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W25Q256FVFIQ

Winbond Electronics W25Q256FVFIQ

Part Number:
W25Q256FVFIQ
Manufacturer:
Winbond Electronics
Ventron No:
3229567-W25Q256FVFIQ
Description:
IC FLASH 256MBIT 104MHZ 16SOIC
ECAD Model:
Datasheet:
W25Q256FVFIQ

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Specifications
Winbond Electronics W25Q256FVFIQ technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25Q256FVFIQ.
  • Factory Lead Time
    14 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    16-SOIC (0.295, 7.50mm Width)
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tube
  • Published
    2016
  • Series
    SpiFlash®
  • Part Status
    Discontinued
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    16
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1.27mm
  • JESD-30 Code
    R-PDSO-G16
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface
    SPI, Serial
  • Memory Size
    256Mb 32M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    104MHz
  • Supply Current-Max
    0.025mA
  • Memory Format
    FLASH
  • Memory Interface
    SPI - Quad I/O, QPI
  • Organization
    256MX1
  • Memory Width
    1
  • Write Cycle Time - Word, Page
    50μs, 3ms
  • Standby Current-Max
    0.000025A
  • Memory Density
    268435456 bit
  • Programming Voltage
    3V
  • Serial Bus Type
    SPI
  • Endurance
    100000 Write/Erase Cycles
  • Data Retention Time-Min
    20
  • Write Protection
    HARDWARE/SOFTWARE
  • Height Seated (Max)
    2.64mm
  • Length
    10.31mm
  • Width
    7.49mm
  • RoHS Status
    ROHS3 Compliant
Description
W25Q256FVFIQ Overview
This product features an operating temperature range of -40°C to 85°C, making it suitable for use in a wide range of environments. It is packaged in a tube for easy handling and storage. With 16 terminations and a dual terminal position, this product offers versatility in its application. It has 1 function and a supply voltage of 3V, meeting the needs of various electronic systems. The JESD-30 code for this product is R-PDSO-G16. The maximum supply voltage (Vsup) is 3.6V, ensuring stable and reliable performance. With a memory density of 268435456 bit, this product offers ample storage capacity. The programming voltage is 3V, providing efficient and accurate programming.

W25Q256FVFIQ Features
Package / Case: 16-SOIC (0.295, 7.50mm Width)


W25Q256FVFIQ Applications
There are a lot of Winbond Electronics
W25Q256FVFIQ Memory applications.


multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
W25Q256FVFIQ More Descriptions
IC FLASH 256M SPI 104MHZ 16SOIC / 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
R-PDSO-G16 Surface Mount Tube 256MX1 ic memory 104MHz 50mus 3ms 7.49mm 0.000025A
NOR Flash Serial-SPI 3.3V 256M-bit 32M x 8 8.5ns 16-Pin SOIC
SPI FLASH 512M bit WSON 8Pad 8*6mm 58nm Taping & Reel
IC FLASH 256MBIT SPI/QUAD 16SOIC
IC REGSTR BUFFER 28-56BIT 176BGA
Product Description Demo for Development.
Product Comparison
The three parts on the right have similar specifications to W25Q256FVFIQ.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Standby Current-Max
    Memory Density
    Programming Voltage
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Mount
    Number of Pins
    ECCN Code
    Pin Count
    Nominal Supply Current
    Access Time
    Address Bus Width
    Density
    Sync/Async
    Word Size
    Radiation Hardening
    HTS Code
    Parallel/Serial
    View Compare
  • W25Q256FVFIQ
    W25Q256FVFIQ
    Winbond Electronics
    14 Weeks
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    YES
    -40°C~85°C TA
    Tube
    2016
    SpiFlash®
    Discontinued
    3 (168 Hours)
    16
    FLASH - NOR
    2.7V~3.6V
    DUAL
    1
    3V
    1.27mm
    R-PDSO-G16
    Not Qualified
    3.6V
    3/3.3V
    2.7V
    SPI, Serial
    256Mb 32M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    0.025mA
    FLASH
    SPI - Quad I/O, QPI
    256MX1
    1
    50μs, 3ms
    0.000025A
    268435456 bit
    3V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    2.64mm
    10.31mm
    7.49mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • W25Q128FVEIG
    W25Q128FVEIG
    Winbond Electronics
    -
    Surface Mount
    8-WDFN Exposed Pad
    -
    -40°C~85°C TA
    Tube
    2016
    SpiFlash®
    Discontinued
    3 (168 Hours)
    8
    FLASH - NOR
    2.7V~3.6V
    DUAL
    1
    3V
    1.27mm
    -
    -
    3.6V
    3/3.3V
    2.7V
    SPI, Serial
    128Mb 16M x 8
    Non-Volatile
    -
    104MHz
    -
    FLASH
    SPI - Quad I/O, QPI
    -
    1
    50μs, 3ms
    0.00002A
    -
    3V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    -
    -
    -
    ROHS3 Compliant
    Surface Mount
    8
    3A991.B.1.A
    8
    20mA
    7 ns
    24b
    128 Mb
    Synchronous
    8b
    No
    -
    -
    W25Q256FVFIQ vs W25Q128FVEIG
  • W25Q128JVBIQ TR
    W25Q128JVBIQ TR
    Winbond Electronics
    10 Weeks
    Surface Mount
    24-TBGA
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    2016
    SpiFlash®
    Active
    3 (168 Hours)
    -
    FLASH - NOR
    2.7V~3.6V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    128Mb 16M x 8
    Non-Volatile
    -
    133MHz
    -
    FLASH
    SPI - Quad I/O, QPI, DTR
    -
    -
    3ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    W25Q256FVFIQ vs W25Q128JVBIQ TR
  • W25Q128FVEIP
    W25Q128FVEIP
    Winbond Electronics
    -
    Surface Mount
    8-WDFN Exposed Pad
    YES
    -40°C~85°C TA
    Tube
    2012
    SpiFlash®
    Discontinued
    3 (168 Hours)
    8
    FLASH - NOR
    2.7V~3.6V
    DUAL
    1
    3V
    1.27mm
    R-PDSO-N8
    -
    3.6V
    -
    2.7V
    -
    128Mb 16M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    -
    FLASH
    SPI - Quad I/O, QPI
    128MX1
    1
    50μs, 3ms
    -
    134217728 bit
    3V
    -
    -
    -
    -
    0.8mm
    8mm
    6mm
    ROHS3 Compliant
    -
    -
    3A991.B.1.A
    8
    -
    -
    -
    -
    -
    -
    -
    8542.32.00.51
    SERIAL
    W25Q256FVFIQ vs W25Q128FVEIP
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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