XC6SLX75T-3FGG676C

Xilinx Inc. XC6SLX75T-3FGG676C

Part Number:
XC6SLX75T-3FGG676C
Manufacturer:
Xilinx Inc.
Ventron No:
3634646-XC6SLX75T-3FGG676C
Description:
IC FPGA 348 I/O 676FBGA
ECAD Model:
Datasheet:
XC6SLX75T-3FGG676C

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Specifications
Xilinx Inc. XC6SLX75T-3FGG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6SLX75T-3FGG676C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    676-BGA
  • Number of Pins
    676
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2008
  • Series
    Spartan®-6 LXT
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC6SLX75
  • Pin Count
    676
  • Number of Outputs
    320
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    348
  • RAM Size
    387kB
  • Clock Frequency
    862MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    74637
  • Total RAM Bits
    3170304
  • Number of LABs/CLBs
    5831
  • Speed Grade
    3
  • Number of Registers
    93296
  • Combinatorial Delay of a CLB-Max
    0.21 ns
  • Height Seated (Max)
    2.44mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    ROHS3 Compliant
Description
XC6SLX75T-3FGG676C Overview
This particular component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Arrays). It is a chip that can be programmed to perform specific functions and is designed for use in embedded systems. The chip is meant to be mounted on the surface of a circuit board and has a 676-BGA (Ball Grid Array) package. It is packaged in a tray and has a JESD-609 code of e1. The moisture sensitivity level is 3, meaning it can withstand exposure to moisture for up to 168 hours. The voltage required for operation is between 1.14V and 1.26V. The terminals on the chip are in the form of balls. This particular component has not yet been qualified for use. The operating supply voltage is 1.2V and it is compliant with the ROHS3 standard for environmental safety.

XC6SLX75T-3FGG676C Features
348 I/Os
Up to 3170304 RAM bits
676 LABs/CLBs
93296 registers

XC6SLX75T-3FGG676C Applications
There are a lot of Xilinx Inc. XC6SLX75T-3FGG676C FPGAs applications.

Military Temperature
Digital signal processing
Defense Applications
Image processing
Medical ultrasounds
Server Applications
Cryptography
OpenCL
Bioinformatics
Integrating multiple SPLDs
XC6SLX75T-3FGG676C More Descriptions
FPGA Spartan-6 LXT Family 74637 Cells 45nm (CMOS) Technology 1.2V 676-Pin FBGA
Spartan-6 FPGA, 348 Max User I/O, Speed Grade-3, Logic Cells 74637, FGG676, RoHSXilinx SCT
Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA676
FPGA, SPARTAN-6, 348 I/O, FPBGA-676; No. of Logic Blocks:11662; No. of Macrocells:74637Macrocells; FPGA Family:Spartan-6; Logic Case Style:FBGA; No. of Pins:676Pins; No. of Speed Grades:3; Total RAM Bits:3096Kbit; MSL:- RoHS Compliant: Yes
Product Comparison
The three parts on the right have similar specifications to XC6SLX75T-3FGG676C.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Number of Outputs
    Qualification Status
    Operating Supply Voltage
    Number of I/O
    RAM Size
    Clock Frequency
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Speed Grade
    Number of Registers
    Combinatorial Delay of a CLB-Max
    Height Seated (Max)
    Length
    Width
    RoHS Status
    ECCN Code
    Terminal Finish
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    Surface Mount
    HTS Code
    JESD-30 Code
    Power Supplies
    Number of Inputs
    View Compare
  • XC6SLX75T-3FGG676C
    XC6SLX75T-3FGG676C
    10 Weeks
    Surface Mount
    Surface Mount
    676-BGA
    676
    0°C~85°C TJ
    Tray
    2008
    Spartan®-6 LXT
    e1
    yes
    Active
    3 (168 Hours)
    676
    Field Programmable Gate Arrays
    CMOS
    1.14V~1.26V
    BOTTOM
    BALL
    250
    1.2V
    1mm
    30
    XC6SLX75
    676
    320
    Not Qualified
    1.2V
    348
    387kB
    862MHz
    FIELD PROGRAMMABLE GATE ARRAY
    74637
    3170304
    5831
    3
    93296
    0.21 ns
    2.44mm
    27mm
    27mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC6SLX16-2FT256C
    10 Weeks
    Surface Mount
    Surface Mount
    256-LBGA
    256
    0°C~85°C TJ
    Tray
    2008
    Spartan®-6 LX
    e0
    no
    Active
    3 (168 Hours)
    256
    Field Programmable Gate Arrays
    CMOS
    1.14V~1.26V
    BOTTOM
    BALL
    240
    1.2V
    1mm
    -
    XC6SLX16
    256
    186
    Not Qualified
    1.2V
    186
    72kB
    667MHz
    FIELD PROGRAMMABLE GATE ARRAY
    14579
    589824
    1139
    2
    18224
    -
    1.55mm
    17mm
    17mm
    Non-RoHS Compliant
    EAR99
    Tin/Lead (Sn63Pb37)
    not_compliant
    30
    -
    -
    -
    -
    -
  • XC6SLX16-N3FT256I
    -
    -
    Surface Mount
    256-LBGA
    -
    -40°C~100°C TJ
    Tray
    2008
    Spartan®-6 LX
    e0
    -
    Obsolete
    3 (168 Hours)
    256
    Field Programmable Gate Arrays
    CMOS
    1.14V~1.26V
    BOTTOM
    BALL
    240
    1.2V
    1mm
    -
    XC6SLX16
    -
    186
    Not Qualified
    -
    186
    -
    806MHz
    FIELD PROGRAMMABLE GATE ARRAY
    14579
    589824
    1139
    -
    -
    0.26 ns
    1.55mm
    17mm
    17mm
    Non-RoHS Compliant
    EAR99
    Tin/Lead (Sn63Pb37)
    not_compliant
    30
    YES
    8542.39.00.01
    S-PBGA-B256
    1.21.2/3.32.5/3.3V
    186
  • XC6SLX150T-N3FG484C
    -
    -
    Surface Mount
    484-BBGA
    -
    0°C~85°C TJ
    Tray
    2008
    Spartan®-6 LXT
    e0
    -
    Obsolete
    3 (168 Hours)
    484
    Field Programmable Gate Arrays
    CMOS
    1.14V~1.26V
    BOTTOM
    BALL
    225
    1.2V
    1mm
    -
    XC6SLX150
    -
    296
    Not Qualified
    -
    296
    -
    806MHz
    FIELD PROGRAMMABLE GATE ARRAY
    147443
    4939776
    11519
    -
    -
    0.26 ns
    2.6mm
    23mm
    23mm
    Non-RoHS Compliant
    3A991.D
    Tin/Lead (Sn63Pb37)
    -
    30
    YES
    8542.39.00.01
    S-PBGA-B484
    1.21.2/3.32.5/3.3V
    296
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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