Xilinx Inc. XC3S2000-4FG456C

XC3S2000-4FG456C Overview
The package that contains this software is called 456-BBGA. There are 333 I/Os for better data transfer. In order to construct a fundamental building block, 46080 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. There are many types of FPGAs in the Spartan®-3 series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. Fpga chips is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. As far as the RAM bits are concerned, this device offers you a total of 737280. For the program to work properly, the RAM si90kBe of this FPGA module must reach 90kB GB in order to ensure normal operation. 5120 LABs/CLBs are configured on this FPGA. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. When this module is operated at its maximum operating temperature, it reaches 85°C. A higher operating temperature than 0°C is recommended. As a basic building block, fpga semiconductor consists of 2000000 gates. The supplier of the device package is 456-FBGA (23x23).

XC3S2000-4FG456C Features
333 I/Os
Up to 737280 RAM bits
85°C gates


XC3S2000-4FG456C Applications
There are a lot of Xilinx Inc.
XC3S2000-4FG456C FPGAs applications.


Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics