VDRIVE2

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FTDI, Future Technology Devices International Ltd VDRIVE2

Part Number:

VDRIVE2

Manufacturer:

FTDI, Future Technology Devices International Ltd

Ventron No:

3-VDRIVE2

Description:

MOD USB FLASH DRIVE INTERFACE

ECAD Model:

Datasheet:

VDRIVE2

Payment:

Payment

Delivery:

Delivery

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Specifications

FTDI, Future Technology Devices International Ltd VDRIVE2 technical specifications, attributes, parameters and parts with similar specifications to FTDI, Future Technology Devices International Ltd VDRIVE2.

  • Factory Lead Time
    15 Weeks
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    Module
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    10
  • Material

    In electronic components, "Material" refers to the substance or composition used to construct the component. It determines the electrical, mechanical, and thermal properties of the component.

    Plastic
  • Packaging
    Bulk
  • Published
    2006
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    Vinculum
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -30°C
  • Color
    Gray
  • Lead Pitch
    2mm
  • Operating Supply Voltage
    5V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    Serial, USB
  • Max Supply Voltage
    5.25V
  • Min Supply Voltage
    4.75V
  • Accessory Type
    USB Audio Module
  • Density
    500 kb
  • Number of Drivers
    1
  • Number of Receivers
    1
  • REACH SVHC
    No SVHC
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free

Description

VDRIVE2 Overview
The module, known as the Vinculum series, comes in a package or case and is available in bulk. Its part status is active, meaning it is currently in production and available for purchase. The module can withstand a maximum operating temperature of 85°C and has a lead pitch of 2mm. It is classified as an accessory type, specifically a USB audio module, and has one driver and one receiver. Additionally, it is compliant with RoHS regulations, ensuring it is environmentally friendly. These specifications make the Vinculum module a versatile and durable choice for various electronic applications.

VDRIVE2 Features
Module
Bulk
Vinculum Series


VDRIVE2 Applications
There are a lot of FTDI, Future Technology Devices International Ltd
VDRIVE2 Microcontroller applications.
VDRIVE2 MCU is usually applied for Measurement and control field, Consumer electronics products, Network communication, mobile communication, Office automation equipment and computer peripherals, Industrial control Instrumentation and process control, Agriculture, transportation, Navigation control, Network application, Metering & measurement, Day to day life, Safety, Medical instruments and Automobile industry.


Smoothing
Decoupling or bypassing
Noise filtering
DC/DC, DC/AC, and AC/AC converters
Frequency converters
Spot welding
Flashtube ignition
DC link
Motor start
Audio crossover
VDRIVE2 More Descriptions
USB Flash Disk/UART, FIFO, SPI int. Module (not offered in your region)
Vinculum USB Host Flash Drive Interface Module, UART or SPI Interface
VDRIVE2 FTDI USB Flash disk interface with enclosure 3MBaud Data Rate Full Speed (12Mbps) USB Host
Vinculum USB Devices VDRIVE USB FLASH DRIVE INTERFACE
FTDI VDRIVE2 MOD, USB FLASH-UART FIFO SPI I/F
MOD, USB FLASH-UART FIFO SPI I/F; Module Applications: Data Collection, Monitoring, Remote Control, Sensor Networks; Compliance Standard: -; Supported Devices: -; Module Interface: USB; Supply Voltage Min: 4.75V; Supply Voltage Max: 5.25V; Product Range: -; SVHC: No SVHC (15-Jan-2019); Convert From: USB A Socket; Pitch Spacing: 2mm

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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