Microchip Technology SST39VF801C-70-4I-B3KE-T
- Part Number:
- SST39VF801C-70-4I-B3KE-T
- Manufacturer:
- Microchip Technology
- Ventron No:
- 3231572-SST39VF801C-70-4I-B3KE-T
- Description:
- IC FLASH 8MBIT 70NS 48TFBGA
- Datasheet:
- SST39VF801C-70-4I-B3KE-T
Microchip Technology SST39VF801C-70-4I-B3KE-T technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology SST39VF801C-70-4I-B3KE-T.
- Factory Lead Time7 Weeks
- Mounting TypeSurface Mount
- Package / Case48-TFBGA
- Surface MountYES
- Number of Pins48
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- Published2011
- SeriesSST39 MPF™
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations48
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- TechnologyCMOS
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Terminal Pitch0.8mm
- Base Part NumberSST39VF801C
- Operating Supply Voltage3.3V
- Memory Size8Mb 512K x 16
- Nominal Supply Current18mA
- Memory TypeNon-Volatile
- Access Time70ns
- Memory FormatFLASH
- Memory InterfaceParallel
- Data Bus Width16b
- Organization512KX16
- Memory Width16
- Write Cycle Time - Word, Page10μs
- Address Bus Width19b
- Density8 Mb
- Standby Current-Max0.00002A
- Sync/AsyncAsynchronous
- Word Size16b
- Data PollingYES
- Toggle BitYES
- Command User InterfaceYES
- Number of Sectors/Size256
- Sector Size2K
- Ready/BusyYES
- Boot BlockBOTTOM
- Common Flash InterfaceYES
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
SST39VF801C-70-4I-B3KE-T Overview
The manufacturer of this component is Microchip Technology. It is a type of memory chip that falls under the memory category. The package or case of the chip is 48-TFBGA. The voltage supply required for this chip ranges from 2.7V to 3.6V. The access time, which is the time it takes for the chip to retrieve data, is 70 nanoseconds. The memory interface for this chip is parallel, meaning it transfers data in parallel rather than serially. The address bus width, which determines the number of address lines used for memory access, is 19 bits. This chip has a density of 8 megabits, meaning it can store a large amount of data. It can operate both synchronously and asynchronously, but in this case, it is designed for asynchronous operation. The toggle bit, which is a feature that allows the chip to switch between two different states, is present in this chip. It also has a common flash interface, which is a standardized interface for flash memory devices. However, this chip is not designed to withstand radiation hardening, meaning it is not resistant to radiation.
SST39VF801C-70-4I-B3KE-T Features
Package / Case: 48-TFBGA
48 Pins
Operating Supply Voltage:3.3V
SST39VF801C-70-4I-B3KE-T Applications
There are a lot of Microchip Technology SST39VF801C-70-4I-B3KE-T Memory applications.
data buffer
main computer memory
cell phones
hard disk drive (HDD)
eSRAM
Cache memory
networks
graphics card
printers
Camcorders
The manufacturer of this component is Microchip Technology. It is a type of memory chip that falls under the memory category. The package or case of the chip is 48-TFBGA. The voltage supply required for this chip ranges from 2.7V to 3.6V. The access time, which is the time it takes for the chip to retrieve data, is 70 nanoseconds. The memory interface for this chip is parallel, meaning it transfers data in parallel rather than serially. The address bus width, which determines the number of address lines used for memory access, is 19 bits. This chip has a density of 8 megabits, meaning it can store a large amount of data. It can operate both synchronously and asynchronously, but in this case, it is designed for asynchronous operation. The toggle bit, which is a feature that allows the chip to switch between two different states, is present in this chip. It also has a common flash interface, which is a standardized interface for flash memory devices. However, this chip is not designed to withstand radiation hardening, meaning it is not resistant to radiation.
SST39VF801C-70-4I-B3KE-T Features
Package / Case: 48-TFBGA
48 Pins
Operating Supply Voltage:3.3V
SST39VF801C-70-4I-B3KE-T Applications
There are a lot of Microchip Technology SST39VF801C-70-4I-B3KE-T Memory applications.
data buffer
main computer memory
cell phones
hard disk drive (HDD)
eSRAM
Cache memory
networks
graphics card
printers
Camcorders
SST39VF801C-70-4I-B3KE-T More Descriptions
Parallel Flash, 2.7 - 3.6 V, 8 Mbit, x16, 70 ns, -40°C to 85°C, TFBGA-48, RoHSMicrochip SCT
Flash Parallel 3.3V 8Mbit 512K x 16bit 70ns 48-Pin TFBGA T/R
8Mb (512Kbx16) NOR FLASH 3.6V 48-ball TFBGA (6x8mm)
3.0V to 3.6V 8Mbit Multi-Purpose Flash
3.0V To 3.6V 8Mbit Multi-Purpose Flash 48 Tfbga 6X8X1.2Mm T/R Rohs Compliant: Yes |Microchip SST39VF801C-70-4I-B3KE-T
IC FLASH 8MBIT PARALLEL 48TFBGA
FLASH MEMORY, 8MBIT, -40 TO 85DEG C;
Flash Parallel 3.3V 8Mbit 512K x 16bit 70ns 48-Pin TFBGA T/R
8Mb (512Kbx16) NOR FLASH 3.6V 48-ball TFBGA (6x8mm)
3.0V to 3.6V 8Mbit Multi-Purpose Flash
3.0V To 3.6V 8Mbit Multi-Purpose Flash 48 Tfbga 6X8X1.2Mm T/R Rohs Compliant: Yes |Microchip SST39VF801C-70-4I-B3KE-T
IC FLASH 8MBIT PARALLEL 48TFBGA
FLASH MEMORY, 8MBIT, -40 TO 85DEG C;
The three parts on the right have similar specifications to SST39VF801C-70-4I-B3KE-T.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishTechnologyVoltage - SupplyTerminal PositionTerminal PitchBase Part NumberOperating Supply VoltageMemory SizeNominal Supply CurrentMemory TypeAccess TimeMemory FormatMemory InterfaceData Bus WidthOrganizationMemory WidthWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxSync/AsyncWord SizeData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizeReady/BusyBoot BlockCommon Flash InterfaceRadiation HardeningRoHS StatusPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeMemory DensityProgramming VoltageLengthHeight Seated (Max)WidthView Compare
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SST39VF801C-70-4I-B3KE-T7 WeeksSurface Mount48-TFBGAYES48-40°C~85°C TATape & Reel (TR)2011SST39 MPF™e1Active3 (168 Hours)48Tin/Silver/Copper (Sn/Ag/Cu)CMOS2.7V~3.6VBOTTOM0.8mmSST39VF801C3.3V8Mb 512K x 1618mANon-Volatile70nsFLASHParallel16b512KX161610μs19b8 Mb0.00002AAsynchronous16bYESYESYES2562KYESBOTTOMYESNoROHS3 Compliant--------------
-
7 WeeksSurface Mount32-TFSOP (0.488, 12.40mm Width)YES--40°C~85°C TATape & Reel (TR)2011SST39 MPF™-Active3 (168 Hours)32-FLASH - NOR2.7V~3.6VDUAL0.5mm--2Mb 256K x 8-Non-Volatile70nsFLASHParallel-256KX8820μs--------------ROHS3 CompliantNOT SPECIFIED13VNOT SPECIFIEDR-PDSO-G323.6V2.7VASYNCHRONOUS2097152 bit2.7V12.4mm1.2mm8mm
-
11 WeeksSurface Mount32-TFSOP (0.488, 12.40mm Width)YES-0°C~70°C TATape & Reel (TR)2011SST39 MPF™-Active3 (168 Hours)32-FLASH - NOR3V~3.6VDUAL0.5mm--2Mb 256K x 8-Non-Volatile55nsFLASHParallel-256KX8820μs--------------ROHS3 Compliant-13.3V-R-PDSO-G323.6V3VASYNCHRONOUS2097152 bit3V12.4mm1.2mm8mm
-
-Surface Mount48-TFBGAYES--40°C~85°C TATape & Reel (TR)-Automotive, AEC-Q100-Active3 (168 Hours)48-CMOS2.7V~3.6VBOTTOM0.8mm--32Mb 2M x 16-Non-Volatile70nsFLASHParallel-2MX161610μs--------------ROHS3 Compliant-13V-R-PBGA-B483.6V2.7VASYNCHRONOUS33554432 bit2.7V8mm1.2mm6mm
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