Xilinx Inc. XC6VLX130T-2FFG1156C
- Part Number:
- XC6VLX130T-2FFG1156C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3135586-XC6VLX130T-2FFG1156C
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Datasheet:
- XC6VLX130T-2FFG1156C
Xilinx Inc. XC6VLX130T-2FFG1156C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6VLX130T-2FFG1156C.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case1156-BBGA, FCBGA
- Number of Pins1156
- Supplier Device Package1156-FCBGA (35x35)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2008
- SeriesVirtex®-6 LXT
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Voltage - Supply0.95V~1.05V
- Base Part NumberXC6VLX130T
- Operating Supply Voltage1V
- Number of I/O600
- RAM Size1.2MB
- Number of Logic Elements/Cells128000
- Total RAM Bits9732096
- Number of LABs/CLBs10000
- Number of Logic Blocks (LABs)10000
- Speed Grade2
- RoHS StatusROHS3 Compliant
XC6VLX130T-2FFG1156C Overview
This particular component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is designed to be mounted on the surface of a circuit board and the specific package or case size is 1156-BBGA, FCBGA. The supplier device package is 1156-FCBGA (35x35) and it is packaged in a tray. It was first released in 2008 and is currently still in active production. The required voltage for this component is between 0.95V and 1.05V. It has a RAM size of 1.2MB and contains 10,000 LABs (Logic Array Blocks) or CLBs (Configurable Logic Blocks). This means it has a maximum capacity of 10,000 logic blocks that can be programmed for specific functions.
XC6VLX130T-2FFG1156C Features
600 I/Os
Up to 9732096 RAM bits
1156 LABs/CLBs
85°C gates
10000 logic blocks (LABs)
XC6VLX130T-2FFG1156C Applications
There are a lot of Xilinx Inc. XC6VLX130T-2FFG1156C FPGAs applications.
Medical imaging
Data center search engines
Radar and Sensors
Video & Image Processing
Data Center
Telecommunication
Industrial,Medical and Scientific Instruments
Industrial IoT
Medical Electronics
Development Boards and Shields for Microcontrollers
This particular component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is designed to be mounted on the surface of a circuit board and the specific package or case size is 1156-BBGA, FCBGA. The supplier device package is 1156-FCBGA (35x35) and it is packaged in a tray. It was first released in 2008 and is currently still in active production. The required voltage for this component is between 0.95V and 1.05V. It has a RAM size of 1.2MB and contains 10,000 LABs (Logic Array Blocks) or CLBs (Configurable Logic Blocks). This means it has a maximum capacity of 10,000 logic blocks that can be programmed for specific functions.
XC6VLX130T-2FFG1156C Features
600 I/Os
Up to 9732096 RAM bits
1156 LABs/CLBs
85°C gates
10000 logic blocks (LABs)
XC6VLX130T-2FFG1156C Applications
There are a lot of Xilinx Inc. XC6VLX130T-2FFG1156C FPGAs applications.
Medical imaging
Data center search engines
Radar and Sensors
Video & Image Processing
Data Center
Telecommunication
Industrial,Medical and Scientific Instruments
Industrial IoT
Medical Electronics
Development Boards and Shields for Microcontrollers
XC6VLX130T-2FFG1156C More Descriptions
FPGA Virtex-6 LXT Family 128000 Cells 40nm (CMOS) Technology 1V 1156-Pin FC-BGA
Field Programmable Gate Array, 1286MHz, 128000-Cell, CMOS, PBGA1156
Product Description Demo for Development.
French Electronic Distributor since 1988
Field Programmable Gate Array, 1286MHz, 128000-Cell, CMOS, PBGA1156
Product Description Demo for Development.
French Electronic Distributor since 1988
The three parts on the right have similar specifications to XC6VLX130T-2FFG1156C.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureVoltage - SupplyBase Part NumberOperating Supply VoltageNumber of I/ORAM SizeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsNumber of Logic Blocks (LABs)Speed GradeRoHS StatusJESD-609 CodePbfree CodeNumber of TerminationsTerminal FinishSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)Pin CountNumber of OutputsQualification StatusProgrammable Logic TypeCombinatorial Delay of a CLB-MaxHeight Seated (Max)LengthWidthECCN CodeTerminal PitchReach Compliance CodeJESD-30 CodeSupply Voltage-Max (Vsup)Propagation DelayNumber of InputsRadiation HardeningView Compare
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XC6VLX130T-2FFG1156C10 WeeksSurface MountSurface Mount1156-BBGA, FCBGA11561156-FCBGA (35x35)0°C~85°C TJTray2008Virtex®-6 LXTActive4 (72 Hours)85°C0°C0.95V~1.05VXC6VLX130T1V6001.2MB128000973209610000100002ROHS3 Compliant----------------------------
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11 WeeksSurface MountSurface Mount784-BBGA, FCBGA784--40°C~100°C TJTray2008Virtex®-6 LXTActive4 (72 Hours)--0.95V~1.05VXC6VLX75T1V360702kB7449657507845820-1Non-RoHS Compliante0no784TIN LEADField Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1VNOT SPECIFIED784360Not QualifiedFIELD PROGRAMMABLE GATE ARRAY5.08 ns2.86mm29mm29mm--------
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14 WeeksSurface MountSurface Mount484-BBGA, FCBGA484--40°C~100°C TJTray2008Virtex®-6 LXTActive4 (72 Hours)--0.95V~1.05VXC6VLX130T1V2401.2MB128000973209610000-2ROHS3 Compliante0no484Tin/Lead (Sn63Pb37)Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1VNOT SPECIFIED484240Not QualifiedFIELD PROGRAMMABLE GATE ARRAY-3mm--3A991.D1mmnot_compliant-----
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-Surface Mount-FCBGA--------100°C-40°C--1V8402.8MB549888--429602RoHS Compliante0-1759TIN LEADField Programmable Gate ArraysCMOSBOTTOMBALL-1V-1759840-FIELD PROGRAMMABLE GATE ARRAY-3.5mm--3A001.A.7.A1mm-S-PBGA-B17591.05V220 ps840No
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