XC4VLX25-10FFG668C

Xilinx Inc. XC4VLX25-10FFG668C

Part Number:
XC4VLX25-10FFG668C
Manufacturer:
Xilinx Inc.
Ventron No:
3129113-XC4VLX25-10FFG668C
Description:
IC FPGA 448 I/O 668FCBGA
ECAD Model:
Datasheet:
XC4VLX25-10FFG668C

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Specifications
Xilinx Inc. XC4VLX25-10FFG668C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VLX25-10FFG668C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    668-BBGA, FCBGA
  • Number of Pins
    668
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    1998
  • Series
    Virtex®-4 LX
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    668
  • Termination
    SMD/SMT
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Frequency
    400MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC4VLX25
  • Pin Count
    668
  • Number of Outputs
    448
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    448
  • RAM Size
    162kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    24192
  • Total RAM Bits
    1327104
  • Number of LABs/CLBs
    2688
  • Speed Grade
    10
  • Height Seated (Max)
    2.85mm
  • Length
    27mm
  • Width
    27mm
  • REACH SVHC
    Unknown
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
XC4VLX25-10FFG668C Overview
This product is packaged in a tray and has a Moisture Sensitivity Level (MSL) of 4, which means it can be exposed to moisture for up to 72 hours. It falls under ECCN Code 3A991.D and has a HTS Code of 8542.39.00.01. The technology used is CMOS and the peak reflow temperature is 245 degrees Celsius. The base part number is XC4VLX25 and it has 448 I/Os. The maximum seated height is 2.85mm and it is compliant with ROHS3 regulations.

XC4VLX25-10FFG668C Features
448 I/Os
Up to 1327104 RAM bits
668 LABs/CLBs
Operating from a frequency of 400MHz

XC4VLX25-10FFG668C Applications
There are a lot of Xilinx Inc. XC4VLX25-10FFG668C FPGAs applications.

Medical Applications
Device controllers
Software-defined radios
Medical ultrasounds
Ecosystem
Automotive Applications
Broadcast
Radar and Sensors
Military Temperature
Electronic Warfare
XC4VLX25-10FFG668C More Descriptions
FPGA Virtex-4 LX Family 24192 Cells 90nm (CMOS) Technology 1.2V 668-Pin FCBGA
448 21492 2688 FPGA BGA-668 Programmable Logic Device (CPLDs/FPGAs) ROHS
Field Programmable Gate Array, 2688 CLBs, 1028MHz, 24192-Cell, CMOS, PBGA676
FPGA, VIRTEX-4, 24K CELLS, 668FCBGA; No. of Macrocells:24192; Operating Temperature Range:0°C to 85°C; No. of Pins:668; SVHC:No SVHC (18-Jun-2010); Package / Case:FBGA; Logic IC Base Number:4VLX25; Logic IC Function:FPGA; Supply Voltage Max:1.26V; Supply Voltage Min:1.14V; Termination Type:SMD; Frequency:400MHz; I/O Output Drive:3.3V, 2.5V, 1.8V, 1.5V; No. of I/O Lines:448; Programmable Logic Type:FPGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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