NXP USA Inc. XC56309VF100AR2

XC56309VF100AR2 Overview
The surface mount technology has been widely adopted in the electronics industry due to its compact size and efficient assembly process. Our product features a surface mount mount, providing ease of installation and space-saving benefits. It is packaged in tape and reel, ensuring convenient handling and storage. The terminal finish is tin/lead/silver (Sn/Pb/Ag), offering excellent solderability and conductivity. With a maximum operating temperature of 105°C, it can withstand high temperature environments. The product is classified under HTS code 8542.31.00.01, making it eligible for international trade. It has a peak reflow temperature of 220°C and a reflow time of 30 seconds, ensuring reliable and consistent soldering. Operating at a supply voltage of 3.3V, it is suitable for a wide range of applications. The data bus width is 24b, providing efficient data transfer. Furthermore, our product is RoHS compliant, meeting the strict environmental standards.

XC56309VF100AR2 Features
Supplied in the MAPBGA package
Operating supply voltage of 3.3V
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics

XC56309VF100AR2 Applications
There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) XC56309VF100AR2 DSP applications.

Radar
Speech processing and recognition
Sonar
Other sensor array processing
Dam design
Automobiles
Telephone conversations
Streaming music
Infrared
Seismology