Xilinx Inc. XC4062XL-09BG432C
- Part Number:
- XC4062XL-09BG432C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3132329-XC4062XL-09BG432C
- Description:
- IC FPGA 352 I/O 432MBGA
- Datasheet:
- XC4062XL-09BG432C
Xilinx Inc. XC4062XL-09BG432C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4062XL-09BG432C.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case432-LBGA Exposed Pad, Metal
- Number of Pins432
- Supplier Device Package432-MBGA (40x40)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- SeriesXC4000E/X
- Published1999
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Voltage - Supply3V~3.6V
- Base Part NumberXC4062XL
- Operating Supply Voltage3.3V
- Number of I/O352
- RAM Size9kB
- Number of Logic Elements/Cells5472
- Total RAM Bits73728
- Number of Gates62000
- Number of LABs/CLBs2304
- Number of Logic Blocks (LABs)2304
- Speed Grade9
- Number of Registers5376
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC4062XL-09BG432C Overview
The package that contains this software is called 432-LBGA Exposed Pad, Metal. There are 352 I/Os for better data transfer. In order to construct a fundamental building block, 5472 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 3V~3.6V battery. There are many types of FPGAs in the XC4000E/X series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 73728. If you are looking for related parts, you can use the base part number XC4062XL as a starting point. For the program to work properly, the RAM si9kBe of this FPGA module must reach 9kB GB in order to ensure normal operation. In this case, 432 pins are used in the design. 2304 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 3.3V supply voltage. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 62000 gates. There are 2304 logic blocks (LABs) in the system, which form its basic building blocks. In order to store and transfer data, a total of 5376 registers are used. The supplier of the device package is 432-MBGA (40x40).
XC4062XL-09BG432C Features
352 I/Os
Up to 73728 RAM bits
432 LABs/CLBs
85°C gates
2304 logic blocks (LABs)
5376 registers
XC4062XL-09BG432C Applications
There are a lot of Xilinx Inc.
XC4062XL-09BG432C FPGAs applications.
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
The package that contains this software is called 432-LBGA Exposed Pad, Metal. There are 352 I/Os for better data transfer. In order to construct a fundamental building block, 5472 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 3V~3.6V battery. There are many types of FPGAs in the XC4000E/X series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 73728. If you are looking for related parts, you can use the base part number XC4062XL as a starting point. For the program to work properly, the RAM si9kBe of this FPGA module must reach 9kB GB in order to ensure normal operation. In this case, 432 pins are used in the design. 2304 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 3.3V supply voltage. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 62000 gates. There are 2304 logic blocks (LABs) in the system, which form its basic building blocks. In order to store and transfer data, a total of 5376 registers are used. The supplier of the device package is 432-MBGA (40x40).
XC4062XL-09BG432C Features
352 I/Os
Up to 73728 RAM bits
432 LABs/CLBs
85°C gates
2304 logic blocks (LABs)
5376 registers
XC4062XL-09BG432C Applications
There are a lot of Xilinx Inc.
XC4062XL-09BG432C FPGAs applications.
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
XC4062XL-09BG432C More Descriptions
FPGA XC4000X Family 62K Gates 5472 Cells 217MHz 0.35um Technology 3.3V 432-Pin BGA
Field Programmable Gate Array, 2304 CLBs, 40000 Gates, 217MHz, CMOS, PBGA432
Contains Lead 1999 Non-RoHS Compliant Obsolete field programmable gate array 0C~85C TJ 9kB 3.3V
FPGA, 2304 CLBS, 40000 GATES, 21
French Electronic Distributor since 1988
Field Programmable Gate Array, 2304 CLBs, 40000 Gates, 217MHz, CMOS, PBGA432
Contains Lead 1999 Non-RoHS Compliant Obsolete field programmable gate array 0C~85C TJ 9kB 3.3V
FPGA, 2304 CLBS, 40000 GATES, 21
French Electronic Distributor since 1988
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