Winbond Electronics W25Q256JVCIM TR

W25Q256JVCIM TR Overview
The package or case for this particular product is a 24-TBGA, which stands for Thin Small Outline Package Ball Grid Array. It is a type of surface-mount packaging used for integrated circuits. The packaging is in the form of a Tape & Reel (TR), which is a method of packaging electronic components for automatic placement. The Moisture Sensitivity Level (MSL) for this product is 3, which means it can withstand 168 hours of exposure to moisture before it needs to be reconditioned. The technology used for this product is FLASH - NOR, which is a type of non-volatile memory that can retain stored data even when the power is turned off. The memory format is FLASH and the memory interface is SPI - Quad I/O, meaning it uses a serial peripheral interface with four input/output lines. The clock frequency for this product is 133MHz, and the write cycle time for a word or page is 3ms. Lastly, this product is also RoHS3 compliant, meaning it is free from certain hazardous substances.

W25Q256JVCIM TR Features
Package / Case: 24-TBGA


W25Q256JVCIM TR Applications
There are a lot of Winbond Electronics
W25Q256JVCIM TR Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,