Xilinx Inc. XC6VLX75T-2FFG484I

Name: XC6VLX75T-2FFG484I
Brand: Xilinx Inc.
SKU: 3135450-XC6VLX75T-2FFG484I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC6VLX75T-2FFG484I

Manufacturer:: Xilinx Inc.

Ventron No:: 3135450-XC6VLX75T-2FFG484I

Description:: IC FPGA 240 I/O 484FCBGA

ECAD Model:

Datasheet:: XC6VLX75T-2FFG484I

Specifications

Xilinx Inc. XC6VLX75T-2FFG484I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6VLX75T-2FFG484I.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
484-BBGA
Number of Pins
484
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2002
Series
Virtex®-6 LXT
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
484
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.95V~1.05V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Supply Voltage
1V
Terminal Pitch
1mm
Reach Compliance Code
not_compliant
Reflow Temperature-Max (s)
30
Base Part Number
XC6VLX75T
Pin Count
484
Number of Outputs
240
Qualification Status
Not Qualified
Number of I/O
240
RAM Size
702kB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
74496
Total RAM Bits
5750784
Number of LABs/CLBs
5820
Speed Grade
2
Height Seated (Max)
3mm
RoHS Status
ROHS3 Compliant

Description

XC6VLX75T-2FFG484I Overview
Contact plating refers to the coating of copper, silver, or tin on the surface of a component, in this case a 484-BBGA package or case. This package has 484 pins, making it suitable for complex electronic devices. It has a wide operating temperature range of -40°C to 100°C, making it suitable for use in various environments. The package is typically sold in trays, with each tray containing 484 terminations. This corresponds to the number of pins in the package. The 484-BBGA package also has 240 outputs, and a high number of logic elements or cells, specifically 74496. It is important to note that this package is compliant with the RoHS3 regulations, ensuring its safety and environmental friendliness.

XC6VLX75T-2FFG484I Features
240 I/Os
Up to 5750784 RAM bits
484 LABs/CLBs

XC6VLX75T-2FFG484I Applications
There are a lot of Xilinx Inc. XC6VLX75T-2FFG484I FPGAs applications.

Random logic
Broadcast
Aircraft navigation
Wired Communications
Digital signal processing
DO-254
Enterprise networking
Data center hardware accelerators
Software-defined radio
Electronic Warfare

XC6VLX75T-2FFG484I More Descriptions

FPGA Virtex-6 LXT Family 74496 Cells 40nm (CMOS) Technology 1V 484-Pin FCBGA
FPGA - Field Programmable Gate Array
IC, DTYPE FLIPFLOP, SMD, 74HC273

Product Comparison

The three parts on the right have similar specifications to XC6VLX75T-2FFG484I.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reach Compliance Code

Reflow Temperature-Max (s)

Base Part Number

Pin Count

Number of Outputs

Qualification Status

Number of I/O

RAM Size

Programmable Logic Type

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Speed Grade

Height Seated (Max)

RoHS Status

Operating Supply Voltage

Number of Registers

Combinatorial Delay of a CLB-Max

Length

Width

Max Operating Temperature

Min Operating Temperature

JESD-30 Code

Supply Voltage-Max (Vsup)

Propagation Delay

Number of Inputs

Number of Logic Blocks (LABs)

Radiation Hardening

View Compare
XC6VLX75T-2FFG484I

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

Surface Mount

484-BBGA

484

-40°C~100°C TJ

Tray

2002

Virtex®-6 LXT

e1

yes

Active

4 (72 Hours)

484

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

CMOS

0.95V~1.05V

BOTTOM

BALL

245

1V

1mm

not_compliant

30

XC6VLX75T

484

240

Not Qualified

240

702kB

FIELD PROGRAMMABLE GATE ARRAY

74496

5750784

5820

2

3mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC6VLX130T-2FF484I

Xilinx Inc.

14 Weeks

-

Surface Mount

Surface Mount

484-BBGA, FCBGA

484

-40°C~100°C TJ

Tray

2008

Virtex®-6 LXT

e0

no

Active

4 (72 Hours)

484

3A991.D

Tin/Lead (Sn63Pb37)

Field Programmable Gate Arrays

CMOS

0.95V~1.05V

BOTTOM

BALL

NOT SPECIFIED

1V

1mm

not_compliant

NOT SPECIFIED

XC6VLX130T

484

240

Not Qualified

240

1.2MB

FIELD PROGRAMMABLE GATE ARRAY

128000

9732096

10000

2

3mm

ROHS3 Compliant

1V

-

-

-

-

-

-

-

-

-

-

-

-

XC6VLX75T-2FFG484I vs XC6VLX130T-2FF484I
XC6VHX380T-1FFG1923C

Xilinx Inc.

14 Weeks

Copper, Silver, Tin

Surface Mount

Surface Mount

1924-BBGA, FCBGA

1923

0°C~85°C TJ

Tray

2008

Virtex®-6 HXT

e1

yes

Active

4 (72 Hours)

-

-

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Field Programmable Gate Arrays

CMOS

0.95V~1.05V

BOTTOM

BALL

245

1V

-

not_compliant

30

XC6VHX380T

-

720

Not Qualified

720

3.4MB

FIELD PROGRAMMABLE GATE ARRAY

382464

28311552

29880

1

3.85mm

ROHS3 Compliant

-

478080

5.08 ns

45mm

45mm

-

-

-

-

-

-

-

-

XC6VLX75T-2FFG484I vs XC6VHX380T-1FFG1923C
XC6VLX550T-2FF1759E

Xilinx Inc.

-

-

Surface Mount

-

FCBGA

-

-

-

-

-

e0

-

-

-

1759

3A001.A.7.A

TIN LEAD

Field Programmable Gate Arrays

CMOS

-

BOTTOM

BALL

-

1V

1mm

-

-

-

1759

840

-

840

2.8MB

FIELD PROGRAMMABLE GATE ARRAY

549888

-

-

2

3.5mm

RoHS Compliant

1V

-

-

-

-

100°C

-40°C

S-PBGA-B1759

1.05V

220 ps

840

42960

No

XC6VLX75T-2FFG484I vs XC6VLX550T-2FF1759E