XC4VFX60-11FFG1152C

Xilinx Inc. XC4VFX60-11FFG1152C

Part Number:
XC4VFX60-11FFG1152C
Manufacturer:
Xilinx Inc.
Ventron No:
3135711-XC4VFX60-11FFG1152C
Description:
IC FPGA 576 I/O 1152FCBGA
ECAD Model:
Datasheet:
XC4VFX60-11FFG1152C

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Specifications
Xilinx Inc. XC4VFX60-11FFG1152C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VFX60-11FFG1152C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    1152-BBGA, FCBGA
  • Number of Pins
    1152
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Virtex®-4 FX
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC4VFX60
  • Number of Outputs
    576
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    576
  • RAM Size
    522kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    56880
  • Total RAM Bits
    4276224
  • Number of LABs/CLBs
    6320
  • Speed Grade
    11
  • Height Seated (Max)
    3.4mm
  • Length
    35mm
  • Width
    35mm
  • RoHS Status
    ROHS3 Compliant
Description
XC4VFX60-11FFG1152C Overview
Xilinx Inc. is a well-known brand in the field of electronic components, particularly for their Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and can be programmed and reprogrammed to perform a variety of functions, making them a popular choice in the technology industry. The Xilinx Inc. chip in question belongs to the Embedded - FPGAs (Field Programmable Gate Array) category, indicating its specialized use in embedded systems. One of the key specifications of this chip is its number of pins, which is 1152. This parameter is crucial as it determines the number of connections that can be made to the chip, allowing for a greater degree of customization and functionality. Additionally, the terminal finish of the chip is Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5), which ensures a strong and reliable connection between the chip and other components. In terms of compliance, the HTS Code for this chip is 8542.39.00.01, which is used to classify electronic components for import and export purposes. This code ensures that the chip meets all necessary regulations and standards. The terminal position of the chip is at the bottom, indicating its placement on a circuit board. The chip has a peak reflow temperature of 245 degrees Celsius, which is the maximum temperature it can withstand during the soldering process. This parameter is essential in ensuring the chip's durability and reliability. The terminal pitch of the chip is 1mm, which refers to the distance between each pin. A smaller pitch allows for more connections and a higher degree of complexity in the chip's design. It is worth noting that this particular chip is not yet qualified, meaning it has not undergone the necessary testing and certification processes. However, given Xilinx Inc.'s reputation for producing high-quality components, it is likely that this chip will meet all necessary qualifications once tested. Finally, the programmable logic type of this chip is FIELD PROGRAMMABLE GATE ARRAY, which indicates its ability to be programmed and reprogrammed to perform various functions. This flexibility makes it a popular choice for applications that require frequent updates and modifications. The height seated (max) of the chip is 3.4mm, which is the maximum height it can occupy on a circuit board. This parameter is important in ensuring that the chip fits within the designated space and does not interfere with other components. Overall, the Xilinx Inc. chip offers a range of parameters that make it a versatile and reliable choice for embedded systems.

XC4VFX60-11FFG1152C Features
576 I/Os
Up to 4276224 RAM bits
1152 LABs/CLBs

XC4VFX60-11FFG1152C Applications
There are a lot of Xilinx Inc. XC4VFX60-11FFG1152C FPGAs applications.

DO-254
Broadcast
Automotive advanced driver assistance systems (ADAS)
Aircraft navigation
Automotive Applications
Artificial intelligence (AI)
Secure Communication
Software-defined radios
Industrial Ethernet
Digital signal processing
XC4VFX60-11FFG1152C More Descriptions
FPGA Virtex-4 FX Family 56880 Cells 90nm (CMOS) Technology 1.2V 1152-Pin FC-BGA
Field Programmable Gate Array, 6320 CLBs, 1181MHz, 56880-Cell, CMOS, PBGA672
Product Description Demo for Development.
XC4VFX60-11FFG1152C ROHS COMPLIANT: YES
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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