Chip Quik Inc. PA0170
- Part Number:
- PA0170
- Manufacturer:
- Chip Quik Inc.
- Ventron No:
- 5054377-PA0170
- Description:
- MINI SOIC-8 EXP PAD TO DIP-8 SMT
- Datasheet:
- PA0170
Chip Quik Inc. PA0170 technical specifications, attributes, parameters and parts with similar specifications to Chip Quik Inc. PA0170.
- MaterialFR4 Epoxy Glass
- Package AcceptedMiniSOIC EP
- SeriesProto-Advantage
- Published2009
- Size / Dimension0.700 x 0.400 17.78mmx10.16mm
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Positions8
- Pitch0.026 0.65mm
- Proto Board TypeSMD to DIP
- Board Thickness0.062 1.57mm 1/16
- RoHS StatusROHS3 Compliant
PA0170 Overview
This product is manufactured by Chip Quik Inc. and belongs to the category of Adapter, Breakout Boards. The images we provide are for reference only, for detailed product information please see specification sheet PA0170 or the datasheet in PDF format. As a professional electronic components distributor, Ventron has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of PA0170. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
This product is manufactured by Chip Quik Inc. and belongs to the category of Adapter, Breakout Boards. The images we provide are for reference only, for detailed product information please see specification sheet PA0170 or the datasheet in PDF format. As a professional electronic components distributor, Ventron has five million electronic components available. Additionally, we have over 500,000 electronic components in stock ready for immediate shipment. If you have requirements, you can send us a quotation form to get the price of PA0170. We attach great importance to our customers' purchasing experience and are willing to establish a long-term cooperative relationship with you. If you have any questions or requirements, please feel free to contact us.
PA0170 More Descriptions
MINI SOIC-8 EXP PAD TO DIP-8 SMT
The three parts on the right have similar specifications to PA0170.
-
ImagePart NumberManufacturerMaterialPackage AcceptedSeriesPublishedSize / DimensionPart StatusMoisture Sensitivity Level (MSL)Number of PositionsPitchProto Board TypeBoard ThicknessRoHS StatusFactory Lead TimeView Compare
-
PA0170FR4 Epoxy GlassMiniSOIC EPProto-Advantage20090.700 x 0.400 17.78mmx10.16mmActive1 (Unlimited)80.026 0.65mmSMD to DIP0.062 1.57mm 1/16ROHS3 Compliant--
-
FR4 Epoxy GlassLLPProto-Advantage20090.700 x 0.400 17.78mmx10.16mmActive1 (Unlimited)80.020 0.50mmSMD to DIP0.062 1.57mm 1/16ROHS3 Compliant2 Weeks
-
FR4 Epoxy GlassLLPProto-Advantage20091.000 x 2.400 25.40mmx60.96mmActive1 (Unlimited)480.020 0.50mmSMD to DIP0.062 1.57mm 1/16ROHS3 Compliant-
-
FR4 Epoxy GlassLCC, JLCC, PLCCProto-Advantage20091.000 x 1.400 25.40mmx35.56mmActive1 (Unlimited)280.050 1.27mmSMD to DIP0.062 1.57mm 1/16ROHS3 Compliant2 Weeks
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