Winbond Electronics W25Q256FVEIP
- Part Number:
- W25Q256FVEIP
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3729904-W25Q256FVEIP
- Description:
- IC FLASH 256MBIT 8WSON
- Datasheet:
- W25Q256FV
Winbond Electronics W25Q256FVEIP technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25Q256FVEIP.
- Mounting TypeSurface Mount
- Package / Case8-WDFN Exposed Pad
- Surface MountYES
- Operating Temperature-40°C~85°C TA
- PackagingTube
- SeriesSpiFlash®
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations8
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionDUAL
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1.27mm
- JESD-30 CodeR-PDSO-N8
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3/3.3V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size256Mb 32M x 8
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Clock Frequency104MHz
- Supply Current-Max0.025mA
- Memory FormatFLASH
- Memory InterfaceSPI - Quad I/O, QPI
- Organization256MX1
- Memory Width1
- Write Cycle Time - Word, Page50μs, 3ms
- Standby Current-Max0.00002A
- Memory Density268435456 bit
- Parallel/SerialSERIAL
- Programming Voltage3V
- Serial Bus TypeSPI
- Endurance100000 Write/Erase Cycles
- Data Retention Time-Min20
- Write ProtectionHARDWARE/SOFTWARE
- Height Seated (Max)0.8mm
- Length8mm
- Width6mm
- RoHS StatusROHS3 Compliant
W25Q256FVEIP Overview
The Mounting Type of this particular electronic component is Surface Mount, which means that it can be mounted directly onto the surface of a circuit board. This feature is highly desirable as it allows for a more compact and efficient design. The Part Status of this component is Discontinued, indicating that it is no longer being produced. However, it is still functional and can be used in existing designs. The Number of Terminations for this component is 8, providing multiple connection points for optimal performance. The Voltage-Supply range is 2.7V~3.6V, making it suitable for a variety of applications. The JESD-30 Code for this component is R-PDSO-N8, which is a standard code used to identify the package type. The Supply Voltage-Min (Vsup) is 2.7V, ensuring that the component operates within the specified range. The Standby Current-Max is 0.00002A, indicating a low power consumption when not in use. With an Endurance of 100000 Write/Erase Cycles, this component is highly durable and can withstand frequent use. Its Length of 8mm makes it compact and easy to incorporate into any design.
W25Q256FVEIP Features
Package / Case: 8-WDFN Exposed Pad
W25Q256FVEIP Applications
There are a lot of Winbond Electronics
W25Q256FVEIP Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
The Mounting Type of this particular electronic component is Surface Mount, which means that it can be mounted directly onto the surface of a circuit board. This feature is highly desirable as it allows for a more compact and efficient design. The Part Status of this component is Discontinued, indicating that it is no longer being produced. However, it is still functional and can be used in existing designs. The Number of Terminations for this component is 8, providing multiple connection points for optimal performance. The Voltage-Supply range is 2.7V~3.6V, making it suitable for a variety of applications. The JESD-30 Code for this component is R-PDSO-N8, which is a standard code used to identify the package type. The Supply Voltage-Min (Vsup) is 2.7V, ensuring that the component operates within the specified range. The Standby Current-Max is 0.00002A, indicating a low power consumption when not in use. With an Endurance of 100000 Write/Erase Cycles, this component is highly durable and can withstand frequent use. Its Length of 8mm makes it compact and easy to incorporate into any design.
W25Q256FVEIP Features
Package / Case: 8-WDFN Exposed Pad
W25Q256FVEIP Applications
There are a lot of Winbond Electronics
W25Q256FVEIP Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
W25Q256FVEIP More Descriptions
IC FLASH 256MBIT SPI/QUAD 8WSON
IC FLASH 256M SPI 104MHZ 8WSON
IC FLASH 256M SPI 104MHZ 8WSON
The three parts on the right have similar specifications to W25Q256FVEIP.
-
ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeClock FrequencySupply Current-MaxMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageStandby Current-MaxMemory DensityParallel/SerialProgramming VoltageSerial Bus TypeEnduranceData Retention Time-MinWrite ProtectionHeight Seated (Max)LengthWidthRoHS StatusMountNumber of PinsPublishedECCN CodePin CountInterfaceNominal Supply CurrentAccess TimeAddress Bus WidthDensitySync/AsyncWord SizeRadiation HardeningFactory Lead TimeView Compare
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W25Q256FVEIPSurface Mount8-WDFN Exposed PadYES-40°C~85°C TATubeSpiFlash®Discontinued3 (168 Hours)8FLASH - NOR2.7V~3.6VDUAL13V1.27mmR-PDSO-N8Not Qualified3.6V3/3.3V2.7V256Mb 32M x 8Non-VolatileSYNCHRONOUS104MHz0.025mAFLASHSPI - Quad I/O, QPI256MX1150μs, 3ms0.00002A268435456 bitSERIAL3VSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARE0.8mm8mm6mmROHS3 Compliant---------------
-
Surface Mount8-WDFN Exposed Pad--40°C~85°C TATubeSpiFlash®Discontinued3 (168 Hours)8FLASH - NOR2.7V~3.6VDUAL13V1.27mm--3.6V3/3.3V2.7V128Mb 16M x 8Non-Volatile-104MHz-FLASHSPI - Quad I/O, QPI-150μs, 3ms0.00002A--3VSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARE---ROHS3 CompliantSurface Mount820163A991.B.1.A8SPI, Serial20mA7 ns24b128 MbSynchronous8bNo-
-
Surface Mount24-TBGA--40°C~85°C TATape & Reel (TR)SpiFlash®Active3 (168 Hours)-FLASH - NOR2.7V~3.6V---------128Mb 16M x 8Non-Volatile-133MHz-FLASHSPI - Quad I/O, QPI, DTR--3ms-----------ROHS3 Compliant--2016----------10 Weeks
-
Surface Mount24-TBGA--40°C~85°C TATape & Reel (TR)SpiFlash®Active3 (168 Hours)-FLASH - NOR2.7V~3.6V---------128Mb 16M x 8Non-Volatile-133MHz-FLASHSPI - Quad I/O, QPI, DTR--3ms-----------ROHS3 Compliant-------------10 Weeks
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