XC3S2000-4FGG676C

Xilinx Inc. XC3S2000-4FGG676C

Part Number:
XC3S2000-4FGG676C
Manufacturer:
Xilinx Inc.
Ventron No:
3126963-XC3S2000-4FGG676C
Description:
IC FPGA 489 I/O 676FBGA
ECAD Model:
Datasheet:
XC3S2000-4FGG676C

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Specifications
Xilinx Inc. XC3S2000-4FGG676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S2000-4FGG676C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    676-BGA
  • Number of Pins
    676
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Spartan®-3
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • ECCN Code
    3A991.D
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC3S2000
  • Pin Count
    676
  • Number of Outputs
    489
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Power Supplies
    1.21.2/3.32.5V
  • Number of I/O
    489
  • RAM Size
    90kB
  • Clock Frequency
    630MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    46080
  • Total RAM Bits
    737280
  • Number of Gates
    2000000
  • Number of LABs/CLBs
    5120
  • Speed Grade
    4
  • Combinatorial Delay of a CLB-Max
    0.61 ns
  • Height Seated (Max)
    2.6mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    ROHS3 Compliant
Description
XC3S2000-4FGG676C Overview
The mounting type for this electronic component is surface mount, meaning it can be easily attached to a circuit board without the need for through-hole soldering. The package or case for this component is 676-BGA, which refers to the type of packaging used to protect and house the internal components. This component is also labeled as Pbfree, indicating that it does not contain any lead, making it safer for the environment. Its moisture sensitivity level is 3, which means it can withstand exposure to moisture for up to 168 hours. With 676 terminations, this component has a large number of connection points. It is built using CMOS technology and operates at a supply voltage of 1.2V. With 489 input/output connections and a clock frequency of 630MHz, this component is capable of handling complex tasks. It is also compliant with the RoHS3 standard, ensuring that it meets strict environmental regulations.

XC3S2000-4FGG676C Features
489 I/Os
Up to 737280 RAM bits
676 LABs/CLBs

XC3S2000-4FGG676C Applications
There are a lot of Xilinx Inc. XC3S2000-4FGG676C FPGAs applications.

Broadcast
Medical imaging
Integrating multiple SPLDs
Enterprise networking
Audio
Space Applications
Server Applications
Telecommunication
Solar Energy
Bioinformatics
XC3S2000-4FGG676C More Descriptions
FPGA Spartan-3 Family 2M Gates 46080 Cells 630MHz 90nm Technology 1.2V 676-Pin FBGA
Field Programmable Gate Array, 5120 CLBs, 2000000 Gates, 630MHz, 46080-Cell, CMOS, PBGA676
Audio Amp Headphone/Speaker 1-CH Mono/2-CH Stereo 1W Class-AB 10-Pin HVSSOP EP Tube
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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