Xilinx Inc. XC6VLX130T-1FF1156C
- Part Number:
- XC6VLX130T-1FF1156C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3641519-XC6VLX130T-1FF1156C
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Datasheet:
- XC6VLX130T-1FF1156C
Xilinx Inc. XC6VLX130T-1FF1156C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6VLX130T-1FF1156C.
- Factory Lead Time11 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case1156-BBGA, FCBGA
- Number of Pins1156
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2008
- SeriesVirtex®-6 LXT
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.95V~1.05V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberXC6VLX130T
- Number of Outputs600
- Qualification StatusNot Qualified
- Operating Supply Voltage1V
- Number of I/O600
- RAM Size1.2MB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells128000
- Total RAM Bits9732096
- Number of LABs/CLBs10000
- Speed Grade1
- Combinatorial Delay of a CLB-Max5.08 ns
- Height Seated (Max)3.5mm
- Length35mm
- Width35mm
- RoHS StatusNon-RoHS Compliant
XC6VLX130T-1FF1156C Overview
The Mount is Surface Mount, meaning that it can be easily attached to a surface without the need for additional hardware. The Package / Case is 1156-BBGA, FCBGA, which refers to the type of packaging used for this component. The Operating Temperature is 0°C~85°C TJ, indicating the temperature range in which this component can safely operate. This particular product was Published in 2008, making it a relatively recent addition to the market. It is part of the Virtex®-6 LXT Series, a high-performance line of products designed for demanding applications. The Pbfree Code for this component is no, meaning that it does contain lead. The Terminal Finish is Tin/Lead (Sn63Pb37), which is a common choice for electronic components. The Voltage - Supply for this component is 0.95V~1.05V, indicating the range of voltage it requires to function properly. The Terminal Form is BALL, meaning that this component has spherical terminals for easy connection. With a large number of Logic Elements/Cells at 128000, this component offers powerful processing capabilities for a variety of applications.
XC6VLX130T-1FF1156C Features
600 I/Os
Up to 9732096 RAM bits
1156 LABs/CLBs
XC6VLX130T-1FF1156C Applications
There are a lot of Xilinx Inc. XC6VLX130T-1FF1156C FPGAs applications.
ASIC prototyping
Image processing
Data center search engines
Filtering and communication encoding
Wireless Communications
Telecommunication
Industrial Ethernet
Camera time adjustments
High Performance Computing
Server Applications
The Mount is Surface Mount, meaning that it can be easily attached to a surface without the need for additional hardware. The Package / Case is 1156-BBGA, FCBGA, which refers to the type of packaging used for this component. The Operating Temperature is 0°C~85°C TJ, indicating the temperature range in which this component can safely operate. This particular product was Published in 2008, making it a relatively recent addition to the market. It is part of the Virtex®-6 LXT Series, a high-performance line of products designed for demanding applications. The Pbfree Code for this component is no, meaning that it does contain lead. The Terminal Finish is Tin/Lead (Sn63Pb37), which is a common choice for electronic components. The Voltage - Supply for this component is 0.95V~1.05V, indicating the range of voltage it requires to function properly. The Terminal Form is BALL, meaning that this component has spherical terminals for easy connection. With a large number of Logic Elements/Cells at 128000, this component offers powerful processing capabilities for a variety of applications.
XC6VLX130T-1FF1156C Features
600 I/Os
Up to 9732096 RAM bits
1156 LABs/CLBs
XC6VLX130T-1FF1156C Applications
There are a lot of Xilinx Inc. XC6VLX130T-1FF1156C FPGAs applications.
ASIC prototyping
Image processing
Data center search engines
Filtering and communication encoding
Wireless Communications
Telecommunication
Industrial Ethernet
Camera time adjustments
High Performance Computing
Server Applications
XC6VLX130T-1FF1156C More Descriptions
FPGA Virtex-6 LXT Family 128000 Cells 40nm (CMOS) Technology 1V 1156-Pin FC-BGA
FPGA - Field Programmable Gate Array
IC FPGA 600 I/O 1156FCBGA
IC FPGA 248 I/O 484FBGA
TVS DIODE 85V 137V SMB
Xilinx BGA1156
Contact for details
FPGA - Field Programmable Gate Array
IC FPGA 600 I/O 1156FCBGA
IC FPGA 248 I/O 484FBGA
TVS DIODE 85V 137V SMB
Xilinx BGA1156
Contact for details
The three parts on the right have similar specifications to XC6VLX130T-1FF1156C.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Terminal FinishSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)Base Part NumberNumber of OutputsQualification StatusOperating Supply VoltageNumber of I/ORAM SizeProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsSpeed GradeCombinatorial Delay of a CLB-MaxHeight Seated (Max)LengthWidthRoHS StatusNumber of TerminationsECCN CodeTerminal PitchReach Compliance CodePin CountContact PlatingNumber of RegistersSupplier Device PackageMax Operating TemperatureMin Operating TemperaturePropagation DelayNumber of Logic Blocks (LABs)Radiation HardeningView Compare
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XC6VLX130T-1FF1156C11 WeeksSurface MountSurface Mount1156-BBGA, FCBGA11560°C~85°C TJTray2008Virtex®-6 LXTe0noActive4 (72 Hours)Tin/Lead (Sn63Pb37)Field Programmable Gate ArraysCMOS0.95V~1.05VBOTTOMBALLNOT SPECIFIED1VNOT SPECIFIEDXC6VLX130T600Not Qualified1V6001.2MBFIELD PROGRAMMABLE GATE ARRAY12800097320961000015.08 ns3.5mm35mm35mmNon-RoHS Compliant--------------
-
14 WeeksSurface MountSurface Mount484-BBGA, FCBGA484-40°C~100°C TJTray2008Virtex®-6 LXTe0noActive4 (72 Hours)Tin/Lead (Sn63Pb37)Field Programmable Gate ArraysCMOS0.95V~1.05VBOTTOMBALLNOT SPECIFIED1VNOT SPECIFIEDXC6VLX130T240Not Qualified1V2401.2MBFIELD PROGRAMMABLE GATE ARRAY1280009732096100002-3mm--ROHS3 Compliant4843A991.D1mmnot_compliant484--------
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14 WeeksSurface MountSurface Mount1924-BBGA, FCBGA19230°C~85°C TJTray2008Virtex®-6 HXTe1yesActive4 (72 Hours)Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate ArraysCMOS0.95V~1.05VBOTTOMBALL2451V30XC6VHX380T720Not Qualified-7203.4MBFIELD PROGRAMMABLE GATE ARRAY382464283115522988015.08 ns3.85mm45mm45mmROHS3 Compliant---not_compliant-Copper, Silver, Tin478080------
-
10 WeeksSurface MountSurface Mount1760-BBGA, FCBGA-0°C~100°C TJTray2008Virtex®-6 SXT--Active4 (72 Hours)---0.95V~1.05V-----XC6VSX475T--1V8404.7MB-47616039223296372002----Non-RoHS Compliant-------1759-FCBGA (42.5x42.5)100°C0°C220 ps37200No
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