Winbond Electronics W25Q256JVBIM
- Part Number:
- W25Q256JVBIM
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3719678-W25Q256JVBIM
- Description:
- IC FLASH 256MBIT 24TFBGA
- Datasheet:
- W25Q256JVBIM
Winbond Electronics W25Q256JVBIM technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25Q256JVBIM.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case24-TBGA
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTray
- SeriesSpiFlash®
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations24
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PBGA-B24
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size256Mb 32M x 8
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Clock Frequency133MHz
- Memory FormatFLASH
- Memory InterfaceSPI - Quad I/O
- Organization32MX8
- Memory Width8
- Write Cycle Time - Word, Page3ms
- Memory Density268435456 bit
- Parallel/SerialSERIAL
- Programming Voltage3V
- Height Seated (Max)1.2mm
- Length8mm
- Width6mm
- RoHS StatusROHS3 Compliant
W25Q256JVBIM Overview
This product is packaged in a 24-TBGA case and has an operating temperature range of -40°C to 85°C. It is also Pbfree, meaning it does not contain lead. The peak reflow temperature is not specified. The supply voltage is 3V and the terminal pitch is 1mm. This product follows the JESD-30 code of R-PBGA-B24 and has a memory interface of SPI - Quad I/O. It has an organization of 32MX8 and is compliant with ROHS3 regulations.
W25Q256JVBIM Features
Package / Case: 24-TBGA
W25Q256JVBIM Applications
There are a lot of Winbond Electronics
W25Q256JVBIM Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
This product is packaged in a 24-TBGA case and has an operating temperature range of -40°C to 85°C. It is also Pbfree, meaning it does not contain lead. The peak reflow temperature is not specified. The supply voltage is 3V and the terminal pitch is 1mm. This product follows the JESD-30 code of R-PBGA-B24 and has a memory interface of SPI - Quad I/O. It has an organization of 32MX8 and is compliant with ROHS3 regulations.
W25Q256JVBIM Features
Package / Case: 24-TBGA
W25Q256JVBIM Applications
There are a lot of Winbond Electronics
W25Q256JVBIM Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
W25Q256JVBIM More Descriptions
Active SERIAL BOTTOM Non-Volatile FLASH Memory -40C~85C TA 2.7V 268435456bit 6mm
TFBGA-24(6x8) NOR FLASH ROHS
IC FLSH 256MBIT SPI/QUAD 24TFBGA
TFBGA-24(6x8) NOR FLASH ROHS
IC FLSH 256MBIT SPI/QUAD 24TFBGA
The three parts on the right have similar specifications to W25Q256JVBIM.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeClock FrequencyMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageMemory DensityParallel/SerialProgramming VoltageHeight Seated (Max)LengthWidthRoHS StatusMountNumber of PinsPublishedECCN CodePin CountPower SuppliesInterfaceNominal Supply CurrentAccess TimeAddress Bus WidthDensityStandby Current-MaxSync/AsyncWord SizeSerial Bus TypeEnduranceData Retention Time-MinWrite ProtectionRadiation HardeningView Compare
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W25Q256JVBIM10 WeeksSurface Mount24-TBGAYES-40°C~85°C TATraySpiFlash®yesActive3 (168 Hours)24FLASH - NOR2.7V~3.6VBOTTOMNOT SPECIFIED13V1mmNOT SPECIFIEDR-PBGA-B243.6V2.7V256Mb 32M x 8Non-VolatileSYNCHRONOUS133MHzFLASHSPI - Quad I/O32MX883ms268435456 bitSERIAL3V1.2mm8mm6mmROHS3 Compliant--------------------
-
-Surface Mount8-WDFN Exposed Pad--40°C~85°C TATubeSpiFlash®-Discontinued3 (168 Hours)8FLASH - NOR2.7V~3.6VDUAL-13V1.27mm--3.6V2.7V128Mb 16M x 8Non-Volatile-104MHzFLASHSPI - Quad I/O, QPI-150μs, 3ms--3V---ROHS3 CompliantSurface Mount820163A991.B.1.A83/3.3VSPI, Serial20mA7 ns24b128 Mb0.00002ASynchronous8bSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARENo
-
10 WeeksSurface Mount8-WDFN Exposed Pad--40°C~85°C TATape & Reel (TR)SpiFlash®-Active3 (168 Hours)-FLASH - NOR2.7V~3.6V---------128Mb 16M x 8Non-Volatile-133MHzFLASHSPI - Quad I/O, QPI, DTR--3ms------ROHS3 Compliant-------------------
-
10 WeeksSurface Mount24-TBGA--40°C~85°C TATape & Reel (TR)SpiFlash®-Active3 (168 Hours)-FLASH - NOR2.7V~3.6V---------128Mb 16M x 8Non-Volatile-133MHzFLASHSPI - Quad I/O, QPI, DTR--3ms------ROHS3 Compliant-------------------
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