Xilinx Inc. XC6SLX25T-N3FGG484C
- Part Number:
- XC6SLX25T-N3FGG484C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3633059-XC6SLX25T-N3FGG484C
- Description:
- IC FPGA 250 I/O 484FBGA
- Datasheet:
- XC6SLX25T-N3FGG484C
Xilinx Inc. XC6SLX25T-N3FGG484C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6SLX25T-N3FGG484C.
- MountSurface Mount
- Package / CaseFBGA
- Number of Pins484
- JESD-609 Codee1
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.2V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)30
- Number of Outputs250
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.21.2/3.32.5/3.3V
- Temperature GradeOTHER
- Number of I/O250
- RAM Size117kB
- Clock Frequency806MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells24051
- Number of Logic Blocks (LABs)1879
- Number of Registers30064
- Combinatorial Delay of a CLB-Max0.26 ns
- Length23mm
- Height Seated (Max)2.6mm
- Width23mm
- RoHS StatusRoHS Compliant
XC6SLX25T-N3FGG484C Overview
In the FBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 250 I/O ports for more coherent data transfer. To form a fundamental building block, there are 24051 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.2V volts is required. FPGA parts like this belong to the Field Programmable Gate Arrays family. A total of 250 outputs are incorporated into this device. 484 terminations are present in total. It is crucial that the RAM si117kBe of this FPGA module reaches 117kB so that the program can run normally. In order to make it work, 484 pins have been designed. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. There is a 1.21.2/3.32.5/3.3V power supply that is required to operate it. As a result of the design of this module, the maximum operating temperature reaches 85°C. There should be a temperature difference between 0°C and the operating temperature. A basic building block of this system consists of 1879 logic blocks (LABs). It usually uses a 806MHz crystal. Fpga semiconductor is important to note that the data is stored and transferred in 30064 different registers.
XC6SLX25T-N3FGG484C Features
250 I/Os
484 LABs/CLBs
85°C gates
1879 logic blocks (LABs)
30064 registers
XC6SLX25T-N3FGG484C Applications
There are a lot of Xilinx
XC6SLX25T-N3FGG484C FPGAs applications.
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
In the FBGA package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 250 I/O ports for more coherent data transfer. To form a fundamental building block, there are 24051 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.2V volts is required. FPGA parts like this belong to the Field Programmable Gate Arrays family. A total of 250 outputs are incorporated into this device. 484 terminations are present in total. It is crucial that the RAM si117kBe of this FPGA module reaches 117kB so that the program can run normally. In order to make it work, 484 pins have been designed. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. There is a 1.21.2/3.32.5/3.3V power supply that is required to operate it. As a result of the design of this module, the maximum operating temperature reaches 85°C. There should be a temperature difference between 0°C and the operating temperature. A basic building block of this system consists of 1879 logic blocks (LABs). It usually uses a 806MHz crystal. Fpga semiconductor is important to note that the data is stored and transferred in 30064 different registers.
XC6SLX25T-N3FGG484C Features
250 I/Os
484 LABs/CLBs
85°C gates
1879 logic blocks (LABs)
30064 registers
XC6SLX25T-N3FGG484C Applications
There are a lot of Xilinx
XC6SLX25T-N3FGG484C FPGAs applications.
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
XC6SLX25T-N3FGG484C More Descriptions
FPGA Spartan-6 LXT Family 24051 Cells 45nm (CMOS) Technology 1.2V 484-Pin FBGA
Spartan-6 FPGA, 250 Max User I/O, Speed Grade-N3, Logic Cells 24051, FGG484, RoHSXilinx SCT
BGA-484 Programmable Logic Device (CPLDs/FPGAs) ROHS
Field Programmable Gate Array, 500MHz, PBGA225
Spartan-6 FPGA, 250 Max User I/O, Speed Grade-N3, Logic Cells 24051, FGG484, RoHSXilinx SCT
BGA-484 Programmable Logic Device (CPLDs/FPGAs) ROHS
Field Programmable Gate Array, 500MHz, PBGA225
The three parts on the right have similar specifications to XC6SLX25T-N3FGG484C.
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ImagePart NumberManufacturerMountPackage / CaseNumber of PinsJESD-609 CodeMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishMax Operating TemperatureMin Operating TemperatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Number of OutputsQualification StatusOperating Supply VoltageSupply Voltage-Max (Vsup)Power SuppliesTemperature GradeNumber of I/ORAM SizeClock FrequencyProgrammable Logic TypeNumber of Logic Elements/CellsNumber of Logic Blocks (LABs)Number of RegistersCombinatorial Delay of a CLB-MaxLengthHeight Seated (Max)WidthRoHS StatusFactory Lead TimeMounting TypeOperating TemperaturePackagingSeriesPublishedPbfree CodePart StatusVoltage - SupplyReach Compliance CodeBase Part NumberPin CountTotal RAM BitsNumber of LABs/CLBsSpeed GradeSurface MountJESD-30 CodeNumber of InputsView Compare
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XC6SLX25T-N3FGG484CSurface MountFBGA484e13 (168 Hours)4843A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)85°C0°C8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL2501.2V1mm30250Not Qualified1.2V1.26V1.21.2/3.32.5/3.3VOTHER250117kB806MHzFIELD PROGRAMMABLE GATE ARRAY240511879300640.26 ns23mm2.6mm23mmRoHS Compliant-------------------
-
Surface Mount256-LBGA256e03 (168 Hours)256EAR99Tin/Lead (Sn63Pb37)---Field Programmable Gate ArraysCMOSBOTTOMBALL2401.2V1mm30186Not Qualified1.2V---18672kB667MHzFIELD PROGRAMMABLE GATE ARRAY14579-18224-17mm1.55mm17mmNon-RoHS Compliant10 WeeksSurface Mount0°C~85°C TJTraySpartan®-6 LX2008noActive1.14V~1.26Vnot_compliantXC6SLX1625658982411392---
-
-484-BBGA-e03 (168 Hours)4843A991.DTin/Lead (Sn63Pb37)--8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL2251.2V1mm30296Not Qualified--1.21.2/3.32.5/3.3V-296-806MHzFIELD PROGRAMMABLE GATE ARRAY147443--0.26 ns23mm2.6mm23mmNon-RoHS Compliant-Surface Mount0°C~85°C TJTraySpartan®-6 LXT2008-Obsolete1.14V~1.26V-XC6SLX150-493977611519-YESS-PBGA-B484296
-
Surface Mount484-BBGA484e13 (168 Hours)484-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)--8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL250-1mm30296Not Qualified--1.22.5/3.3V-296603kB-FIELD PROGRAMMABLE GATE ARRAY101261---23mm2.6mm23mmRoHS Compliant-Surface Mount0°C~85°C TJTraySpartan®-6 LXT2008-Obsolete1.14V~1.26VunknownXC6SLX10048449397767911----
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