Winbond Electronics W25P16VSSIG
- Part Number:
- W25P16VSSIG
- Manufacturer:
- Winbond Electronics
- Ventron No:
- 3245859-W25P16VSSIG
- Description:
- IC FLASH 16MBIT 50MHZ 8SOIC
- Datasheet:
- W25P80,W25P16,W25P32
Winbond Electronics W25P16VSSIG technical specifications, attributes, parameters and parts with similar specifications to Winbond Electronics W25P16VSSIG.
- Mounting TypeSurface Mount
- Package / Case8-SOIC (0.209, 5.30mm Width)
- Surface MountYES
- Number of Pins8
- Operating Temperature-40°C~85°C TA
- PackagingTube
- SeriesSpiFlash®
- Published2006
- JESD-609 Codee3
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations8
- ECCN CodeEAR99
- Terminal FinishMATTE TIN
- TechnologyCMOS
- Voltage - Supply2.7V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1.27mm
- Time@Peak Reflow Temperature-Max (s)40
- Pin Count8
- Supply Voltage-Max (Vsup)3.6V
- Power Supplies3/3.3V
- Supply Voltage-Min (Vsup)2.7V
- InterfaceSPI, Serial
- Memory Size16Mb 2M x 8
- Memory TypeNon-Volatile
- Clock Frequency50MHz
- Supply Current-Max0.032mA
- Access Time50 μs
- Memory FormatFLASH
- Memory InterfaceSPI
- Organization16MX1
- Memory Width1
- Write Cycle Time - Word, Page7ms
- Address Bus Width1b
- Density16 Mb
- Standby Current-Max0.000005A
- Programming Voltage2.7V
- Serial Bus TypeSPI
- Endurance100000 Write/Erase Cycles
- Data Retention Time-Min20
- Write ProtectionHARDWARE/SOFTWARE
- Length5.27mm
- Height Seated (Max)2.16mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
W25P16VSSIG Overview
Non-Volatile is its memory type. It is available in a case with a Tube shape. As you can see, it is embedded in 8-SOIC (0.209, 5.30mm Width) case. There is an 16Mb 2M x 8 memory capacity on the chip. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. There is a recommendation that Surface Mount mounting type should be used for this product. As you can see from the diagram, the chip is planted with 8 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 3V power supply. With a clock frequency of 50MHz, the memory rotates on its own. It is encased in an 8-pin package that contains this ic memory chip. It has 8 pins indicating it has 8 memory locations. This memory chip requires a mere 3/3.3V of power. Among the SpiFlash® series of memory devices, this part is essential for its applications. By integrating with the SPI-type serial bus, this memory transmits data to the processor. This memory ics is capable of operating with an input current of 0.032mA at max. A programming voltage of 2.7V is needed to alter the state of certain nonvolatile memory arrays.
W25P16VSSIG Features
Package / Case: 8-SOIC (0.209, 5.30mm Width)
8 Pins
W25P16VSSIG Applications
There are a lot of Winbond Electronics
W25P16VSSIG Memory applications.
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
Non-Volatile is its memory type. It is available in a case with a Tube shape. As you can see, it is embedded in 8-SOIC (0.209, 5.30mm Width) case. There is an 16Mb 2M x 8 memory capacity on the chip. In this device, the memory is of the FLASH-format, which is a popular format in the mainstream computing sector. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. There is a recommendation that Surface Mount mounting type should be used for this product. As you can see from the diagram, the chip is planted with 8 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 3V power supply. With a clock frequency of 50MHz, the memory rotates on its own. It is encased in an 8-pin package that contains this ic memory chip. It has 8 pins indicating it has 8 memory locations. This memory chip requires a mere 3/3.3V of power. Among the SpiFlash® series of memory devices, this part is essential for its applications. By integrating with the SPI-type serial bus, this memory transmits data to the processor. This memory ics is capable of operating with an input current of 0.032mA at max. A programming voltage of 2.7V is needed to alter the state of certain nonvolatile memory arrays.
W25P16VSSIG Features
Package / Case: 8-SOIC (0.209, 5.30mm Width)
8 Pins
W25P16VSSIG Applications
There are a lot of Winbond Electronics
W25P16VSSIG Memory applications.
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)
W25P16VSSIG More Descriptions
IC FLASH 16MBIT 50MHZ 8SOIC
16M-BIT SPI FLASH8 PIN SOIC, 300MIL, GREEN
OEMs, CMs ONLY (NO BROKERS)
16M-BIT SPI FLASH8 PIN SOIC, 300MIL, GREEN
OEMs, CMs ONLY (NO BROKERS)
The three parts on the right have similar specifications to W25P16VSSIG.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingSeriesPublishedJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Pin CountSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)InterfaceMemory SizeMemory TypeClock FrequencySupply Current-MaxAccess TimeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxProgramming VoltageSerial Bus TypeEnduranceData Retention Time-MinWrite ProtectionLengthHeight Seated (Max)Radiation HardeningRoHS StatusLead FreeHTS CodeReach Compliance CodeJESD-30 CodeQualification StatusOperating ModeMemory DensityWidthSupplier Device PackageView Compare
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W25P16VSSIGSurface Mount8-SOIC (0.209, 5.30mm Width)YES8-40°C~85°C TATubeSpiFlash®2006e3Obsolete3 (168 Hours)8EAR99MATTE TINCMOS2.7V~3.6VDUAL26013V1.27mm4083.6V3/3.3V2.7VSPI, Serial16Mb 2M x 8Non-Volatile50MHz0.032mA50 μsFLASHSPI16MX117ms1b16 Mb0.000005A2.7VSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARE5.27mm2.16mmNoROHS3 CompliantLead Free---------
-
Surface Mount8-SOIC (0.154, 3.90mm Width)YES--40°C~85°C TATubeSpiFlash®2006e3Obsolete3 (168 Hours)8EAR99Matte Tin (Sn)CMOS2.7V~3.6VDUAL26013V1.27mm4083.6V3/3.3V2.7VSPI, Serial4Mb 512K x 8Non-Volatile40MHz0.025mA40 μsFLASHSPI4MX115ms--0.000005A2.7VSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARE4.85mm1.72mm-ROHS3 CompliantLead Free8542.32.00.51unknownR-PDSO-G8Not QualifiedSYNCHRONOUS4194304 bit3.9mm-
-
Surface Mount8-SOIC (0.154, 3.90mm Width)---40°C~85°C TATape & Reel (TR)SpiFlash®2006-Obsolete3 (168 Hours)---FLASH2.7V~3.6V-----------2Mb 256K x 8Non-Volatile40MHz--FLASHSPI--5ms-----------ROHS3 Compliant--------8-SOIC
-
Surface Mount8-SOIC (0.209, 5.30mm Width)---40°C~85°C TATape & Reel (TR)SpiFlash®2006-Obsolete3 (168 Hours)---FLASH2.7V~3.6V-----------8Mb 1M x 8Non-Volatile50MHz--FLASHSPI--7ms-----------ROHS3 Compliant--------8-SOIC
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