Xilinx Inc. XC6SLX75T-2FGG676C

Name: XC6SLX75T-2FGG676C
Brand: Xilinx Inc.
SKU: 3127935-XC6SLX75T-2FGG676C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC6SLX75T-2FGG676C

Manufacturer:: Xilinx Inc.

Ventron No:: 3127935-XC6SLX75T-2FGG676C

Description:: IC FPGA 348 I/O 676FBGA

ECAD Model:

Datasheet:: XC6SLX75T-2FGG676C

Specifications

Xilinx Inc. XC6SLX75T-2FGG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6SLX75T-2FGG676C.

Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
676-BGA
Number of Pins
676
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2008
Series
Spartan®-6 LXT
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
676
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.2V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
XC6SLX75
Pin Count
676
Number of Outputs
320
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Number of I/O
348
RAM Size
387kB
Clock Frequency
667MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
74637
Total RAM Bits
3170304
Number of LABs/CLBs
5831
Speed Grade
2
Number of Registers
93296
RoHS Status
ROHS3 Compliant

Description

XC6SLX75T-2FGG676C Overview
The manufacturer of this component is Xilinx Inc. It is a chip belonging to the Embedded - FPGAs (Field Programmable Gate Array) category. The chip can operate within a temperature range of 0°C to 85°C. It is currently in active production. The terminals of the chip are positioned at the bottom and have a ball form. The maximum reflow temperature is 30 seconds. The chip has a total of 320 outputs. It has not yet been qualified. The clock frequency of the chip is 667MHz and it has a speed grade of 2. Additionally, it is compliant with the ROHS3 standard.

XC6SLX75T-2FGG676C Features
348 I/Os
Up to 3170304 RAM bits
676 LABs/CLBs
93296 registers

XC6SLX75T-2FGG676C Applications
There are a lot of Xilinx Inc. XC6SLX75T-2FGG676C FPGAs applications.

Audio
Bioinformatics
Medical ultrasounds
Wired Communications
Digital signal processing
Random logic
Filtering and communication encoding
Device controllers
Aircraft navigation
Server Applications

XC6SLX75T-2FGG676C More Descriptions

FPGA Spartan-6 LXT Family 74637 Cells 45nm (CMOS) Technology 1.2V 676-Pin FBGA
Spartan-6 FPGA, 348 Max User I/O, Speed Grade-2, Logic Cells 74637, FGG676, RoHSXilinx SCT
FPGA - Field Programmable Gate Array XC6SLX75T-2FGG676C
BGA-676 Programmable Logic Device (CPLDs/FPGAs) ROHS
Product Description Demo for Development.
XC6SLX75T-2FGG676C ROHS COMPLIANT: YES

Product Comparison

The three parts on the right have similar specifications to XC6SLX75T-2FGG676C.

Image

Part Number

Manufacturer

Factory Lead Time

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

Pin Count

Number of Outputs

Qualification Status

Operating Supply Voltage

Number of I/O

RAM Size

Clock Frequency

Programmable Logic Type

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Speed Grade

Number of Registers

RoHS Status

HTS Code

Power Supplies

Combinatorial Delay of a CLB-Max

Number of CLBs

Height Seated (Max)

Length

Width

Reach Compliance Code

Time@Peak Reflow Temperature-Max (s)

Surface Mount

JESD-30 Code

Number of Inputs

View Compare
XC6SLX75T-2FGG676C

Xilinx Inc.

10 Weeks

Surface Mount

Surface Mount

676-BGA

676

0°C~85°C TJ

Tray

2008

Spartan®-6 LXT

e1

yes

Active

3 (168 Hours)

676

3A991.D

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Field Programmable Gate Arrays

CMOS

1.14V~1.26V

BOTTOM

BALL

250

1.2V

1mm

30

XC6SLX75

676

320

Not Qualified

1.2V

348

387kB

667MHz

FIELD PROGRAMMABLE GATE ARRAY

74637

3170304

5831

2

93296

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-
XC6SLX9-L1FTG256I

Xilinx Inc.

10 Weeks

Surface Mount

Surface Mount

256-LBGA

256

-40°C~100°C TJ

Tray

2008

Spartan®-6 LX

e1

yes

Active

3 (168 Hours)

256

EAR99

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Field Programmable Gate Arrays

CMOS

1.14V~1.26V

BOTTOM

BALL

260

1V

1mm

30

XC6SLX9

256

186

Not Qualified

1V

186

72kB

-

FIELD PROGRAMMABLE GATE ARRAY

9152

589824

715

-

11440

ROHS3 Compliant

8542.39.00.01

12.5/3.3V

0.46 ns

715

1.55mm

17mm

17mm

-

-

-

-

-

XC6SLX75T-2FGG676C vs XC6SLX9-L1FTG256I
XC6SLX16-2FT256C

Xilinx Inc.

10 Weeks

Surface Mount

Surface Mount

256-LBGA

256

0°C~85°C TJ

Tray

2008

Spartan®-6 LX

e0

no

Active

3 (168 Hours)

256

EAR99

Tin/Lead (Sn63Pb37)

Field Programmable Gate Arrays

CMOS

1.14V~1.26V

BOTTOM

BALL

240

1.2V

1mm

-

XC6SLX16

256

186

Not Qualified

1.2V

186

72kB

667MHz

FIELD PROGRAMMABLE GATE ARRAY

14579

589824

1139

2

18224

Non-RoHS Compliant

-

-

-

-

1.55mm

17mm

17mm

not_compliant

30

-

-

-

XC6SLX75T-2FGG676C vs XC6SLX16-2FT256C
XC6SLX16-N3FT256I

Xilinx Inc.

-

-

Surface Mount

256-LBGA

-

-40°C~100°C TJ

Tray

2008

Spartan®-6 LX

e0

-

Obsolete

3 (168 Hours)

256

EAR99

Tin/Lead (Sn63Pb37)

Field Programmable Gate Arrays

CMOS

1.14V~1.26V

BOTTOM

BALL

240

1.2V

1mm

-

XC6SLX16

-

186

Not Qualified

-

186

-

806MHz

FIELD PROGRAMMABLE GATE ARRAY

14579

589824

1139

-

-

Non-RoHS Compliant

8542.39.00.01

1.21.2/3.32.5/3.3V

0.26 ns

-

1.55mm

17mm

17mm

not_compliant

30

YES

S-PBGA-B256

186

XC6SLX75T-2FGG676C vs XC6SLX16-N3FT256I