MX29GL512FHXFI-11G

Macronix MX29GL512FHXFI-11G

Part Number:
MX29GL512FHXFI-11G
Manufacturer:
Macronix
Ventron No:
3721238-MX29GL512FHXFI-11G
Description:
IC FLASH 512MBIT 110NS 64LFBGA
ECAD Model:
Datasheet:
MX29GL512F

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Specifications
Macronix MX29GL512FHXFI-11G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX29GL512FHXFI-11G.
  • Surface Mount
    YES
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Number of Terminations
    64
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -40°C
  • HTS Code
    8542.32.00.51
  • Subcategory
    Flash Memories
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    3V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    64
  • JESD-30 Code
    R-PBGA-B64
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    3.6V
  • Power Supplies
    3/3.3V
  • Temperature Grade
    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface
    Parallel
  • Memory Type
    FLASH, NOR
  • Operating Mode
    ASYNCHRONOUS
  • Supply Current-Max
    0.03mA
  • Access Time
    110 ns
  • Organization
    32MX16
  • Memory Width
    16
  • Density
    512 Mb
  • Standby Current-Max
    0.00002A
  • Programming Voltage
    3V
  • Alternate Memory Width
    8
  • Data Polling
    YES
  • Toggle Bit
    YES
  • Number of Sectors/Size
    512
  • Sector Size
    128K
  • Page Size
    8/16words
  • Ready/Busy
    YES
  • Length
    13mm
  • Height Seated (Max)
    1.4mm
  • Width
    11mm
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
MX29GL512FHXFI-11G Overview
A FLASH, NOR-type memory can be classified as the memory type of this device. A total of 64 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3V will be necessary. The memory device in question has 64 pins, thus indicating that it has 64 memory locations that can be accessed. There is a note indicating that this memory chip operates at an 3.6V volt supply voltage. As for power supplies, this memory chip requires just 3/3.3V . There must not be a minimum operating temperature of less than -40°C for this device. A temperature of no more than 85°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component. In order to operate your device, you will need to provide a maximum supply current of 0.03mA. A programming voltage of 3V is required to change a nonvolatile memory array's state. Usually, this memory ics falls under the Flash Memories component category. A total of 512 specifically sized divisions are contained in this memory.

MX29GL512FHXFI-11G Features
Operating Supply Voltage:3.6V


MX29GL512FHXFI-11G Applications
There are a lot of Macronix
MX29GL512FHXFI-11G Memory applications.


supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
MX29GL512FHXFI-11G More Descriptions
MX29GL512 Series 512 Mbit (64 M X 8) 3 V 100 ns Parallel Flash Memory - FBGA-56
NOR Flash Parallel 3.3V 512Mbit 64M/32M x 8bit/16bit 110ns 64-Pin LFBGA
512Mbit (Parallel) LFBGA-64,CSP(11x13) NOR FLASH ROHS
IC FLSH 512MBIT PARALLEL 64LFBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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