Chip Quik Inc. PA0171
- Part Number:
- PA0171
- Manufacturer:
- Chip Quik Inc.
- Ventron No:
- 4659389-PA0171
- Description:
- MINI SOIC-10 EXP PAD TO DIP-10 S
- Datasheet:
- PA0171
Chip Quik Inc. PA0171 technical specifications, attributes, parameters and parts with similar specifications to Chip Quik Inc. PA0171.
- MaterialFR4 Epoxy Glass
- Package AcceptedMiniSOIC EP
- SeriesProto-Advantage
- Published2009
- Size / Dimension0.700 x 0.500 17.78mmx12.70mm
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Positions10
- Pitch0.020 0.50mm
- Proto Board TypeSMD to DIP
- Board Thickness0.062 1.57mm 1/16
- RoHS StatusROHS3 Compliant
PA0171 Overview
This product is manufactured by Chip Quik Inc. and belongs to the category of Adapter, Breakout Boards. The images we provide are for reference only, for detailed product information please see specification sheet PA0171 or the datasheet in PDF format. As a professional electronic components distributor, Ventron has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of PA0171. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
This product is manufactured by Chip Quik Inc. and belongs to the category of Adapter, Breakout Boards. The images we provide are for reference only, for detailed product information please see specification sheet PA0171 or the datasheet in PDF format. As a professional electronic components distributor, Ventron has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of PA0171. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
PA0171 More Descriptions
MINI SOIC-10 EXP PAD TO DIP-10 S
The three parts on the right have similar specifications to PA0171.
-
ImagePart NumberManufacturerMaterialPackage AcceptedSeriesPublishedSize / DimensionPart StatusMoisture Sensitivity Level (MSL)Number of PositionsPitchProto Board TypeBoard ThicknessRoHS StatusFactory Lead TimeView Compare
-
PA0171FR4 Epoxy GlassMiniSOIC EPProto-Advantage20090.700 x 0.500 17.78mmx12.70mmActive1 (Unlimited)100.020 0.50mmSMD to DIP0.062 1.57mm 1/16ROHS3 Compliant--
-
FR4 Epoxy GlassLLPProto-Advantage20090.700 x 0.400 17.78mmx10.16mmActive1 (Unlimited)80.020 0.50mmSMD to DIP0.062 1.57mm 1/16ROHS3 Compliant2 Weeks
-
FR4 Epoxy GlassLCC, JLCC, PLCCProto-Advantage20091.000 x 1.400 25.40mmx35.56mmActive1 (Unlimited)280.050 1.27mmSMD to DIP0.062 1.57mm 1/16ROHS3 Compliant2 Weeks
-
FR4 Epoxy GlassLLPProto-Advantage20091.000 x 1.800 25.40mmx45.72mmActive1 (Unlimited)360.020 0.50mmSMD to DIP0.062 1.57mm 1/16ROHS3 Compliant-
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