Xilinx Inc. XC6SLX9-2CSG225I

XC6SLX9-2CSG225I Overview
The Mount is Surface Mount, which refers to the method of attaching electronic components to a printed circuit board. The Package/Case for this particular component is 225-LFBGA, CSPBGA, which stands for 225-Lead Fine-Pitch Ball Grid Array and Chip Scale Package Ball Grid Array. This indicates the number of leads and the type of packaging used for the component. The Operating Temperature for this component is -40°C~100°C TJ, meaning it can function within a wide range of temperatures. The ECCN Code for this component is EAR99, indicating that it is classified as an Export Administration Regulation (EAR) item and can be exported without a license. The Voltage - Supply for this component is 1.14V~1.26V, indicating the range of voltage required for it to operate. The Terminal Pitch is 0.8mm, which is the distance between the center of one terminal to the center of the next terminal. This component has a Pin Count of 225, meaning it has 225 pins for connection to other components. It has a Clock Frequency of 667MHz, indicating the speed at which it can process data. This component also has a high processing power, with 9152 Logic Elements/Cells and a Total RAM Bits of 589824.

XC6SLX9-2CSG225I Features
160 I/Os
Up to 589824 RAM bits
225 LABs/CLBs
11440 registers

XC6SLX9-2CSG225I Applications
There are a lot of Xilinx Inc. XC6SLX9-2CSG225I FPGAs applications.

Computer hardware emulation
Radar and Sensors
Defense Applications
Enterprise networking
Medical Applications
ASIC prototyping
DO-254
Bioinformatics
Artificial intelligence (AI)
Electronic Warfare