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W25Q16JVXGIQ TR

Winbond Electronics W25Q16JVXGIQ TR

Part Number:
W25Q16JVXGIQ TR
Manufacturer:
Winbond Electronics
Ventron No:
3245895-W25Q16JVXGIQ TR
Description:
IC FLASH 16MBIT 133MHZ XSON
ECAD Model:
Datasheet:
W25Q16JVXGIQ TR

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Specifications
Winbond Electronics W25Q16JVXGIQ TR technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25Q16JVXGIQ TR.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    8-XDFN Exposed Pad
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2016
  • Series
    SpiFlash®
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Memory Size
    16Mb 2M x 8
  • Memory Type
    Non-Volatile
  • Clock Frequency
    133MHz
  • Memory Format
    FLASH
  • Memory Interface
    SPI - Quad I/O
  • Write Cycle Time - Word, Page
    3ms
  • RoHS Status
    ROHS3 Compliant
Description
W25Q16JVXGIQ TR Overview
The mounting type for this particular component is surface mount, making it easy to install on a circuit board. The package or case is 8-XDFN exposed pad, providing a compact and durable design. This component belongs to the SpiFlash® series, ensuring high performance and reliability. Its part status is active, meaning it is currently in production and readily available. The moisture sensitivity level (MSL) is 3, indicating that it can withstand exposure to moisture for up to 168 hours. With a memory size of 16Mb 2M x 8, this component offers ample storage capacity. It is a non-volatile memory type, meaning it retains data even when power is turned off. The memory format is FLASH, allowing for fast data access. The write cycle time for each word or page is 3ms, providing efficient data transfer. Additionally, this component is ROHS3 compliant, meeting environmental standards.

W25Q16JVXGIQ TR Features
Package / Case: 8-XDFN Exposed Pad


W25Q16JVXGIQ TR Applications
There are a lot of Winbond Electronics
W25Q16JVXGIQ TR Memory applications.


Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
W25Q16JVXGIQ TR More Descriptions
XSON-8(4x4) NOR FLASH ROHS
IC FLASH 16MBIT SPI/QUAD 8XSON
IC FLASH 16M SPI 133MHZ 8XSON
Product Comparison
The three parts on the right have similar specifications to W25Q16JVXGIQ TR.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Technology
    Voltage - Supply
    Memory Size
    Memory Type
    Clock Frequency
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    RoHS Status
    Surface Mount
    Number of Terminations
    ECCN Code
    HTS Code
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Pin Count
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Parallel/Serial
    Programming Voltage
    Height Seated (Max)
    Length
    Width
    View Compare
  • W25Q16JVXGIQ TR
    W25Q16JVXGIQ TR
    Winbond Electronics
    10 Weeks
    Surface Mount
    8-XDFN Exposed Pad
    -40°C~85°C TA
    Tape & Reel (TR)
    2016
    SpiFlash®
    Active
    3 (168 Hours)
    FLASH - NOR
    2.7V~3.6V
    16Mb 2M x 8
    Non-Volatile
    133MHz
    FLASH
    SPI - Quad I/O
    3ms
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • W25Q128JVBIQ TR
    W25Q128JVBIQ TR
    Winbond Electronics
    10 Weeks
    Surface Mount
    24-TBGA
    -40°C~85°C TA
    Tape & Reel (TR)
    2016
    SpiFlash®
    Active
    3 (168 Hours)
    FLASH - NOR
    2.7V~3.6V
    128Mb 16M x 8
    Non-Volatile
    133MHz
    FLASH
    SPI - Quad I/O, QPI, DTR
    3ms
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    W25Q16JVXGIQ TR vs W25Q128JVBIQ TR
  • W25Q128JVPIM TR
    W25Q128JVPIM TR
    Winbond Electronics
    10 Weeks
    Surface Mount
    8-WDFN Exposed Pad
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    SpiFlash®
    Active
    3 (168 Hours)
    FLASH - NOR
    2.7V~3.6V
    128Mb 16M x 8
    Non-Volatile
    133MHz
    FLASH
    SPI - Quad I/O, QPI, DTR
    3ms
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    W25Q16JVXGIQ TR vs W25Q128JVPIM TR
  • W25Q128FVEIP
    W25Q128FVEIP
    Winbond Electronics
    -
    Surface Mount
    8-WDFN Exposed Pad
    -40°C~85°C TA
    Tube
    2012
    SpiFlash®
    Discontinued
    3 (168 Hours)
    FLASH - NOR
    2.7V~3.6V
    128Mb 16M x 8
    Non-Volatile
    104MHz
    FLASH
    SPI - Quad I/O, QPI
    50μs, 3ms
    ROHS3 Compliant
    YES
    8
    3A991.B.1.A
    8542.32.00.51
    DUAL
    1
    3V
    1.27mm
    8
    R-PDSO-N8
    3.6V
    2.7V
    SYNCHRONOUS
    128MX1
    1
    134217728 bit
    SERIAL
    3V
    0.8mm
    8mm
    6mm
    W25Q16JVXGIQ TR vs W25Q128FVEIP
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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