Xilinx Inc. XC6VLX760-2FFG1760C

Name: XC6VLX760-2FFG1760C
Brand: Xilinx Inc.
SKU: 3637930-XC6VLX760-2FFG1760C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC6VLX760-2FFG1760C

Manufacturer:: Xilinx Inc.

Ventron No:: 3637930-XC6VLX760-2FFG1760C

Description:: IC FPGA 1200 I/O 1760FBGA

ECAD Model:

Datasheet:: XC6VLX760-2FFG1760C

Specifications

Xilinx Inc. XC6VLX760-2FFG1760C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6VLX760-2FFG1760C.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
1760-BBGA, FCBGA
Number of Pins
1760
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2008
Series
Virtex®-6 LXT
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
ECCN Code
3A001.A.7.A
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.95V~1.05V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
XC6VLX760
Qualification Status
Not Qualified
Number of I/O
1200
RAM Size
3.2MB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
758784
Total RAM Bits
26542080
Number of LABs/CLBs
59280
Speed Grade
2
Height Seated (Max)
3.5mm
RoHS Status
ROHS3 Compliant

Description

XC6VLX760-2FFG1760C Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip known as Embedded - FPGAs (Field Programmable Gate Array), falling under the category of Embedded - FPGAs (Field Programmable Gate Array). It was first released in 2008 and belongs to the Virtex®-6 LXT series. Its ECCN Code is 3A001.A.7.A and it uses CMOS technology. The voltage supply for this chip ranges from 0.95V to 1.05V. The maximum reflow temperature is 30 degrees Celsius. It has a total of 1200 input/output connections. This chip is classified as a FIELD PROGRAMMABLE GATE ARRAY. Its maximum seated height is 3.5mm. It is compliant with the ROHS3 standard.

XC6VLX760-2FFG1760C Features
1200 I/Os
Up to 26542080 RAM bits
1760 LABs/CLBs

XC6VLX760-2FFG1760C Applications
There are a lot of Xilinx Inc. XC6VLX760-2FFG1760C FPGAs applications.

Military Temperature
Enterprise networking
Data Center
Electronic Warfare
Development Boards and Shields for Microcontrollers
Automotive advanced driver assistance systems (ADAS)
Aerospace and Defense
Consumer Electronics
Software-defined radios
Automotive driver's assistance

XC6VLX760-2FFG1760C More Descriptions

FPGA Virtex-6 LX Family 758784 Cells 40nm (CMOS) Technology 1V 1760-Pin FCBGA
Field Programmable Gate Array, 1098MHz, 758784-Cell, CMOS, PBGA1760
IC FPGA 1200 I/O 1760FCBGA
IC FPGA 702 I/O 2104FCBGA
TVS DIODE 220VWM 356VC SMA

Product Comparison

The three parts on the right have similar specifications to XC6VLX760-2FFG1760C.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

ECCN Code

Terminal Finish

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

Qualification Status

Number of I/O

RAM Size

Programmable Logic Type

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Speed Grade

Height Seated (Max)

RoHS Status

Number of Terminations

Reach Compliance Code

Pin Count

Number of Outputs

Operating Supply Voltage

Supplier Device Package

Max Operating Temperature

Min Operating Temperature

Propagation Delay

Number of Logic Blocks (LABs)

Radiation Hardening

Time@Peak Reflow Temperature-Max (s)

Temperature Grade

Combinatorial Delay of a CLB-Max

Length

Width

View Compare
XC6VLX760-2FFG1760C

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

Surface Mount

1760-BBGA, FCBGA

1760

0°C~85°C TJ

Tray

2008

Virtex®-6 LXT

e1

yes

Active

4 (72 Hours)

3A001.A.7.A

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Field Programmable Gate Arrays

CMOS

0.95V~1.05V

BOTTOM

BALL

245

1V

1mm

30

XC6VLX760

Not Qualified

1200

3.2MB

FIELD PROGRAMMABLE GATE ARRAY

758784

26542080

59280

2

3.5mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC6VLX130T-2FF484I

Xilinx Inc.

14 Weeks

-

Surface Mount

Surface Mount

484-BBGA, FCBGA

484

-40°C~100°C TJ

Tray

2008

Virtex®-6 LXT

e0

no

Active

4 (72 Hours)

3A991.D

Tin/Lead (Sn63Pb37)

Field Programmable Gate Arrays

CMOS

0.95V~1.05V

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

NOT SPECIFIED

XC6VLX130T

Not Qualified

240

1.2MB

FIELD PROGRAMMABLE GATE ARRAY

128000

9732096

10000

2

3mm

ROHS3 Compliant

484

not_compliant

484

240

1V

-

-

-

-

-

-

-

-

-

-

-

XC6VLX760-2FFG1760C vs XC6VLX130T-2FF484I
XC6VSX475T-2FF1759E

Xilinx Inc.

10 Weeks

-

Surface Mount

Surface Mount

1760-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2008

Virtex®-6 SXT

-

-

Active

4 (72 Hours)

-

-

-

-

0.95V~1.05V

-

-

-

-

-

-

XC6VSX475T

-

840

4.7MB

-

476160

39223296

37200

2

-

Non-RoHS Compliant

-

-

-

-

1V

1759-FCBGA (42.5x42.5)

100°C

0°C

220 ps

37200

No

-

-

-

-

-

XC6VLX760-2FFG1760C vs XC6VSX475T-2FF1759E
XC6VHX565T-1FFG1924C

Xilinx Inc.

-

-

Surface Mount

-

FCBGA

1924

-

-

-

-

e1

yes

-

4 (72 Hours)

-

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Field Programmable Gate Arrays

CMOS

-

BOTTOM

BALL

245

1V

-

-

-

Not Qualified

640

4MB

FIELD PROGRAMMABLE GATE ARRAY

566784

-

-

1

3.85mm

RoHS Compliant

-

-

-

640

1V

-

85°C

0°C

-

44280

-

30

OTHER

5.08 ns

45mm

45mm

XC6VLX760-2FFG1760C vs XC6VHX565T-1FFG1924C