MX25L12855EMI-10G

Macronix MX25L12855EMI-10G

Part Number:
MX25L12855EMI-10G
Manufacturer:
Macronix
Ventron No:
3719822-MX25L12855EMI-10G
Description:
IC FLASH 128MBIT 104MHZ 16SOP
ECAD Model:
Datasheet:
MX25L6455E, MX25L12855E

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Specifications
Macronix MX25L12855EMI-10G technical specifications, attributes, parameters and parts with similar specifications to Macronix MX25L12855EMI-10G.
  • Factory Lead Time
    16 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    16-SOIC (0.295, 7.50mm Width)
  • Surface Mount
    YES
  • Number of Pins
    16
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tube
  • Series
    MXSMIO™
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    16
  • ECCN Code
    3A991.B.1.A
  • Terminal Finish
    Matte Tin (Sn)
  • Additional Feature
    ALSO CONFIGURABLE AS 128M X 1, 20 YEAR DATA RETENTION
  • HTS Code
    8542.32.00.51
  • Technology
    FLASH - NOR
  • Voltage - Supply
    2.7V~3.6V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reach Compliance Code
    unknown
  • Time@Peak Reflow Temperature-Max (s)
    40
  • Pin Count
    16
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3/3.3V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface
    SPI, Serial
  • Memory Size
    128Mb 16M x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    104MHz
  • Supply Current-Max
    0.025mA
  • Memory Format
    FLASH
  • Memory Interface
    SPI
  • Organization
    32MX4
  • Memory Width
    4
  • Write Cycle Time - Word, Page
    300μs, 5ms
  • Standby Current-Max
    0.00004A
  • Memory Density
    134217728 bit
  • Programming Voltage
    2.7V
  • Serial Bus Type
    SPI
  • Endurance
    100000 Write/Erase Cycles
  • Data Retention Time-Min
    20
  • Write Protection
    HARDWARE/SOFTWARE
  • Alternate Memory Width
    2
  • Height Seated (Max)
    2.65mm
  • Length
    10.3mm
  • Width
    7.52mm
  • RoHS Status
    ROHS3 Compliant
Description
MX25L12855EMI-10G Overview
The mounting type for this particular component is surface mount, meaning it can be easily attached to a surface without the need for any additional hardware. Its moisture sensitivity level (MSL) is 3, which means it can withstand exposure to moisture for up to 168 hours without any damage. The ECCN code for this component is 3A991.B.1.A, indicating that it is classified as a technology or software with encryption capabilities. The terminal pitch for this component is 1.27mm, making it suitable for use in compact devices. It has not yet been qualified, but its interface is SPI, Serial, and its operating mode is synchronous. The organization of this component is 32MX4, and its maximum seated height is 2.65mm, with a width of 7.52mm.

MX25L12855EMI-10G Features
Package / Case: 16-SOIC (0.295, 7.50mm Width)
16 Pins
Additional Feature:ALSO CONFIGURABLE AS 128M X 1, 20 YEAR DATA RETENTION


MX25L12855EMI-10G Applications
There are a lot of Macronix
MX25L12855EMI-10G Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
MX25L12855EMI-10G More Descriptions
IC FLSH 128MBIT SPI 104MHZ 16SOP
Product Comparison
The three parts on the right have similar specifications to MX25L12855EMI-10G.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Standby Current-Max
    Memory Density
    Programming Voltage
    Serial Bus Type
    Endurance
    Data Retention Time-Min
    Write Protection
    Alternate Memory Width
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    JESD-30 Code
    Operating Supply Voltage
    Density
    Lead Free
    Pbfree Code
    Reflow Temperature-Max (s)
    View Compare
  • MX25L12855EMI-10G
    MX25L12855EMI-10G
    16 Weeks
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    YES
    16
    -40°C~85°C TA
    Tube
    MXSMIO™
    e3
    Active
    3 (168 Hours)
    16
    3A991.B.1.A
    Matte Tin (Sn)
    ALSO CONFIGURABLE AS 128M X 1, 20 YEAR DATA RETENTION
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    DUAL
    260
    1
    3.3V
    1.27mm
    unknown
    40
    16
    Not Qualified
    3.6V
    3/3.3V
    2.7V
    SPI, Serial
    128Mb 16M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    0.025mA
    FLASH
    SPI
    32MX4
    4
    300μs, 5ms
    0.00004A
    134217728 bit
    2.7V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    2
    2.65mm
    10.3mm
    7.52mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • MX25L12875FMI-10G
    16 Weeks
    Surface Mount
    16-SOIC (0.295, 7.50mm Width)
    YES
    16
    -40°C~85°C TA
    Tube
    MX25xxx35/36 - MXSMIO™
    e3
    Active
    3 (168 Hours)
    16
    -
    MATTE TIN (800)
    CAN BE ORGNISED AS 128 MBIT X 1
    -
    FLASH - NOR
    2.7V~3.6V
    DUAL
    260
    1
    3V
    1.27mm
    -
    40
    16
    -
    3.6V
    -
    2.7V
    SPI, Serial
    128Mb 16M x 8
    Non-Volatile
    SYNCHRONOUS
    104MHz
    -
    FLASH
    SPI
    32MX4
    4
    30μs, 1.5ms
    -
    134217728 bit
    3V
    -
    -
    -
    -
    2
    2.65mm
    10.3mm
    7.52mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
  • MX25L2006EZNI-12G
    10 Weeks
    Surface Mount
    8-WDFN Exposed Pad
    YES
    -
    -40°C~85°C TA
    Tray
    MX25xxx05/06
    -
    Active
    3 (168 Hours)
    8
    EAR99
    -
    -
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    -
    NOT SPECIFIED
    8
    Not Qualified
    -
    3/3.3V
    2.7V
    SPI, Serial
    2Mb 256K x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    0.02mA
    FLASH
    SPI
    1MX2
    2
    50μs, 3ms
    0.00001A
    -
    2.7V
    SPI
    100000 Write/Erase Cycles
    20
    HARDWARE/SOFTWARE
    1
    0.8mm
    6mm
    5mm
    ROHS3 Compliant
    2010
    R-PDSO-N8
    3.6V
    2 Mb
    Lead Free
    -
    -
  • MX25L1606EM2I-12G
    16 Weeks
    Surface Mount
    8-SOIC (0.209, 5.30mm Width)
    YES
    -
    -40°C~85°C TA
    Tube
    MX25xxx05/06
    e3
    Not For New Designs
    3 (168 Hours)
    8
    EAR99
    Matte Tin (Sn) - annealed
    -
    8542.32.00.51
    FLASH - NOR
    2.7V~3.6V
    DUAL
    NOT SPECIFIED
    1
    3V
    1.27mm
    -
    -
    8
    Not Qualified
    -
    3/3.3V
    2.7V
    SPI, Serial
    16Mb 2M x 8
    Non-Volatile
    SYNCHRONOUS
    86MHz
    0.025mA
    FLASH
    SPI
    8MX2
    2
    50μs, 3ms
    0.00002A
    -
    2.7V
    SPI
    100000 Write/Erase Cycles
    -
    HARDWARE/SOFTWARE
    1
    2.16mm
    5.28mm
    5.23mm
    ROHS3 Compliant
    2016
    R-PDSO-G8
    3.6V
    16 Mb
    Lead Free
    yes
    NOT SPECIFIED
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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