Xilinx Inc. XC6VLX365T-2FF1156I
- Part Number:
- XC6VLX365T-2FF1156I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3128864-XC6VLX365T-2FF1156I
- Description:
- IC FPGA 600 I/O 1156FCBGA
- ECAD Model:
-
- Datasheet:
- XC6VLX365T-2FF1156I
Xilinx Inc. XC6VLX365T-2FF1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6VLX365T-2FF1156I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case1156-BBGA, FCBGA
- Number of Pins1156
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2008
- SeriesVirtex®-6 LXT
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- ECCN Code3A991.D
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.95V~1.05V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberXC6VLX365T
- Number of Outputs600
- Qualification StatusNot Qualified
- Operating Supply Voltage1V
- Number of I/O600
- RAM Size1.8MB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells364032
- Total RAM Bits15335424
- Number of LABs/CLBs28440
- Speed Grade2
- Height Seated (Max)3.5mm
- Length35mm
- Width35mm
- RoHS StatusNon-RoHS Compliant
XC6VLX365T-2FF1156I Overview
Xilinx Inc. is the brand of this part, which is an Embedded - FPGAs (Field Programmable Gate Array) chip belonging to the Embedded - FPGAs (Field Programmable Gate Array) category. It was published in 2008 and has a JESD-609 Code of e0. The part is currently active and has an ECCN Code of 3A991.D. The technology used is CMOS and the terminal form is BALL. The part has 1156 pins and a maximum operating temperature of -40°C~100°C TJ. It also has a reflow temperature-max (s) that is not specified and contains 364032 logic elements/cells.
XC6VLX365T-2FF1156I Features
600 I/Os
Up to 15335424 RAM bits
1156 LABs/CLBs
XC6VLX365T-2FF1156I Applications
There are a lot of Xilinx Inc. XC6VLX365T-2FF1156I FPGAs applications.
Digital signal processing
Random logic
Automotive
Video & Image Processing
Radar and Sensors
Software-defined radio
Image processing
Security systems
Space Applications
Aircraft navigation
Xilinx Inc. is the brand of this part, which is an Embedded - FPGAs (Field Programmable Gate Array) chip belonging to the Embedded - FPGAs (Field Programmable Gate Array) category. It was published in 2008 and has a JESD-609 Code of e0. The part is currently active and has an ECCN Code of 3A991.D. The technology used is CMOS and the terminal form is BALL. The part has 1156 pins and a maximum operating temperature of -40°C~100°C TJ. It also has a reflow temperature-max (s) that is not specified and contains 364032 logic elements/cells.
XC6VLX365T-2FF1156I Features
600 I/Os
Up to 15335424 RAM bits
1156 LABs/CLBs
XC6VLX365T-2FF1156I Applications
There are a lot of Xilinx Inc. XC6VLX365T-2FF1156I FPGAs applications.
Digital signal processing
Random logic
Automotive
Video & Image Processing
Radar and Sensors
Software-defined radio
Image processing
Security systems
Space Applications
Aircraft navigation
XC6VLX365T-2FF1156I More Descriptions
FPGA Virtex-6 LXT Family 364032 Cells 40nm (CMOS) Technology 1V 1156-Pin FC-BGA
FPGA - Field Programmable Gate Array
IC FPGA 600 I/O 1156FCBGA
FPGA - Field Programmable Gate Array
IC FPGA 600 I/O 1156FCBGA
The three parts on the right have similar specifications to XC6VLX365T-2FF1156I.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)ECCN CodeTerminal FinishSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberNumber of OutputsQualification StatusOperating Supply VoltageNumber of I/ORAM SizeProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsSpeed GradeHeight Seated (Max)LengthWidthRoHS StatusNumber of TerminationsPin CountCombinatorial Delay of a CLB-MaxReach Compliance CodeContact PlatingNumber of RegistersView Compare
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XC6VLX365T-2FF1156I10 WeeksSurface MountSurface Mount1156-BBGA, FCBGA1156-40°C~100°C TJTray2008Virtex®-6 LXTe0noActive4 (72 Hours)3A991.DTin/Lead (Sn63Pb37)Field Programmable Gate ArraysCMOS0.95V~1.05VBOTTOMBALLNOT SPECIFIED1V1mmNOT SPECIFIEDXC6VLX365T600Not Qualified1V6001.8MBFIELD PROGRAMMABLE GATE ARRAY364032153354242844023.5mm35mm35mmNon-RoHS Compliant------- -
11 WeeksSurface MountSurface Mount784-BBGA, FCBGA784-40°C~100°C TJTray2008Virtex®-6 LXTe0noActive4 (72 Hours)-TIN LEADField Programmable Gate ArraysCMOS0.95V~1.05VBOTTOMBALLNOT SPECIFIED1V-NOT SPECIFIEDXC6VLX75T360Not Qualified1V360702kBFIELD PROGRAMMABLE GATE ARRAY744965750784582012.86mm29mm29mmNon-RoHS Compliant7847845.08 ns---
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14 WeeksSurface MountSurface Mount484-BBGA, FCBGA484-40°C~100°C TJTray2008Virtex®-6 LXTe0noActive4 (72 Hours)3A991.DTin/Lead (Sn63Pb37)Field Programmable Gate ArraysCMOS0.95V~1.05VBOTTOMBALLNOT SPECIFIED1V1mmNOT SPECIFIEDXC6VLX130T240Not Qualified1V2401.2MBFIELD PROGRAMMABLE GATE ARRAY12800097320961000023mm--ROHS3 Compliant484484-not_compliant--
-
14 WeeksSurface MountSurface Mount1924-BBGA, FCBGA19230°C~85°C TJTray2008Virtex®-6 HXTe1yesActive4 (72 Hours)-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate ArraysCMOS0.95V~1.05VBOTTOMBALL2451V-30XC6VHX380T720Not Qualified-7203.4MBFIELD PROGRAMMABLE GATE ARRAY382464283115522988013.85mm45mm45mmROHS3 Compliant--5.08 nsnot_compliantCopper, Silver, Tin478080
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