Xilinx Inc. XC3S1200E-4FGG400C

Name: XC3S1200E-4FGG400C
Brand: Xilinx Inc.
SKU: 3125843-XC3S1200E-4FGG400C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC3S1200E-4FGG400C

Manufacturer:: Xilinx Inc.

Ventron No:: 3125843-XC3S1200E-4FGG400C

Description:: IC FPGA 304 I/O 400FBGA

ECAD Model:

Datasheet:: XC3S1200E-4FGG400C

Specifications

Xilinx Inc. XC3S1200E-4FGG400C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S1200E-4FGG400C.

Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
400-BGA
Number of Pins
400
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2008
Series
Spartan®-3E
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
400
ECCN Code
3A991.D
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.2V
Frequency
572MHz
Reflow Temperature-Max (s)
30
Base Part Number
XC3S1200E
Pin Count
400
Number of Outputs
232
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Power Supplies
1.21.2/3.32.5V
Number of I/O
304
RAM Size
63kB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
19512
Total RAM Bits
516096
Number of Gates
1200000
Number of LABs/CLBs
2168
Speed Grade
4
Number of Registers
17344
Combinatorial Delay of a CLB-Max
0.76 ns
Height
1.73mm
Length
21mm
Width
21mm
REACH SVHC
Unknown
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free

Description

XC3S1200E-4FGG400C Overview
The specific brand of this component is Xilinx Inc., a company that specializes in the production of Embedded - FPGAs (Field Programmable Gate Array) chips. This particular chip falls under the category of Embedded - FPGAs (Field Programmable Gate Array). It is designed in a 400-BGA package/case and has a JESD-609 code of e1. The voltage supply for this chip ranges from 1.14V to 1.26V. The maximum temperature for reflow is 30 seconds. The type of programmable logic used in this chip is FIELD PROGRAMMABLE GATE ARRAY. It has a total of 19512 logic elements/cells and a speed grade of 4. Additionally, it contains 17344 registers. The dimensions of this chip are 1.73mm in height and 21mm in width.

XC3S1200E-4FGG400C Features
304 I/Os
Up to 516096 RAM bits
400 LABs/CLBs
17344 registers
Operating from a frequency of 572MHz

XC3S1200E-4FGG400C Applications
There are a lot of Xilinx Inc. XC3S1200E-4FGG400C FPGAs applications.

Random logic
OpenCL
Image processing
Ecosystem
Industrial IoT
Camera time adjustments
Voice recognition
Space Applications
Solar Energy
Aircraft navigation

XC3S1200E-4FGG400C More Descriptions

FPGA Spartan-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 400-Pin F-BGA
Field Programmable Gate Array, 2168 CLBs, 1200000 Gates, 572MHz, 19512-Cell, CMOS, PBGA256
XILINX XC3S1200E-4FGG400C FPGA, SPARTAN-3E, 19512CELLS, 400FBGA
PLD Logic; Programmable Logic Type:FPGA; Logic Type:FPGA; Logic Family:CMOS; Logic Base Number:3S1200; No. of I/O Pins:304; Frequency Max:311MHz; I/O Output Drive:12 mA; Supply Voltage Min:1.14V; Supply Voltage Max:1.26V ;RoHS Compliant: Yes
FPGA,SPARTAN-3E,19512CELLS, 400FBGA; Programmable Logic Type:FPGA; Logic IC Function:FPGA; Logic IC Family:CMOS; Logic IC Base Number:3S1200; No of I/O Lines:304; No. of Macrocells:19512; Frequency:572MHz; I/O Interface Standard:LVCMOS, LVTTL, HSTL, SSTL, True LVDS, RSDS, mini-L; Voltage, Supply Min:1.14V; Voltage, Supply Max:1.26V; Case Style:FBGA; Operating Temperature Range:0°C to 85°C; Base Number:3; No. of Pins:400; Temp, Op. Max:85°C; Temp, Op. Min:0°C; Termination Type:SMD

Certification