Toshiba Semiconductor and Storage TBD62003APG

TBD62003APG Overview
Surface Mount technology has revolutionized the way electronic components are packaged and mounted onto circuit boards. One such example is the use of tubes for packaging, which allows for efficient storage and handling during the manufacturing process. This is particularly important for components with a high number of terminations, such as the one in question with 16 terminations. The terminal position, being dual, also adds to the ease of assembly and ensures a secure connection. Additionally, the Moisture Sensitivity Level (MSL) of 1 (unlimited) further adds to the reliability and durability of the component. Even though the peak reflow temperature is not specified, the maximum output current of 2.8A and minimum supply voltage of 2.5V make it suitable for a wide range of applications. Moreover, the output configuration being low side and the voltage supply not being required make it a versatile and convenient choice for electronic designs.

TBD62003APG Features
Supplied from 5V

TBD62003APG Applications
There are a lot of Toshiba Semiconductor and Storage TBD62003APG Power Switches ICs applications.

Wireless Headsets
Low Voltage I/O System Power
Solid-State Drives
Set-top-box
Set-Top Boxes
Storage Drives
Mobile Communication Devices
Wireless Modem Data Cards
Telecom and Network Systems
Portable/Handheld Devices