Xilinx Inc. XC4013E-3PQ160I
- Part Number:
- XC4013E-3PQ160I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3644754-XC4013E-3PQ160I
- Description:
- IC FPGA 129 I/O 160QFP
- Datasheet:
- XC4013E-3PQ160I
Xilinx Inc. XC4013E-3PQ160I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4013E-3PQ160I.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case160-BQFP
- Number of Pins160
- Supplier Device Package160-PQFP (28x28)
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesXC4000E/X
- Published1999
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature100°C
- Min Operating Temperature-40°C
- Voltage - Supply4.5V~5.5V
- Base Part NumberXC4013E
- Number of I/O129
- RAM Size2.3kB
- Number of Logic Elements/Cells1368
- Total RAM Bits18432
- Number of Gates13000
- Number of LABs/CLBs576
- Number of Logic Blocks (LABs)576
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC4013E-3PQ160I Overview
This package is included in the 160-BQFP package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 4.5V~5.5V . An FPGA belonging to the XC4000E/X series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 18432 RAM bits in terms of its RAM si18432e. Parts related to this part can be found using its base part number XC4013E. During the configuration of this FPGA module, the RAM si2.3kBe reaches 2.3kB to ensure that the program runs normally. The device is designed with 160 pins in total. An array of 576 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 13000 gates as fpga semiconductors basic building block. In its basic building block, it is composed of 576 logic blocks (LABs), which are called building blocks. Device package 160-PQFP (28x28) is provided by its supplier.
XC4013E-3PQ160I Features
129 I/Os
Up to 18432 RAM bits
160 LABs/CLBs
100°C gates
576 logic blocks (LABs)
XC4013E-3PQ160I Applications
There are a lot of Xilinx Inc.
XC4013E-3PQ160I FPGAs applications.
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
This package is included in the 160-BQFP package and is available for purchase. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 4.5V~5.5V . An FPGA belonging to the XC4000E/X series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. Using the Tray layout, this FPGA model can be contained in a very small amount of space. This device is equipped with 18432 RAM bits in terms of its RAM si18432e. Parts related to this part can be found using its base part number XC4013E. During the configuration of this FPGA module, the RAM si2.3kBe reaches 2.3kB to ensure that the program runs normally. The device is designed with 160 pins in total. An array of 576 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 13000 gates as fpga semiconductors basic building block. In its basic building block, it is composed of 576 logic blocks (LABs), which are called building blocks. Device package 160-PQFP (28x28) is provided by its supplier.
XC4013E-3PQ160I Features
129 I/Os
Up to 18432 RAM bits
160 LABs/CLBs
100°C gates
576 logic blocks (LABs)
XC4013E-3PQ160I Applications
There are a lot of Xilinx Inc.
XC4013E-3PQ160I FPGAs applications.
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
XC4013E-3PQ160I More Descriptions
Field Programmable Gate Array, 576 CLBs, 10000 Gates, 125MHz, CMOS, PQFP160
IC FPGA 129 I/O 160PQFP
IC FPGA 192 I/O 223CPGA
Contact for details
IC FPGA 129 I/O 160PQFP
IC FPGA 192 I/O 223CPGA
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