet:: XC7K325T-1FB900I

Specifications

Xilinx Inc. XC7K325T-1FB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7K325T-1FB900I.

Factory Lead Time
11 Weeks
Contact Plating
Lead, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
900-BBGA, FCBGA
Number of Pins
900
Supplier Device Package
900-FCBGA (31x31)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2009
Series
Kintex®-7
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Voltage - Supply
0.97V~1.03V
Base Part Number
XC7K325T
Max Supply Voltage
1.03V
Min Supply Voltage
970mV
Memory Size
1GB
Number of I/O
500
RAM Size
2MB
Memory Type
DDR3
Propagation Delay
120 ps
Turn On Delay Time
120 ps
Number of Logic Elements/Cells
326080
Total RAM Bits
16404480
Number of LABs/CLBs
25475
Number of Logic Blocks (LABs)
25475
Speed Grade
1
Number of Registers
407600
Radiation Hardening
No
RoHS Status
Non-RoHS Compliant

Description

XC7K325T-1FB900I Overview
Xilinx Inc. is a well-known and established brand in the field of electronic components, specifically in the realm of Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and widely used in various industries due to their programmable nature and ability to adapt to different applications. The contact plating of this particular Xilinx Inc. chip is made of lead and tin, ensuring a secure and reliable connection. The chip is designed for surface mount installation, making it suitable for compact and space-saving designs. Its package size is 900-BBGA, FCBGA, which is a standard and widely used form factor in the industry. With 900 pins, this chip offers a wide range of connectivity options and can handle complex tasks with ease. The Moisture Sensitivity Level (MSL) of 4 (72 Hours) indicates that the chip can withstand high levels of humidity for a certain period without any damage, making it suitable for various environments. It has a maximum operating temperature of 100°C, ensuring stable and reliable performance even in extreme conditions. The chip requires a minimum supply voltage of 970mV, making it energy-efficient and cost-effective. With a memory size of 1GB, this Xilinx Inc. chip can store and process large amounts of data, making it ideal for high-performance applications. It also boasts an impressive number of Logic Blocks (LABs) with 25475, providing users with a vast array of options for customization and optimization. It is important to note that this particular chip is Non-RoHS Compliant, meaning it may contain substances that are harmful to the environment. Overall, Xilinx Inc.'s Embedded - FPGAs chip offers exceptional performance, versatility, and reliability, making it a top choice for various electronic applications.

XC7K325T-1FB900I Features
500 I/Os
Up to 16404480 RAM bits
900 LABs/CLBs
100°C gates
25475 logic blocks (LABs)
407600 registers

XC7K325T-1FB900I Applications
There are a lot of Xilinx Inc. XC7K325T-1FB900I FPGAs applications.

Software-defined radios
Camera time adjustments
Digital signal processing
Data center search engines
OpenCL
Broadcast
Artificial intelligence (AI)
Medical ultrasounds
Voice recognition
Industrial,Medical and Scientific Instruments

XC7K325T-1FB900I More Descriptions

FPGA Kintex-7 326080 Cells 28nm Technology 1V 900-Pin FCBGA
Field Programmable Gate Array, PBGA900
MOSFET N-CH 30V 5.8A SOT23
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 784FCBGA

Product Comparison

The three parts on the right have similar specifications to XC7K325T-1FB900I.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Mounting Type

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Voltage - Supply

Base Part Number

Max Supply Voltage

Min Supply Voltage

Memory Size

Number of I/O

RAM Size

Memory Type

Propagation Delay

Turn On Delay Time

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Number of Logic Blocks (LABs)

Speed Grade

Number of Registers

Radiation Hardening

RoHS Status

Surface Mount

JESD-609 Code

Pbfree Code

Number of Terminations

ECCN Code

Terminal Finish

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reach Compliance Code

Reflow Temperature-Max (s)

Pin Count

Number of Outputs

Qualification Status

Power Supplies

Clock Frequency

Programmable Logic Type

Combinatorial Delay of a CLB-Max

Height Seated (Max)

Length

Width

Number of Terminals

JESD-30 Code

Number of Inputs

Number of Logic Cells

View Compare
XC7K325T-1FB900I

Xilinx Inc.

11 Weeks

Lead, Tin

Surface Mount

Surface Mount

900-BBGA, FCBGA

900

900-FCBGA (31x31)

-40°C~100°C TJ

Tray

2009

Kintex®-7

Active

4 (72 Hours)

100°C

-40°C

0.97V~1.03V

XC7K325T

1.03V

970mV

1GB

500

2MB

DDR3

120 ps

120 ps

326080

16404480

25475

25475

1

407600

No

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC7K410T-1FFG676C

Xilinx Inc.

12 Weeks

-

-

Surface Mount

676-BBGA, FCBGA

676

-

0°C~85°C TJ

Tray

2010

Kintex®-7

Active

4 (72 Hours)

-

-

0.97V~1.03V

XC7K410T

-

-

-

400

3.5MB

-

-

-

406720

29306880

31775

-

-1

508400

-

ROHS3 Compliant

YES

e1

yes

676

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

not_compliant

NOT SPECIFIED

676

400

Not Qualified

11.83.3V

1098MHz

FIELD PROGRAMMABLE GATE ARRAY

0.74 ns

3.37mm

27mm

27mm

-

-

-

-

XC7K325T-1FB900I vs XC7K410T-1FFG676C
XC7K410T-1FF676C

Xilinx Inc.

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

Non-RoHS Compliant

YES

-

-

-

-

-

-

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

-

-

1mm

compliant

-

-

400

Not Qualified

11.83.3V

1818MHz

FIELD PROGRAMMABLE GATE ARRAY

-

-

-

-

676

S-PBGA-B676

400

406720

XC7K325T-1FB900I vs XC7K410T-1FF676C
XC7K325T-3FFG900E

Xilinx Inc.

11 Weeks

-

-

Surface Mount

900-BBGA, FCBGA

-

-

0°C~100°C TJ

Tray

2009

Kintex®-7

Active

4 (72 Hours)

-

-

0.97V~1.03V

XC7K325T

-

-

1GB

500

2MB

DDR3

-

-

326080

16404480

25475

-

-3

407600

-

ROHS3 Compliant

YES

e1

yes

900

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

not_compliant

NOT SPECIFIED

900

500

Not Qualified

11.83.3V

1412MHz

FIELD PROGRAMMABLE GATE ARRAY

0.58 ns

3.35mm

31mm

31mm

-

S-PBGA-B900

500

-

XC7K325T-1FB900I vs XC7K325T-3FFG900E