NXP USA Inc. SPC5200CBV400
- Part Number:
- SPC5200CBV400
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3162028-SPC5200CBV400
- Description:
- IC MPU MPC52XX 400MHZ 272BGA
- Datasheet:
- SPC5200CBV400
NXP USA Inc. SPC5200CBV400 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. SPC5200CBV400.
- Package / CaseBGA
- Surface MountYES
- Number of Pins272
- JESD-609 Codee0
- Pbfree Codeno
- Moisture Sensitivity Level (MSL)3
- Number of Terminations272
- Terminal FinishTin/Lead (Sn/Pb)
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- Additional FeatureALSO REQUIRES 3.3V SUPPLY
- SubcategoryMicroprocessors
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)240
- Supply Voltage1.5V
- Frequency400MHz
- Reflow Temperature-Max (s)30
- Pin Count272
- Temperature GradeINDUSTRIAL
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR
- Bit Size32
- Frequency (Max)400MHz
- Data Bus Width32b
- Address Bus Width32
- Core ArchitecturePowerPC
- Boundary ScanYES
- Low Power ModeYES
- FormatFLOATING POINT
- Integrated CacheYES
- Number of Cores1
- Height Seated (Max)2.65mm
- Length27mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
SPC5200CBV400 Overview
The package or case for this particular technology is a Ball Grid Array (BGA), which is a type of surface-mount packaging used for integrated circuits. It follows the JESD-609 Code, which is the industry standard for thermal resistance and moisture sensitivity of electronic components. The Moisture Sensitivity Level (MSL) for this package is 3, indicating that it can withstand a moderate level of moisture exposure. The technology used in this package is Complementary Metal-Oxide-Semiconductor (CMOS), which is a type of integrated circuit technology known for its low power consumption and high speed. The peak reflow temperature for this package is 240 degrees Celsius. It operates at a supply voltage of 1.5V and has a pin count of 272. The address bus width is 32, and it also features an integrated cache. Additionally, this package is RoHS compliant, meaning it is free of hazardous substances and meets environmental regulations.
SPC5200CBV400 Features
32-Bit Structure
32b-Bit Data Bus Width
1-Core CPU
SPC5200CBV400 Applications
There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) SPC5200CBV400 Microprocessor applications.
Christmas lights
Auto-breaking system
Medical instruments chromatographs
Measurement and control field
Digital set-top boxes
Firewalls
Torpedo guidance
X-ray
Projectors
Equipment control
The package or case for this particular technology is a Ball Grid Array (BGA), which is a type of surface-mount packaging used for integrated circuits. It follows the JESD-609 Code, which is the industry standard for thermal resistance and moisture sensitivity of electronic components. The Moisture Sensitivity Level (MSL) for this package is 3, indicating that it can withstand a moderate level of moisture exposure. The technology used in this package is Complementary Metal-Oxide-Semiconductor (CMOS), which is a type of integrated circuit technology known for its low power consumption and high speed. The peak reflow temperature for this package is 240 degrees Celsius. It operates at a supply voltage of 1.5V and has a pin count of 272. The address bus width is 32, and it also features an integrated cache. Additionally, this package is RoHS compliant, meaning it is free of hazardous substances and meets environmental regulations.
SPC5200CBV400 Features
32-Bit Structure
32b-Bit Data Bus Width
1-Core CPU
SPC5200CBV400 Applications
There are a lot of Freescale Semiconductor, Inc. (NXP Semiconductors) SPC5200CBV400 Microprocessor applications.
Christmas lights
Auto-breaking system
Medical instruments chromatographs
Measurement and control field
Digital set-top boxes
Firewalls
Torpedo guidance
X-ray
Projectors
Equipment control
SPC5200CBV400 More Descriptions
MPU MPC52xx RISC 32-Bit 400MHz 2.5V/3.3V 272-Pin BGA Tray
PowerPC e300 Microprocessor IC MPC52xx 1 Core, 32-Bit 400MHz 272-PBGA (27x27)
FLOATING POINT MICROPROCESSOR PowerPC BALL IC Microprocessor 85C 27mm 1.5V 32b
PowerPC e300 Microprocessor IC MPC52xx 1 Core, 32-Bit 400MHz 272-PBGA (27x27)
FLOATING POINT MICROPROCESSOR PowerPC BALL IC Microprocessor 85C 27mm 1.5V 32b
The three parts on the right have similar specifications to SPC5200CBV400.
-
ImagePart NumberManufacturerPackage / CaseSurface MountNumber of PinsJESD-609 CodePbfree CodeMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishMax Operating TemperatureMin Operating TemperatureAdditional FeatureSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageFrequencyReflow Temperature-Max (s)Pin CountTemperature GradeuPs/uCs/Peripheral ICs TypeBit SizeFrequency (Max)Data Bus WidthAddress Bus WidthCore ArchitectureBoundary ScanLow Power ModeFormatIntegrated CacheNumber of CoresHeight Seated (Max)LengthRadiation HardeningRoHS StatusFactory Lead TimeOperating TemperaturePackagingPublishedSeriesPart StatusECCN CodeHTS CodeTerminal PitchBase Part NumberJESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)SpeedCore ProcessorExternal Data Bus WidthVoltage - I/OEthernetNumber of Cores/Bus WidthGraphics AccelerationRAM ControllersUSBAdditional InterfacesPower SuppliesClock FrequencyScreening LevelSupplier Device PackageView Compare
-
SPC5200CBV400BGAYES272e0no3272Tin/Lead (Sn/Pb)85°C-40°CALSO REQUIRES 3.3V SUPPLYMicroprocessorsCMOSBOTTOMBALL2401.5V400MHz30272INDUSTRIALMICROPROCESSOR32400MHz32b32PowerPCYESYESFLOATING POINTYES12.65mm27mmNoRoHS Compliant----------------------------
-
272-BBGAYES-e1-3 (168 Hours)272Tin/Silver/Copper (Sn/Ag/Cu)----CMOSBOTTOMBALL2601.5V-40--MICROPROCESSOR---13-YESYESFLOATING POINTYES-2.65mm27mm-ROHS3 Compliant12 Weeks-40°C~85°C TATray2003MPC52xxObsolete3A991.A.28542.31.00.011.27mmPC5200S-PBGA-B2721.58V1.42V400MHzPowerPC e300322.5V 3.3V10/100Mbps (1)1 Core 32-BitNoDDR, SDRAMUSB 1.1 (2)AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART----
-
272-BBGAYES-e0-3 (168 Hours)272Tin/Lead (Sn/Pb)---MicroprocessorsCMOSBOTTOMBALL2451.5V-30--MICROPROCESSOR32--32-YESYESFLOATING POINTYES-2.65mm27mm-Non-RoHS Compliant12 Weeks-40°C~85°C TATray2003MPC52xxNot For New Designs3A991.A.28542.31.00.011.27mmPC5200S-PBGA-B2721.58V1.42V400MHzPowerPC G2_LE322.5V 3.3V10/100Mbps (1)1 Core 32-BitNoDDR, SDRAMUSB 1.1 (2)AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART1.53.3V66MHzAEC-Q100-
-
272-BBGA----3 (168 Hours)-----------------------------ROHS3 Compliant12 Weeks-40°C~85°C TATape & Reel (TR)2003MPC52xxObsolete---PC5200---400MHzPowerPC e300-2.5V 3.3V10/100Mbps (1)1 Core 32-BitNoDDR, SDRAMUSB 1.1 (2)AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART---272-PBGA (27x27)
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
06 September 2023
A4988 Characteristics, Application and Basic Principle
A4988 is an efficient and commonly used stepper motor driver chip, widely used in 3D printing and CNC machine tools and other fields. We will discuss in depth... -
07 September 2023
What Is The Difference Between NE5532 And RC4558D?
Ⅰ. Overview of NE5532NE5532 is a dual operational amplifier chip with excellent performance and low noise characteristics. Its circuit design is similar to that of a common operational... -
07 September 2023
TPC8129 Internal Circuit, Specifications, Application and Marking
Ⅰ. Overview of TPC8129TPC8129 is a product of Toshiba, a Japanese comprehensive electronic and electrical company. It is a chip for LED driver circuits and is mainly used... -
12 September 2023
The Difference Between L293D and L298N
In this article we will explore the main differences between the L293D and L298N motor drivers. Both motor drives have their own unique features and applications. Understanding the...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.