Cypress Semiconductor Corp S25FL256SAGMFB010
- Part Number:
- S25FL256SAGMFB010
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3233345-S25FL256SAGMFB010
- Description:
- IC 256M FLASH MEMORY
- Datasheet:
- S25FL256SAGMFB010
Cypress Semiconductor Corp S25FL256SAGMFB010 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp S25FL256SAGMFB010.
- Factory Lead Time13 Weeks
- Mounting TypeSurface Mount
- Package / Case16-SOIC (0.295, 7.50mm Width)
- Surface MountYES
- Operating Temperature-40°C~105°C TA
- PackagingTray
- Published2016
- SeriesAutomotive, AEC-Q100, FL-S
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations16
- Additional FeatureALSO CONFIGURABLE AS 256M X 1
- HTS Code8542.32.00.51
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionDUAL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeR-PDSO-G16
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size256Mb 32M x 8
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Clock Frequency133MHz
- Memory FormatFLASH
- Memory InterfaceSPI - Quad I/O
- Organization64MX4
- Memory Width4
- Memory Density268435456 bit
- Parallel/SerialSERIAL
- Programming Voltage3V
- Write Cycle Time-Max (tWC)500ms
- Alternate Memory Width2
- Height Seated (Max)2.65mm
- Length10.3mm
- Width7.5mm
- RoHS StatusROHS3 Compliant
S25FL256SAGMFB010 Overview
The number of terminations for this particular product is 16, which is a moderate amount compared to other electronic components. The supply voltage required for optimal functioning is 3V, which is a relatively low voltage. The reflow temperature, however, is not specified, which may cause some concern for potential users. The JESD-30 code for this product is R-PDSO-G16, indicating a rectangular package with a power dissipation of 1.5W and a thermal resistance of 62°C/W. The maximum supply voltage for this product is 3.6V, which is slightly higher than the required voltage. The organization of this component is 64MX4, meaning it has 64 million cells with 4 bits per cell. The programming voltage for this product is 3V, which is consistent with the required supply voltage. The maximum write cycle time is 500ms, which is relatively slow compared to other memory devices. Additionally, this component has an alternate memory width of 2, indicating that it can support multiple data widths. Finally, the maximum seated height for this product is 2.65mm, which is relatively thin and compact. Overall, this component has a moderate number of terminations and a low supply voltage, but some specifications such as reflow temperature and write cycle time are not specified.
S25FL256SAGMFB010 Features
Package / Case: 16-SOIC (0.295, 7.50mm Width)
Additional Feature:ALSO CONFIGURABLE AS 256M X 1
S25FL256SAGMFB010 Applications
There are a lot of Cypress Semiconductor Corp S25FL256SAGMFB010 Memory applications.
eDRAM
cell phones
networks
graphics card
main computer memory
servers
mainframes
supercomputers
multimedia computers
personal computers
The number of terminations for this particular product is 16, which is a moderate amount compared to other electronic components. The supply voltage required for optimal functioning is 3V, which is a relatively low voltage. The reflow temperature, however, is not specified, which may cause some concern for potential users. The JESD-30 code for this product is R-PDSO-G16, indicating a rectangular package with a power dissipation of 1.5W and a thermal resistance of 62°C/W. The maximum supply voltage for this product is 3.6V, which is slightly higher than the required voltage. The organization of this component is 64MX4, meaning it has 64 million cells with 4 bits per cell. The programming voltage for this product is 3V, which is consistent with the required supply voltage. The maximum write cycle time is 500ms, which is relatively slow compared to other memory devices. Additionally, this component has an alternate memory width of 2, indicating that it can support multiple data widths. Finally, the maximum seated height for this product is 2.65mm, which is relatively thin and compact. Overall, this component has a moderate number of terminations and a low supply voltage, but some specifications such as reflow temperature and write cycle time are not specified.
S25FL256SAGMFB010 Features
Package / Case: 16-SOIC (0.295, 7.50mm Width)
Additional Feature:ALSO CONFIGURABLE AS 256M X 1
S25FL256SAGMFB010 Applications
There are a lot of Cypress Semiconductor Corp S25FL256SAGMFB010 Memory applications.
eDRAM
cell phones
networks
graphics card
main computer memory
servers
mainframes
supercomputers
multimedia computers
personal computers
S25FL256SAGMFB010 More Descriptions
Flash NOR Serial-SPI 3.3V 256Mbit 256M/128M/64M X 1Bit/2Bit/4Bit 8ns 16-Pin SOIC Tray
IC FLASH 256MBIT SPI/QUAD 16SOIC
Nor/Tray |Cypress Infineon Technologies S25FL256SAGMFB010
S25FL256S - 256-Mbit, 3.0V CMOS
IC FLASH 256MBIT SPI/QUAD 16SOIC
Nor/Tray |Cypress Infineon Technologies S25FL256SAGMFB010
S25FL256S - 256-Mbit, 3.0V CMOS
The three parts on the right have similar specifications to S25FL256SAGMFB010.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeClock FrequencyMemory FormatMemory InterfaceOrganizationMemory WidthMemory DensityParallel/SerialProgramming VoltageWrite Cycle Time-Max (tWC)Alternate Memory WidthHeight Seated (Max)LengthWidthRoHS StatusMountNumber of PinsECCN CodePower SuppliesInterfaceNominal Supply CurrentAccess TimeWrite Cycle Time - Word, PageAddress Bus WidthDensityStandby Current-MaxSync/AsyncWord SizeSerial Bus TypeEnduranceData Retention Time-MinWrite ProtectionPage SizeRadiation HardeningSupplier Device PackageView Compare
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S25FL256SAGMFB01013 WeeksSurface Mount16-SOIC (0.295, 7.50mm Width)YES-40°C~105°C TATray2016Automotive, AEC-Q100, FL-SActive3 (168 Hours)16ALSO CONFIGURABLE AS 256M X 18542.32.00.51FLASH - NOR2.7V~3.6VDUALNOT SPECIFIED13V1.27mmNOT SPECIFIEDR-PDSO-G163.6V2.7V256Mb 32M x 8Non-VolatileSYNCHRONOUS133MHzFLASHSPI - Quad I/O64MX44268435456 bitSERIAL3V500ms22.65mm10.3mm7.5mmROHS3 Compliant---------------------
-
11 WeeksSurface Mount8-UDFN Exposed Pad--40°C~105°C TATray2007FL-PObsolete3 (168 Hours)8--FLASH - NOR2.7V~3.6VDUAL-13V1.27mm--3.6V2.7V32Mb 4M x 8Non-Volatile-104MHzFLASHSPI - Quad I/O4KX1616--3V-----ROHS3 CompliantSurface Mount83A991.B.1.A3/3.3VSPI, Serial38mA8 ns5μs, 3ms1b32 Mb0.00001ASynchronous8bSPI100000 Write/Erase Cycles20HARDWARE/SOFTWARE256BNo-
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13 WeeksSurface Mount16-SOIC (0.295, 7.50mm Width)--40°C~85°C TATray-FL-PObsolete1 (Unlimited)---FLASH - NOR2.7V~3.6V---------32Mb 4M x 8Non-Volatile-104MHzFLASHSPI - Quad I/O----------ROHS3 Compliant-16-----5μs, 3ms-----------16-SOIC
-
-Surface Mount8-SOIC (0.209, 5.30mm Width)--40°C~85°C TATray-FL-PObsolete1 (Unlimited)---FLASH - NOR2.7V~3.6V---------32Mb 4M x 8Non-Volatile-104MHzFLASHSPI - Quad I/O----------ROHS3 Compliant-8-----5μs, 3ms-----------8-SOIC
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