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W25Q64FVSSIG

Winbond Electronics W25Q64FVSSIG

Part Number:
W25Q64FVSSIG
Manufacturer:
Winbond Electronics
Ventron No:
3717970-W25Q64FVSSIG
Description:
IC FLASH 64MBIT 104MHZ 8SOIC
ECAD Model:
Datasheet:
W25Q64FVSSIG

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Specifications
Winbond Electronics W25Q64FVSSIG technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25Q64FVSSIG.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    8-SOIC (0.209, 5.30mm Width)
  • Number of Pins
    8
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tube
  • Published
    2011
  • Series
    SpiFlash®
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Terminal Pitch
    1.27mm
  • Pin Count
    8
  • Supply Voltage-Max (Vsup)
    3.6V
  • Supply Voltage-Min (Vsup)
    3V
  • Interface
    SPI, Serial
  • Memory Size
    64Mb 8M x 8
  • Nominal Supply Current
    40mA
  • Memory Type
    Non-Volatile
  • Clock Frequency
    104MHz
  • Access Time
    8.5 ns
  • Memory Format
    FLASH
  • Memory Interface
    SPI - Quad I/O, QPI
  • Output Characteristics
    3-STATE
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    50μs, 3ms
  • Address Bus Width
    1b
  • Density
    64 Mb
  • Standby Current-Max
    0.00005A
  • Sync/Async
    Synchronous
  • Word Size
    8b
  • Serial Bus Type
    SPI
  • Data Retention Time-Min
    20
  • Write Protection
    HARDWARE/SOFTWARE
  • Alternate Memory Width
    1
  • Page Size
    256B
  • Height Seated (Max)
    2.16mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
W25Q64FVSSIG Overview
The manufacturer of this component is Winbond Electronics. It is a type of Memory chip, which falls under the Memory classification. It comes in a Tube packaging and is marked as Pbfree. It has 8 pins and requires a minimum supply voltage of 3V. The interface used for this chip is SPI, Serial. Its output characteristics are 3-STATE, and it has a memory width of 8 bits. It can be protected from writing through either hardware or software means. Each page of memory has a size of 256B. This chip is not designed to withstand radiation.

W25Q64FVSSIG Features
Package / Case: 8-SOIC (0.209, 5.30mm Width)
8 Pins

W25Q64FVSSIG Applications
There are a lot of Winbond Electronics W25Q64FVSSIG Memory applications.

supercomputers
hard disk drive (HDD)
DVD disk buffer
mainframes
graphics card
printers
servers
nonvolatile BIOS memory
telecommunications
multimedia computers
W25Q64FVSSIG More Descriptions
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 64M-bit 8M x 8 7ns 8-Pin SOIC
EAR99 Surface Mount Tube FLASH - NOR ic memory 104MHz 8.5ns 2.16mm 40mA
Product Description Demo for Development.
IC FLASH 64MBIT SPI/QUAD 8SOIC
French Electronic Distributor since 1988
IC, 64M-BIT SERIAL NOR FLASH MEMORY WITH
Product Comparison
The three parts on the right have similar specifications to W25Q64FVSSIG.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Terminal Pitch
    Pin Count
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Output Characteristics
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Sync/Async
    Word Size
    Serial Bus Type
    Data Retention Time-Min
    Write Protection
    Alternate Memory Width
    Page Size
    Height Seated (Max)
    Radiation Hardening
    RoHS Status
    Surface Mount
    HTS Code
    Supply Voltage
    Qualification Status
    Power Supplies
    Operating Mode
    Supply Current-Max
    Organization
    Memory Density
    Programming Voltage
    Endurance
    Length
    Width
    Factory Lead Time
    JESD-30 Code
    Parallel/Serial
    View Compare
  • W25Q64FVSSIG
    W25Q64FVSSIG
    Winbond Electronics
    Surface Mount
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    8
    -40°C~85°C TA
    Tube
    2011
    SpiFlash®
    e3
    yes
    Obsolete
    3 (168 Hours)
    8
    EAR99
    Matte Tin (Sn) - annealed
    FLASH - NOR
    2.7V~3.6V
    DUAL
    1
    1.27mm
    8
    3.6V
    3V
    SPI, Serial
    64Mb 8M x 8
    40mA
    Non-Volatile
    104MHz
    8.5 ns
    FLASH
    SPI - Quad I/O, QPI
    3-STATE
    8
    50μs, 3ms
    1b
    64 Mb
    0.00005A
    Synchronous
    8b
    SPI
    20
    HARDWARE/SOFTWARE
    1
    256B
    2.16mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • W25Q128FVCIG
    W25Q128FVCIG
    Winbond Electronics
    -
    Surface Mount
    24-TBGA
    24
    -40°C~85°C TA
    Tube
    2012
    SpiFlash®
    -
    -
    Discontinued
    3 (168 Hours)
    24
    3A991.B.1.A
    -
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    1
    1mm
    24
    3.6V
    2.7V
    SPI, Serial
    128Mb 16M x 8
    -
    Non-Volatile
    104MHz
    -
    FLASH
    SPI - Quad I/O, QPI
    -
    1
    50μs, 3ms
    -
    -
    0.00002A
    -
    -
    SPI
    20
    HARDWARE/SOFTWARE
    -
    -
    1.2mm
    -
    ROHS3 Compliant
    YES
    8542.32.00.51
    3V
    Not Qualified
    3/3.3V
    SYNCHRONOUS
    0.02mA
    128MX1
    134217728 bit
    3V
    100000 Write/Erase Cycles
    8mm
    6mm
    -
    -
    -
    W25Q64FVSSIG vs W25Q128FVCIG
  • W25Q128JVPIM TR
    W25Q128JVPIM TR
    Winbond Electronics
    -
    Surface Mount
    8-WDFN Exposed Pad
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    SpiFlash®
    -
    -
    Active
    3 (168 Hours)
    -
    -
    -
    FLASH - NOR
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    -
    128Mb 16M x 8
    -
    Non-Volatile
    133MHz
    -
    FLASH
    SPI - Quad I/O, QPI, DTR
    -
    -
    3ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    10 Weeks
    -
    -
    W25Q64FVSSIG vs W25Q128JVPIM TR
  • W25Q128FVEIP
    W25Q128FVEIP
    Winbond Electronics
    -
    Surface Mount
    8-WDFN Exposed Pad
    -
    -40°C~85°C TA
    Tube
    2012
    SpiFlash®
    -
    -
    Discontinued
    3 (168 Hours)
    8
    3A991.B.1.A
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    1
    1.27mm
    8
    3.6V
    2.7V
    -
    128Mb 16M x 8
    -
    Non-Volatile
    104MHz
    -
    FLASH
    SPI - Quad I/O, QPI
    -
    1
    50μs, 3ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    0.8mm
    -
    ROHS3 Compliant
    YES
    8542.32.00.51
    3V
    -
    -
    SYNCHRONOUS
    -
    128MX1
    134217728 bit
    3V
    -
    8mm
    6mm
    -
    R-PDSO-N8
    SERIAL
    W25Q64FVSSIG vs W25Q128FVEIP
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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