XC4062XL-09BG432C

Xilinx Inc. XC4062XL-09BG432C

Part Number:
XC4062XL-09BG432C
Manufacturer:
Xilinx Inc.
Ventron No:
3132329-XC4062XL-09BG432C
Description:
IC FPGA 352 I/O 432MBGA
ECAD Model:
Datasheet:
XC4062XL-09BG432C

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Specifications
Xilinx Inc. XC4062XL-09BG432C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4062XL-09BG432C.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    432-LBGA Exposed Pad, Metal
  • Number of Pins
    432
  • Supplier Device Package
    432-MBGA (40x40)
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Series
    XC4000E/X
  • Published
    1999
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    0°C
  • Voltage - Supply
    3V~3.6V
  • Base Part Number
    XC4062XL
  • Operating Supply Voltage
    3.3V
  • Number of I/O
    352
  • RAM Size
    9kB
  • Number of Logic Elements/Cells
    5472
  • Total RAM Bits
    73728
  • Number of Gates
    62000
  • Number of LABs/CLBs
    2304
  • Number of Logic Blocks (LABs)
    2304
  • Speed Grade
    9
  • Number of Registers
    5376
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Contains Lead
Description
XC4062XL-09BG432C Overview
The package that contains this software is called 432-LBGA Exposed Pad, Metal. There are 352 I/Os for better data transfer. In order to construct a fundamental building block, 5472 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 3V~3.6V battery. There are many types of FPGAs in the XC4000E/X series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 73728. If you are looking for related parts, you can use the base part number XC4062XL as a starting point. For the program to work properly, the RAM si9kBe of this FPGA module must reach 9kB GB in order to ensure normal operation. In this case, 432 pins are used in the design. 2304 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 3.3V supply voltage. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 62000 gates. There are 2304 logic blocks (LABs) in the system, which form its basic building blocks. In order to store and transfer data, a total of 5376 registers are used. The supplier of the device package is 432-MBGA (40x40).

XC4062XL-09BG432C Features
352 I/Os
Up to 73728 RAM bits
432 LABs/CLBs
85°C gates
2304 logic blocks (LABs)
5376 registers


XC4062XL-09BG432C Applications
There are a lot of Xilinx Inc.
XC4062XL-09BG432C FPGAs applications.


Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
XC4062XL-09BG432C More Descriptions
FPGA XC4000X Family 62K Gates 5472 Cells 217MHz 0.35um Technology 3.3V 432-Pin BGA
Field Programmable Gate Array, 2304 CLBs, 40000 Gates, 217MHz, CMOS, PBGA432
Contains Lead 1999 Non-RoHS Compliant Obsolete field programmable gate array 0C~85C TJ 9kB 3.3V
FPGA, 2304 CLBS, 40000 GATES, 21
French Electronic Distributor since 1988
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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