Xilinx Inc. XC3S1200E-4FT256I
- Part Number:
- XC3S1200E-4FT256I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3633140-XC3S1200E-4FT256I
- Description:
- IC FPGA 190 I/O 256FTBGA
- Datasheet:
- XC3S1200E-4FT256I
Xilinx Inc. XC3S1200E-4FT256I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S1200E-4FT256I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-LBGA
- Number of Pins256
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesSpartan®-3E
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)240
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC3S1200E
- Number of Outputs150
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.32.5V
- Number of I/O190
- RAM Size63kB
- Clock Frequency572MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells19512
- Total RAM Bits516096
- Number of Gates1200000
- Number of LABs/CLBs2168
- Speed Grade4
- Number of Registers17344
- Combinatorial Delay of a CLB-Max0.76 ns
- Height Seated (Max)1.55mm
- Length17mm
- Width17mm
- RoHS StatusNon-RoHS Compliant
XC3S1200E-4FT256I Overview
In the 256-LBGA package, you will find fpga chips. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 190 I/Os are programmed to ensure a more coherent data transfer. In order to construct a fundamental building block, 19512 logic elements/cells are required. In order to operate fpga chips, a voltage supply of 1.2V volts is required. An FPGA part from the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 1.14V~1.26V . FPGAs belonging to the Spartan?-3E series are a type of FPGA that belong to the Spartan?-3E series of FPGAs. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. This device is equipped with 150 separate outputs, which makes it a very versatile device. Using the Tray layout, this FPGA model can be contained in a very small amount of space. There are a total of 256 terminations. This device has 516096 RAM bits, which is the number of RAM bits that this device offers. For related parts, use its base part number XC3S1200E. The FPGA module's RAM si63kBe reaches 63kB in order to ensure that the program operates in a normal manner. In this case, 256 pins are used in the design. An array of 2168 LABs/CLBs is built into the FPGA. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. There is a 1.21.2/3.32.5V power supply that is required to operate it. 1200000 gates make up the basic block of its construction. Typically, it uses a crystal oscillating at 572MHz in order to operate. A total of 17344 registers are used for storing and transferring data between them.
XC3S1200E-4FT256I Features
190 I/Os
Up to 516096 RAM bits
256 LABs/CLBs
17344 registers
XC3S1200E-4FT256I Applications
There are a lot of Xilinx Inc. XC3S1200E-4FT256I FPGAs applications.
Device controllers
Military Temperature
Filtering and communication encoding
Computer hardware emulation
Voice recognition
Ecosystem
Artificial intelligence (AI)
DO-254
Software-defined radio
Aerospace and Defense
In the 256-LBGA package, you will find fpga chips. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 190 I/Os are programmed to ensure a more coherent data transfer. In order to construct a fundamental building block, 19512 logic elements/cells are required. In order to operate fpga chips, a voltage supply of 1.2V volts is required. An FPGA part from the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 1.14V~1.26V . FPGAs belonging to the Spartan?-3E series are a type of FPGA that belong to the Spartan?-3E series of FPGAs. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. This device is equipped with 150 separate outputs, which makes it a very versatile device. Using the Tray layout, this FPGA model can be contained in a very small amount of space. There are a total of 256 terminations. This device has 516096 RAM bits, which is the number of RAM bits that this device offers. For related parts, use its base part number XC3S1200E. The FPGA module's RAM si63kBe reaches 63kB in order to ensure that the program operates in a normal manner. In this case, 256 pins are used in the design. An array of 2168 LABs/CLBs is built into the FPGA. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. There is a 1.21.2/3.32.5V power supply that is required to operate it. 1200000 gates make up the basic block of its construction. Typically, it uses a crystal oscillating at 572MHz in order to operate. A total of 17344 registers are used for storing and transferring data between them.
XC3S1200E-4FT256I Features
190 I/Os
Up to 516096 RAM bits
256 LABs/CLBs
17344 registers
XC3S1200E-4FT256I Applications
There are a lot of Xilinx Inc. XC3S1200E-4FT256I FPGAs applications.
Device controllers
Military Temperature
Filtering and communication encoding
Computer hardware emulation
Voice recognition
Ecosystem
Artificial intelligence (AI)
DO-254
Software-defined radio
Aerospace and Defense
XC3S1200E-4FT256I More Descriptions
FPGA Spartan-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 2168 CLBs, 1200000 Gates, 572MHz, 19512-Cell, CMOS, PBGA256
FTBGA-256 Programmable Logic Device (CPLDs/FPGAs) ROHS
Xc3S1200E-4Ft256I Rohs Compliant: No |Amd Xilinx XC3S1200E-4FT256I
Field Programmable Gate Array, 2168 CLBs, 1200000 Gates, 572MHz, 19512-Cell, CMOS, PBGA256
FTBGA-256 Programmable Logic Device (CPLDs/FPGAs) ROHS
Xc3S1200E-4Ft256I Rohs Compliant: No |Amd Xilinx XC3S1200E-4FT256I
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