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PC28F512P30TFA

Micron Technology Inc. PC28F512P30TFA

Part Number:
PC28F512P30TFA
Manufacturer:
Micron Technology Inc.
Ventron No:
3234721-PC28F512P30TFA
Description:
IC FLASH 512MBIT 100NS 64EASYBGA
ECAD Model:
Datasheet:
PC28F512P30TFA

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Specifications
Micron Technology Inc. PC28F512P30TFA technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. PC28F512P30TFA.
  • Factory Lead Time
    5 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    64-TBGA
  • Surface Mount
    YES
  • Number of Pins
    64
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2008
  • Series
    Axcell™
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    64
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Additional Feature
    TOP BOOT
  • Technology
    FLASH - NOR
  • Voltage - Supply
    1.7V~2V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    28F512P30
  • Operating Supply Voltage
    1.8V
  • Power Supplies
    1.81.8/3.3V
  • Voltage
    1.7V
  • Interface
    Parallel, Serial
  • Memory Size
    512Mb 32M x 16
  • Nominal Supply Current
    31mA
  • Memory Type
    Non-Volatile
  • Clock Frequency
    52MHz
  • Memory Format
    FLASH
  • Memory Interface
    Parallel
  • Organization
    32MX16
  • Memory Width
    16
  • Write Cycle Time - Word, Page
    100ns
  • Address Bus Width
    25b
  • Density
    512 Mb
  • Standby Current-Max
    0.000225A
  • Access Time (Max)
    100 ns
  • Sync/Async
    Asynchronous
  • Word Size
    16b
  • Data Polling
    NO
  • Toggle Bit
    NO
  • Number of Sectors/Size
    4511
  • Page Size
    16words
  • Boot Block
    TOP
  • Height Seated (Max)
    1.2mm
  • Length
    10mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
Description
PC28F512P30TFA Overview
The package or case for this particular product is a 64-TBGA (Thin Ball Grid Array) with a JESD-609 Code of e1. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to moisture for up to 168 hours. The terminal position of this package is located at the bottom. The Peak Reflow Temperature for this product is 260 degrees Celsius. The Memory Size is 512Mb, with an organization of 32MX16, meaning it is a 32M x 16 memory chip. The Access Time (Max) for this product is 100 nanoseconds, and it does not have the capability for Data Polling. The maximum seated height for this package is 1.2mm. These specifications make this product suitable for a variety of electronic devices and applications.

PC28F512P30TFA Features
Package / Case: 64-TBGA
64 Pins
Operating Supply Voltage:1.8V
Additional Feature:TOP BOOT


PC28F512P30TFA Applications
There are a lot of Micron Technology Inc.
PC28F512P30TFA Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
PC28F512P30TFA More Descriptions
NOR Flash 512Mb 32M x 16bit Serial 1.8V 100ns 64-Pin BGA Tray
IC FLASH 512MBIT PAR 64EASYBGA
Product Comparison
The three parts on the right have similar specifications to PC28F512P30TFA.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Operating Supply Voltage
    Power Supplies
    Voltage
    Interface
    Memory Size
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Standby Current-Max
    Access Time (Max)
    Sync/Async
    Word Size
    Data Polling
    Toggle Bit
    Number of Sectors/Size
    Page Size
    Boot Block
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Qualification Status
    Supply Current-Max
    Memory Density
    Command User Interface
    Common Flash Interface
    Pbfree Code
    Pin Count
    ECCN Code
    HTS Code
    Reach Compliance Code
    Operating Mode
    Alternate Memory Width
    Ready/Busy
    Width
    View Compare
  • PC28F512P30TFA
    PC28F512P30TFA
    Micron Technology Inc.
    5 Weeks
    Surface Mount
    64-TBGA
    YES
    64
    -40°C~85°C TA
    Tray
    2008
    Axcell™
    e1
    Obsolete
    3 (168 Hours)
    64
    Tin/Silver/Copper (Sn/Ag/Cu)
    TOP BOOT
    FLASH - NOR
    1.7V~2V
    BOTTOM
    260
    1
    1.8V
    1mm
    30
    28F512P30
    1.8V
    1.81.8/3.3V
    1.7V
    Parallel, Serial
    512Mb 32M x 16
    31mA
    Non-Volatile
    52MHz
    FLASH
    Parallel
    32MX16
    16
    100ns
    25b
    512 Mb
    0.000225A
    100 ns
    Asynchronous
    16b
    NO
    NO
    4511
    16words
    TOP
    1.2mm
    10mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • PC28F128P30B85E
    PC28F128P30B85E
    Micron Technology Inc.
    -
    Surface Mount
    64-TBGA
    YES
    64
    -40°C~85°C TA
    Tray
    2009
    StrataFlash™
    -
    Obsolete
    3 (168 Hours)
    64
    -
    -
    FLASH - NOR
    1.7V~2V
    BOTTOM
    -
    -
    -
    1mm
    -
    28F128P30
    -
    1.81.8/3.3V
    1.7V
    -
    128Mb 8M x 16
    -
    Non-Volatile
    52MHz
    FLASH
    Parallel
    8MX16
    16
    85ns
    -
    -
    0.000075A
    85 ns
    -
    -
    NO
    NO
    4127
    4words
    BOTTOM
    -
    -
    -
    ROHS3 Compliant
    Not Qualified
    0.051mA
    134217728 bit
    YES
    YES
    -
    -
    -
    -
    -
    -
    -
    -
    -
    PC28F512P30TFA vs PC28F128P30B85E
  • PC28F00AP33BFA
    PC28F00AP33BFA
    Micron Technology Inc.
    -
    Surface Mount
    64-TBGA
    YES
    64
    -40°C~85°C TA
    Tray
    2013
    Axcell™
    e1
    Obsolete
    3 (168 Hours)
    64
    TIN SILVER COPPER
    -
    FLASH - NOR
    2.3V~3.6V
    BOTTOM
    260
    1
    3V
    1mm
    30
    28F00AP33
    -
    -
    2.3V
    Parallel, Serial
    1Gb 64M x 16
    31mA
    Non-Volatile
    52MHz
    FLASH
    Parallel
    -
    16
    95ns
    26b
    1 Gb
    -
    95 ns
    Asynchronous
    16b
    -
    -
    -
    -
    -
    1.2mm
    10mm
    No
    ROHS3 Compliant
    -
    -
    -
    -
    -
    yes
    64
    -
    -
    -
    -
    -
    -
    -
    PC28F512P30TFA vs PC28F00AP33BFA
  • PC28F064M29EWBX
    PC28F064M29EWBX
    Micron Technology Inc.
    -
    Surface Mount
    64-LBGA
    YES
    64
    -40°C~85°C TA
    Tray
    2013
    -
    e1
    Obsolete
    3 (168 Hours)
    64
    TIN SILVER COPPER
    -
    FLASH - NOR
    2.7V~3.6V
    BOTTOM
    260
    1
    3V
    1mm
    30
    PC28F064M29
    -
    3/3.3V
    2.7V
    -
    64Mb 8M x 8 4M x 16
    -
    Non-Volatile
    -
    FLASH
    Parallel
    4MX16
    16
    60ns
    -
    -
    0.00012A
    65 ns
    -
    -
    YES
    YES
    8127
    8/16words
    BOTTOM
    1.4mm
    13mm
    -
    ROHS3 Compliant
    Not Qualified
    0.025mA
    -
    YES
    YES
    yes
    -
    3A991.B.1.A
    8542.32.00.51
    unknown
    ASYNCHRONOUS
    8
    YES
    11mm
    PC28F512P30TFA vs PC28F064M29EWBX
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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