Winbond Electronics W9825G2JB-75
- Part Number:
- W9825G2JB-75
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3234137-W9825G2JB-75
- Description:
- IC SDRAM 256MBIT 133MHZ 90TFBGA
- Datasheet:
- W9825G2JB-75
Winbond Electronics W9825G2JB-75 technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W9825G2JB-75.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case90-TFBGA
- Number of Pins90
- Operating Temperature0°C~70°C TA
- PackagingTray
- Published2011
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations90
- ECCN CodeEAR99
- Additional FeatureAUTO/SELF REFRESH
- HTS Code8542.32.00.24
- TechnologySDRAM
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- Pin Count90
- Qualification StatusNot Qualified
- Operating Supply Voltage3.3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size256Mb 8M x 32
- Number of Ports1
- Nominal Supply Current140mA
- Memory TypeVolatile
- Operating ModeSYNCHRONOUS
- Clock Frequency133MHz
- Access Time5.4ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Organization8MX32
- Memory Width32
- Address Bus Width12b
- Density256 Mb
- Standby Current-Max0.004A
- I/O TypeCOMMON
- Refresh Cycles4096
- Sequential Burst Length1248FP
- Interleaved Burst Length1248
- Height Seated (Max)1.2mm
- Length13mm
- RoHS StatusROHS3 Compliant
W9825G2JB-75 Overview
The package or case of this particular electronic component is a 90-TFBGA, which stands for Thin Fine Pitch Ball Grid Array. It is designed to be compact and efficient, making it suitable for various applications. The operating temperature for this component ranges from 0°C to 70°C TA, ensuring its reliability in different environments. With a Moisture Sensitivity Level (MSL) of 3, this component can withstand exposure to moisture for up to 168 hours without any damage. Another notable feature is the AUTO/SELF REFRESH capability, which allows for efficient power management. While the qualification status of this component is currently Not Qualified, it operates in SYNCHRONOUS mode with a clock frequency of 133MHz. The memory width is 32 bits, and the address bus width is 12 bits, providing sufficient storage and accessibility. In addition, the sequential burst length is 1248FP, allowing for quick data transfer and processing.
W9825G2JB-75 Features
Package / Case: 90-TFBGA
90 Pins
Operating Supply Voltage:3.3V
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W9825G2JB-75 Applications
There are a lot of Winbond Electronics
W9825G2JB-75 Memory applications.
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
The package or case of this particular electronic component is a 90-TFBGA, which stands for Thin Fine Pitch Ball Grid Array. It is designed to be compact and efficient, making it suitable for various applications. The operating temperature for this component ranges from 0°C to 70°C TA, ensuring its reliability in different environments. With a Moisture Sensitivity Level (MSL) of 3, this component can withstand exposure to moisture for up to 168 hours without any damage. Another notable feature is the AUTO/SELF REFRESH capability, which allows for efficient power management. While the qualification status of this component is currently Not Qualified, it operates in SYNCHRONOUS mode with a clock frequency of 133MHz. The memory width is 32 bits, and the address bus width is 12 bits, providing sufficient storage and accessibility. In addition, the sequential burst length is 1248FP, allowing for quick data transfer and processing.
W9825G2JB-75 Features
Package / Case: 90-TFBGA
90 Pins
Operating Supply Voltage:3.3V
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
W9825G2JB-75 Applications
There are a lot of Winbond Electronics
W9825G2JB-75 Memory applications.
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
W9825G2JB-75 More Descriptions
DRAM Chip SDRAM 256M-Bit 8Mx32 3.3V 90-Pin TFBGA
IC DRAM 256MBIT PARALLEL 90TFBGA
IC SDRAM 256MBIT 133MHZ 90TFBGA
IC DRAM 256MBIT PARALLEL 90TFBGA
IC SDRAM 256MBIT 133MHZ 90TFBGA
The three parts on the right have similar specifications to W9825G2JB-75.
-
ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Pin CountQualification StatusOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeNumber of PortsNominal Supply CurrentMemory TypeOperating ModeClock FrequencyAccess TimeMemory FormatMemory InterfaceOrganizationMemory WidthAddress Bus WidthDensityStandby Current-MaxI/O TypeRefresh CyclesSequential Burst LengthInterleaved Burst LengthHeight Seated (Max)LengthRoHS StatusOutput CharacteristicsRadiation HardeningData Bus WidthSurface MountReflow Temperature-Max (s)JESD-30 CodePower SuppliesSupply Current-MaxMemory DensityWidthView Compare
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W9825G2JB-7510 WeeksSurface MountSurface Mount90-TFBGA900°C~70°C TATray2011Active3 (168 Hours)90EAR99AUTO/SELF REFRESH8542.32.00.24SDRAM2.7V~3.6VBOTTOMNOT SPECIFIED13.3V0.8mmNOT SPECIFIED90Not Qualified3.3V3.6V2.7V256Mb 8M x 321140mAVolatileSYNCHRONOUS133MHz5.4nsDRAMParallel8MX323212b256 Mb0.004ACOMMON40961248FP12481.2mm13mmROHS3 Compliant-----------
-
-Surface MountSurface Mount54-TSOP (0.400, 10.16mm Width)54-40°C~85°C TATray2010Obsolete3 (168 Hours)54EAR99AUTO/SELF REFRESH-SDRAM3V~3.6VDUAL-13.3V0.8mm-54-3.3V3.6V3V256Mb 16M x 16180mAVolatile-166MHz5nsDRAMParallel16MX161615b256 Mb0.002ACOMMON81921248FP12481.2mm22.22mmROHS3 Compliant3-STATENo--------
-
-Surface MountSurface Mount54-TSOP (0.400, 10.16mm Width)540°C~70°C TATray2008Obsolete3 (168 Hours)54EAR99AUTO/SELF REFRESH-SDRAM3V~3.6VDUAL-13.3V0.8mm-54-3.3V3.6V3V256Mb 16M x 161150mAVolatile-166MHz5nsDRAMParallel16MX161615b256 Mb0.002ACOMMON81921248FP12481.2mm22.22mmROHS3 Compliant3-STATENo16b-------
-
10 Weeks-Surface Mount54-TFBGA-0°C~70°C TATray2016Active3 (168 Hours)54EAR99AUTO/SELF REFRESH8542.32.00.24SDRAM3V~3.6VBOTTOMNOT SPECIFIED13.3V0.8mm-54Not Qualified-3.6V3V256Mb 16M x 161-VolatileSYNCHRONOUS166MHz5nsDRAMParallel16MX1616--0.002ACOMMON81921248FP12481.2mm8mmROHS3 Compliant3-STATE--YESNOT SPECIFIEDS-PBGA-B543.3V0.08mA268435456 bit8mm
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