Micron Technology Inc. MTFC4GMVEA-1M WT

MTFC4GMVEA-1M WT Overview
The mounting type for this particular electronic component is surface mount, which means it is designed to be mounted directly onto a circuit board. The package or case for this component is a 153-WFBGA, which is a type of ball grid array package. It is able to withstand a wide range of temperatures, as it has an operating temperature of -25°C to 85°C TA. This component was published in 2013 and belongs to the e•MMC™ series. However, it is now discontinued. It has a moisture sensitivity level of 3, meaning it can be exposed to moisture for up to 168 hours. The HTS code for this component is 8542.31.00.01, indicating its classification for customs purposes. It has a memory size of 32Gb, with 4G x 8 configuration, and is a non-volatile memory type.

MTFC4GMVEA-1M WT Features
Package / Case: 153-WFBGA


MTFC4GMVEA-1M WT Applications
There are a lot of Micron Technology Inc.
MTFC4GMVEA-1M WT Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM