Xilinx Inc. XC3S250E-5CP132C

XC3S250E-5CP132C Overview
Fpga chips is supplied in the BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. There are 85 outputs incorporated in this device. Fpga chips is designed wFpga chipsh 132 terminations. The RAM si27kBe of this FPGA module reaches 27kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 132 pins. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. The maximal operating temperature of this module reaches 85°C. The operating temperature should be higher than 0°C. Fpga semiconductor is equipped wfpga semiconductorh 132 pin count. There are 4896 registers used to store and transfer data. 612 CLBs are basic modules used for its architecture.

XC3S250E-5CP132C Features
132 LABs/CLBs
85°C gates
4896 registers


XC3S250E-5CP132C Applications
There are a lot of Xilinx
XC3S250E-5CP132C FPGAs applications.


Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition