Xilinx Inc. XC6SLX100-2FGG676C
- Part Number:
- XC6SLX100-2FGG676C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3127857-XC6SLX100-2FGG676C
- Description:
- IC FPGA 480 I/O 676FBGA
- Datasheet:
- XC6SLX100-2FGG676C
Xilinx Inc. XC6SLX100-2FGG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6SLX100-2FGG676C.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case676-BGA
- Number of Pins676
- Supplier Device Package676-FBGA (27x27)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2008
- SeriesSpartan®-6 LX
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Voltage - Supply1.14V~1.26V
- Base Part NumberXC6SLX100
- Operating Supply Voltage1.2V
- Number of I/O480
- RAM Size603kB
- Number of Logic Elements/Cells101261
- Total RAM Bits4939776
- Number of LABs/CLBs7911
- Number of Logic Blocks (LABs)7911
- Speed Grade2
- Number of Registers126576
- RoHS StatusROHS3 Compliant
XC6SLX100-2FGG676C Overview
This particular component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is a 676-BGA package with 676 pins and is also known as a 676-FBGA (27x27) by the supplier. The packaging for this part is a tray and it has a Moisture Sensitivity Level (MSL) of 3, which means it can withstand 168 hours of exposure to moisture. The maximum operating temperature for this chip is 85°C and it requires a voltage supply of 1.14V~1.26V. Its base part number is XC6SLX100 and it has a total of 480 I/O (input/output) connections. The number of logic elements or cells in this component is 101261.
XC6SLX100-2FGG676C Features
480 I/Os
Up to 4939776 RAM bits
676 LABs/CLBs
85°C gates
7911 logic blocks (LABs)
126576 registers
XC6SLX100-2FGG676C Applications
There are a lot of Xilinx Inc. XC6SLX100-2FGG676C FPGAs applications.
Voice recognition
Server Applications
Device controllers
Automotive advanced driver assistance systems (ADAS)
Random logic
ADAS
Automotive driver's assistance
High Performance Computing
Video & Image Processing
Industrial IoT
This particular component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is a 676-BGA package with 676 pins and is also known as a 676-FBGA (27x27) by the supplier. The packaging for this part is a tray and it has a Moisture Sensitivity Level (MSL) of 3, which means it can withstand 168 hours of exposure to moisture. The maximum operating temperature for this chip is 85°C and it requires a voltage supply of 1.14V~1.26V. Its base part number is XC6SLX100 and it has a total of 480 I/O (input/output) connections. The number of logic elements or cells in this component is 101261.
XC6SLX100-2FGG676C Features
480 I/Os
Up to 4939776 RAM bits
676 LABs/CLBs
85°C gates
7911 logic blocks (LABs)
126576 registers
XC6SLX100-2FGG676C Applications
There are a lot of Xilinx Inc. XC6SLX100-2FGG676C FPGAs applications.
Voice recognition
Server Applications
Device controllers
Automotive advanced driver assistance systems (ADAS)
Random logic
ADAS
Automotive driver's assistance
High Performance Computing
Video & Image Processing
Industrial IoT
XC6SLX100-2FGG676C More Descriptions
Field Programmable Gate Array, 7911 CLBs, 667MHz, 101261-Cell, CMOS, PBGA676
IC FPGA 480 I/O 676FBGA
IC FPGA 480 I/O 676FBGA
The three parts on the right have similar specifications to XC6SLX100-2FGG676C.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureVoltage - SupplyBase Part NumberOperating Supply VoltageNumber of I/ORAM SizeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsNumber of Logic Blocks (LABs)Speed GradeNumber of RegistersRoHS StatusJESD-609 CodePbfree CodeNumber of TerminationsECCN CodeTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Pin CountNumber of OutputsQualification StatusPower SuppliesProgrammable Logic TypeCombinatorial Delay of a CLB-MaxNumber of CLBsHeight Seated (Max)LengthWidthReach Compliance CodeTime@Peak Reflow Temperature-Max (s)Clock FrequencySurface MountJESD-30 CodeNumber of InputsView Compare
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XC6SLX100-2FGG676C10 WeeksSurface MountSurface Mount676-BGA676676-FBGA (27x27)0°C~85°C TJTray2008Spartan®-6 LXActive3 (168 Hours)85°C0°C1.14V~1.26VXC6SLX1001.2V480603kB1012614939776791179112126576ROHS3 Compliant-------------------------------
-
10 WeeksSurface MountSurface Mount256-LBGA256-0°C~85°C TJTray2008Spartan®-6 LXActive3 (168 Hours)--1.14V~1.26VXC6SLX91V18672kB9152589824715--11440ROHS3 Compliante1yes256EAR99Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL2601V1mm30256186Not Qualified12.5/3.3VFIELD PROGRAMMABLE GATE ARRAY0.46 ns7151.55mm17mm17mm------
-
10 WeeksSurface MountSurface Mount256-LBGA256-0°C~85°C TJTray2008Spartan®-6 LXActive3 (168 Hours)--1.14V~1.26VXC6SLX161.2V18672kB145795898241139-218224Non-RoHS Compliante0no256EAR99Tin/Lead (Sn63Pb37)-Field Programmable Gate ArraysCMOSBOTTOMBALL2401.2V1mm-256186Not Qualified-FIELD PROGRAMMABLE GATE ARRAY--1.55mm17mm17mmnot_compliant30667MHz---
-
--Surface Mount484-BBGA--0°C~85°C TJTray2008Spartan®-6 LXTObsolete3 (168 Hours)--1.14V~1.26VXC6SLX150-296-147443493977611519---Non-RoHS Compliante0-4843A991.DTin/Lead (Sn63Pb37)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALL2251.2V1mm--296Not Qualified1.21.2/3.32.5/3.3VFIELD PROGRAMMABLE GATE ARRAY0.26 ns-2.6mm23mm23mm-30806MHzYESS-PBGA-B484296
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