Xilinx Inc. XC6SLX75T-3FGG484I
- Part Number:
- XC6SLX75T-3FGG484I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3127891-XC6SLX75T-3FGG484I
- Description:
- IC FPGA 268 I/O 484FBGA
- Datasheet:
- XC6SLX75T-3FGG484I
Xilinx Inc. XC6SLX75T-3FGG484I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6SLX75T-3FGG484I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case484-BBGA
- Number of Pins484
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2008
- SeriesSpartan®-6 LXT
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC6SLX75
- Pin Count484
- Number of Outputs268
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Number of I/O268
- RAM Size387kB
- Clock Frequency862MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells74637
- Total RAM Bits3170304
- Number of LABs/CLBs5831
- Speed Grade3
- Number of Registers93296
- Combinatorial Delay of a CLB-Max0.21 ns
- Height Seated (Max)2.6mm
- RoHS StatusROHS3 Compliant
XC6SLX75T-3FGG484I Overview
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and can be programmed to perform a wide range of functions, making them a popular choice for various applications. The Xilinx Inc. chip in question belongs to the Embedded - FPGAs (Field Programmable Gate Array) category, which is known for its advanced capabilities and flexibility. One important aspect to consider when using this chip is its mounting style, which is surface mount. This means that it can be easily mounted onto a circuit board, making it suitable for use in compact electronic devices. Additionally, the chip has 484 pins, providing a large number of connection points for various components and ensuring efficient data transfer. The Xilinx Inc. chip was first published in 2008, and since then, it has undergone several updates and improvements to keep up with the ever-evolving technology landscape. It is constantly being optimized to provide better performance and meet the changing needs of the market. When it comes to technical specifications, the chip has a JESD-609 code of e1, indicating its compliance with industry standards and protocols. It also utilizes CMOS technology, known for its low power consumption and high-speed processing capabilities. The voltage supply for this chip ranges from 1.14V to 1.26V, ensuring efficient and stable power delivery. In terms of reflow temperature, the chip can withstand a maximum of 30 seconds at high temperatures, making it suitable for use in various manufacturing processes. It also has a RAM size of 387kB, providing ample storage space for data and instructions. One of the key features of this Xilinx Inc. chip is its clock frequency, which is an impressive 862MHz. This high clock speed allows for fast data processing and ensures smooth performance even for complex tasks. Lastly, it is worth mentioning that this chip is also environmentally friendly, as it is ROHS3 compliant. This means that it meets the strict regulations for the restriction of hazardous substances, making it a safe and sustainable choice for electronic devices. Overall, the Xilinx Inc. chip offers a comprehensive set of parameters that make it a top choice for various applications in the technology industry.
XC6SLX75T-3FGG484I Features
268 I/Os
Up to 3170304 RAM bits
484 LABs/CLBs
93296 registers
XC6SLX75T-3FGG484I Applications
There are a lot of Xilinx Inc. XC6SLX75T-3FGG484I FPGAs applications.
Military Temperature
Integrating multiple SPLDs
Medical ultrasounds
Electronic Warfare
DO-254
Enterprise networking
Data center search engines
Industrial,Medical and Scientific Instruments
Data center hardware accelerators
Digital signal processing
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and can be programmed to perform a wide range of functions, making them a popular choice for various applications. The Xilinx Inc. chip in question belongs to the Embedded - FPGAs (Field Programmable Gate Array) category, which is known for its advanced capabilities and flexibility. One important aspect to consider when using this chip is its mounting style, which is surface mount. This means that it can be easily mounted onto a circuit board, making it suitable for use in compact electronic devices. Additionally, the chip has 484 pins, providing a large number of connection points for various components and ensuring efficient data transfer. The Xilinx Inc. chip was first published in 2008, and since then, it has undergone several updates and improvements to keep up with the ever-evolving technology landscape. It is constantly being optimized to provide better performance and meet the changing needs of the market. When it comes to technical specifications, the chip has a JESD-609 code of e1, indicating its compliance with industry standards and protocols. It also utilizes CMOS technology, known for its low power consumption and high-speed processing capabilities. The voltage supply for this chip ranges from 1.14V to 1.26V, ensuring efficient and stable power delivery. In terms of reflow temperature, the chip can withstand a maximum of 30 seconds at high temperatures, making it suitable for use in various manufacturing processes. It also has a RAM size of 387kB, providing ample storage space for data and instructions. One of the key features of this Xilinx Inc. chip is its clock frequency, which is an impressive 862MHz. This high clock speed allows for fast data processing and ensures smooth performance even for complex tasks. Lastly, it is worth mentioning that this chip is also environmentally friendly, as it is ROHS3 compliant. This means that it meets the strict regulations for the restriction of hazardous substances, making it a safe and sustainable choice for electronic devices. Overall, the Xilinx Inc. chip offers a comprehensive set of parameters that make it a top choice for various applications in the technology industry.
XC6SLX75T-3FGG484I Features
268 I/Os
Up to 3170304 RAM bits
484 LABs/CLBs
93296 registers
XC6SLX75T-3FGG484I Applications
There are a lot of Xilinx Inc. XC6SLX75T-3FGG484I FPGAs applications.
Military Temperature
Integrating multiple SPLDs
Medical ultrasounds
Electronic Warfare
DO-254
Enterprise networking
Data center search engines
Industrial,Medical and Scientific Instruments
Data center hardware accelerators
Digital signal processing
XC6SLX75T-3FGG484I More Descriptions
FPGA Spartan-6 LXT Family 74637 Cells 45nm (CMOS) Technology 1.2V 484-Pin FBGA
Spartan-6 FPGA, 348 Max User I/O, Speed Grade-3, Logic Cells 74637, FGG484, RoHSXilinx SCT
Field Programmable Gate Array, 5831 CLBs, 74637-Cell, PBGA484
Product Description Demo for Development.
OP Amp Quad GP ±20V/40V 20-Pin LCCC Tube
XC6SLX75T-3FGG484I ROHS COMPLIANT: YES
Spartan-6 FPGA, 348 Max User I/O, Speed Grade-3, Logic Cells 74637, FGG484, RoHSXilinx SCT
Field Programmable Gate Array, 5831 CLBs, 74637-Cell, PBGA484
Product Description Demo for Development.
OP Amp Quad GP ±20V/40V 20-Pin LCCC Tube
XC6SLX75T-3FGG484I ROHS COMPLIANT: YES
The three parts on the right have similar specifications to XC6SLX75T-3FGG484I.
-
ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberPin CountNumber of OutputsQualification StatusOperating Supply VoltageNumber of I/ORAM SizeClock FrequencyProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsSpeed GradeNumber of RegistersCombinatorial Delay of a CLB-MaxHeight Seated (Max)RoHS StatusSurface MountECCN CodeTerminal FinishHTS CodeReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodePower SuppliesNumber of InputsLengthWidthView Compare
-
XC6SLX75T-3FGG484I10 WeeksSurface MountSurface Mount484-BBGA484-40°C~100°C TJTray2008Spartan®-6 LXTe1yesActive3 (168 Hours)484Field Programmable Gate ArraysCMOS1.14V~1.26VBOTTOMBALL2501.2V1mm30XC6SLX75484268Not Qualified1.2V268387kB862MHzFIELD PROGRAMMABLE GATE ARRAY74637317030458313932960.21 ns2.6mmROHS3 Compliant------------
-
--Surface Mount256-LBGA--40°C~100°C TJTray2008Spartan®-6 LXe0-Obsolete3 (168 Hours)256Field Programmable Gate ArraysCMOS1.14V~1.26VBOTTOMBALL2401.2V1mm-XC6SLX16-186Not Qualified-186-806MHzFIELD PROGRAMMABLE GATE ARRAY145795898241139--0.26 ns1.55mmNon-RoHS CompliantYESEAR99Tin/Lead (Sn63Pb37)8542.39.00.01not_compliant30S-PBGA-B2561.21.2/3.32.5/3.3V18617mm17mm
-
--Surface Mount484-BBGA-0°C~85°C TJTray2008Spartan®-6 LXTe0-Obsolete3 (168 Hours)484Field Programmable Gate ArraysCMOS1.14V~1.26VBOTTOMBALL2251.2V1mm-XC6SLX150-296Not Qualified-296-806MHzFIELD PROGRAMMABLE GATE ARRAY147443493977611519--0.26 ns2.6mmNon-RoHS CompliantYES3A991.DTin/Lead (Sn63Pb37)8542.39.00.01-30S-PBGA-B4841.21.2/3.32.5/3.3V29623mm23mm
-
-Surface MountSurface Mount484-BBGA4840°C~85°C TJTray2008Spartan®-6 LXTe1-Obsolete3 (168 Hours)484Field Programmable Gate ArraysCMOS1.14V~1.26VBOTTOMBALL250-1mm-XC6SLX100484296Not Qualified-296603kB-FIELD PROGRAMMABLE GATE ARRAY10126149397767911---2.6mmRoHS Compliant--Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01unknown30-1.22.5/3.3V-23mm23mm
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
21 February 2024
What is the ADS1118IDGSR and How Does it Work?
Ⅰ. ADS1118IDGSR descriptionⅡ. Specifications of ADS1118IDGSRⅢ. Absolute maximum ratings of ADS1118IDGSRⅣ. How does ADS1118IDGSR work?Ⅴ. Package of ADS1118IDGSRⅥ. What are the characteristics of ADS1118IDGSR?Ⅶ. Typical application of ADS1118IDGSRⅧ.... -
22 February 2024
L293D Motor Driver Characteristics, Technical Parameters, Advantages and Working Principle
Ⅰ. L293D descriptionⅡ. Characteristics of L293DⅢ. Technical parameters of L293DⅣ. Advantages of L293DⅤ. L293D motor driving principleⅥ. Circuit diagram of L293DⅦ. Applications of L293DⅧ. Wiring method of L293D... -
22 February 2024
L7805CV Specifications, Applications and Design Considerations
Ⅰ. Introduction to L7805CVⅡ. Specifications of L7805CVⅢ. L7805CV symbol, footprint and pin configurationⅣ. Applications of L7805CVⅤ. Precautions for using L7805CVⅥ. Absolute maximum ratings of L7805CVⅦ. Design considerations for... -
23 February 2024
ADM2483BRWZ Alternatives, Symbol, Advantages and Disadvantages and Package
Ⅰ. Overview of ADM2483BRWZⅡ. Technical parameters of ADM2483BRWZⅢ. ADM2483BRWZ symbol, footprint and pin configurationⅣ. Circuit description of ADM2483BRWZⅤ. What are the advantages and disadvantages of ADM2483BRWZ?Ⅵ. Dimensions and...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.