XC4VFX12-12FFG668C

Xilinx Inc. XC4VFX12-12FFG668C

Part Number:
XC4VFX12-12FFG668C
Manufacturer:
Xilinx Inc.
Ventron No:
3635539-XC4VFX12-12FFG668C
Description:
IC FPGA 320 I/O 668FCBGA
ECAD Model:
Datasheet:
XC4VFX12-12FFG668C

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Specifications
Xilinx Inc. XC4VFX12-12FFG668C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VFX12-12FFG668C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    668-BBGA, FCBGA
  • Number of Pins
    668
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Virtex®-4 FX
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    668
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC4VFX12
  • Pin Count
    668
  • Number of Outputs
    320
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    320
  • RAM Size
    81kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    12312
  • Total RAM Bits
    663552
  • Number of LABs/CLBs
    1368
  • Speed Grade
    12
  • Height Seated (Max)
    2.85mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    ROHS3 Compliant
Description
XC4VFX12-12FFG668C Overview
The Embedded - FPGAs chip produced by Xilinx Inc. has a number of 668 pins and is packaged in a tray. Its JESD-609 Code is e1 and it is Pbfree. The Moisture Sensitivity Level (MSL) is 4 (72 Hours). Its Terminal Finish is Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) and its Terminal Position is BOTTOM. The Peak Reflow Temperature (Cel) is 245 and its Length is 27mm. This chip is also ROHS3 Compliant.

XC4VFX12-12FFG668C Features
320 I/Os
Up to 663552 RAM bits
668 LABs/CLBs

XC4VFX12-12FFG668C Applications
There are a lot of Xilinx Inc. XC4VFX12-12FFG668C FPGAs applications.

Medical ultrasounds
Broadcast
Industrial IoT
Artificial intelligence (AI)
DO-254
Server Applications
Integrating multiple SPLDs
Distributed Monetary Systems
Security systems
Medical Electronics
XC4VFX12-12FFG668C More Descriptions
FPGA Virtex-4 FX Family 12312 Cells 90nm (CMOS) Technology 1.2V 668-Pin FCBGA
Field Programmable Gate Array, 1181MHz, 12312-Cell, CMOS, PBGA363
IC FPGA 320 I/O 668FCBGA
Contact for details
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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